Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
03/04/2010 | US20100055917 Method for forming active pillar of vertical channel transistor |
03/04/2010 | US20100055916 Method for decapsulating package |
03/04/2010 | US20100055915 Processing apparatus, processing method, and plasma source |
03/04/2010 | US20100055914 Methods of forming fine patterns in semiconductor devices |
03/04/2010 | US20100055913 Methods Of Forming A Photoresist-Comprising Pattern On A Substrate |
03/04/2010 | US20100055912 Semiconductor fabricating process |
03/04/2010 | US20100055911 Plasma processing method and resist pattern modifying method |
03/04/2010 | US20100055910 Exposure mask and method for forming semiconductor device using the same |
03/04/2010 | US20100055909 Semiconductor polishing compound, process for its production and polishing method |
03/04/2010 | US20100055908 Method for producing a semiconductor wafer |
03/04/2010 | US20100055907 Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching |
03/04/2010 | US20100055906 Two-step hardmask fabrication methodology for silicon waveguides |
03/04/2010 | US20100055905 Method of forming an aluminum oxide layer |
03/04/2010 | US20100055904 Method for reducing tungsten roughness and improving reflectivity |
03/04/2010 | US20100055903 Enhancing structural integrity of low-k dielectrics in metallization systems of semiconductor devices by using a crack suppressing material layer |
03/04/2010 | US20100055902 Reducing critical dimensions of vias and contacts above the device level of semiconductor devices |
03/04/2010 | US20100055901 Laser material removal methods and apparatus |
03/04/2010 | US20100055900 Mask and method for fabricating semiconductor device using the same |
03/04/2010 | US20100055899 Particle reduction in pecvd processes for depositing low-k material by using a plasma assisted post-deposition step |
03/04/2010 | US20100055898 Method for fabricating an integrated circuit |
03/04/2010 | US20100055897 Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process |
03/04/2010 | US20100055896 Semiconductor device |
03/04/2010 | US20100055895 Electrically conductive structure on a semiconductor substrate formed from printing |
03/04/2010 | US20100055894 Method for Manufacturing Semiconductor Device |
03/04/2010 | US20100055893 Method of fabricating semiconductor device |
03/04/2010 | US20100055892 Method for forming a semiconductor device |
03/04/2010 | US20100055891 Dual gate structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method |
03/04/2010 | US20100055890 Method for fabricating non-volatile memory |
03/04/2010 | US20100055889 Composite Charge Storage Structure Formation In Non-Volatile Memory Using Etch Stop Technologies |
03/04/2010 | US20100055888 Semiconductor device fabrication method |
03/04/2010 | US20100055887 Laser Diffusion Fabrication of Solar Cells |
03/04/2010 | US20100055886 Semiconductor manufacturing method and semiconductor device |
03/04/2010 | US20100055885 Method of making low work function component |
03/04/2010 | US20100055884 Manufacturing method for silicon wafer |
03/04/2010 | US20100055883 Group iii-nitride semiconductor thin film, method for fabricating the same, and group iii-nitride semiconductor light emitting device |
03/04/2010 | US20100055882 Junction Termination Extension with Controllable Doping Profile and Controllable Width for High-Voltage Electronic Devices |
03/04/2010 | US20100055881 Heat treatment method for compound semiconductor and apparatus therefor |
03/04/2010 | US20100055880 Selective growth of polycrystalline silicon-containing semiconductor material on a silicon-containing semiconductor surface |
03/04/2010 | US20100055879 Method for manufacturing a semiconductor device |
03/04/2010 | US20100055878 Fabrication Method of Semiconductor Device |
03/04/2010 | US20100055877 Wafer processing method |
03/04/2010 | US20100055876 Laser processing method and laser processing apparatus |
03/04/2010 | US20100055875 Method for manufacturing semiconductor chip and method for processing semiconductor wafer |
03/04/2010 | US20100055874 Layer transfer of films utilizing controlled propagation |
03/04/2010 | US20100055873 Led-laser lift-off method |
03/04/2010 | US20100055872 Method for manufacturing semiconductor layer and semiconductor device |
03/04/2010 | US20100055871 Memory in logic cell |
03/04/2010 | US20100055870 Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device |
03/04/2010 | US20100055869 Semiconductor device and method of manufacturing same |
03/04/2010 | US20100055868 Method of forming insulation layer of semiconductor device and method of forming semiconductor device using the insulation layer |
03/04/2010 | US20100055867 Structured strained substrate for forming strained transistors with reduced thickness of active layer |
03/04/2010 | US20100055866 Method of forming transistor in semiconductor device |
03/04/2010 | US20100055865 Method of fabricating semiconductor device |
03/04/2010 | US20100055864 Method of forming isolation structure for semiconductor integrated circuit substrate |
03/04/2010 | US20100055863 Method of patterning noble metals for semiconductor devices by electropolishing |
03/04/2010 | US20100055862 Method for producing an integrated circuit arrangement with capacitor in an interconnect layer |
03/04/2010 | US20100055861 Method for fabricating capacitor in semiconductor device |
03/04/2010 | US20100055860 Semiconductor Process and Integrated Circuit |
03/04/2010 | US20100055859 Semiconductor device and method of manufacturing the same |
03/04/2010 | US20100055858 Silicon carbide semiconductor device and method for manufacturing the same |
03/04/2010 | US20100055857 Method of forming a power device |
03/04/2010 | US20100055856 Method of forming oxide layer, and method of manufacturing semiconductor device |
03/04/2010 | US20100055855 Method of preventing sliding in manufacturing semiconductur device |
03/04/2010 | US20100055854 Method of manufacturing semiconductor device |
03/04/2010 | US20100055853 Method for manufacturing pixel structure |
03/04/2010 | US20100055852 Semiconductor device and method of fabricating the same |
03/04/2010 | US20100055851 Photoresist compostion, method for forming thin film patterns, and method for manufacturing a thin film transistor using the same |
03/04/2010 | US20100055850 Methods for fabricating pixel structure, display panel and electro-optical apparatus |
03/04/2010 | US20100055849 Method of encapsulating wire bonds |
03/04/2010 | US20100055848 Inspection of underfill in integrated circuit package |
03/04/2010 | US20100055847 Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards |
03/04/2010 | US20100055846 Semiconductor package structures |
03/04/2010 | US20100055845 Power semiconductor module and method of manufacturing the same |
03/04/2010 | US20100055844 Method of manufacturing semiconductor device |
03/04/2010 | US20100055843 Chip package module heat sink |
03/04/2010 | US20100055842 Thermosetting die-bonding film |
03/04/2010 | US20100055841 Semiconductor device and method of producing the same |
03/04/2010 | US20100055840 Electronic packaging structure and a manufacturing method thereof |
03/04/2010 | US20100055839 Method of manufacturing a semiconductor device |
03/04/2010 | US20100055838 Sensitivity capacitive sensor |
03/04/2010 | US20100055837 Multi-chip module and methods |
03/04/2010 | US20100055836 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
03/04/2010 | US20100055835 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
03/04/2010 | US20100055834 Semiconductor device manufacturing method |
03/04/2010 | US20100055833 Method of manufacturing semiconductor device in which functional portion of element is exposed |
03/04/2010 | US20100055832 Method for manufacturing semiconductor device |
03/04/2010 | US20100055831 Phase changeable memory cell array region and method of forming the same |
03/04/2010 | US20100055830 I-shaped phase change memory cell |
03/04/2010 | US20100055829 Apparatus and methods for forming phase change layer and method of manufacturing phase change memory device |
03/04/2010 | US20100055828 Process and paste for contacting metal surfaces |
03/04/2010 | US20100055826 Methods of Fabrication of Solar Cells Using High Power Pulsed Magnetron Sputtering |
03/04/2010 | US20100055825 Semiconductor device manufacturing method |
03/04/2010 | US20100055824 Micro/nanostructure PN junction diode array thin-film solar cell and method for fabricating the same |
03/04/2010 | US20100055821 Method for manufacturing an intergrated pressure sensor |
03/04/2010 | US20100055817 Method of manufacturing array substrate of horizontal electric field type transreflective liquid crystal display |
03/04/2010 | US20100055815 Method of manfuacturing lens for light emitting diode package |
03/04/2010 | US20100055814 Method of manufacturing light emitting diode device |
03/04/2010 | US20100055812 Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace |
03/04/2010 | US20100055811 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate |
03/04/2010 | US20100055810 Mask for thin film deposition and method of manufacturing oled using the same |