Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/25/2010US20100045282 Thin film lamination, thin film magnetic sensor using the thin film lamination and method for manufacturing the thin film lamination
02/25/2010US20100045179 Display apparatus using oxide semiconductor and production method thereof
02/25/2010US20100045173 Organic light emitting display apparatus and method of manufacturing organic light emitting display apparatus
02/25/2010US20100045169 Nano electronic devices
02/25/2010US20100044890 Semiconductor substrate manufacture apparatus, semiconductor substrate manufacture method, and semiconductor substrate
02/25/2010US20100044887 Method for producing circuit substrate, and circuit substrate
02/25/2010US20100044885 Semiconductor device and manufacturing method
02/25/2010US20100044884 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
02/25/2010US20100044881 Semiconductor device and fabrication method thereof
02/25/2010US20100044879 Layered chip package and method of manufacturing same
02/25/2010US20100044878 Integrated circuit package system having cavity
02/25/2010US20100044877 Electronic device having a chip stack
02/25/2010US20100044874 Integrated circuit of decreased size
02/25/2010US20100044873 Semiconductor device and method of manufacturing the same
02/25/2010US20100044870 Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
02/25/2010US20100044869 Reliable interconnects
02/25/2010US20100044867 Methods of post-contact back end of line through-hole via integration
02/25/2010US20100044866 Semiconductor device having via connecting between interconnects
02/25/2010US20100044865 Fabrication of a diffusion barrier cap on copper containing conductive elements
02/25/2010US20100044864 Method of manufacturing semiconductor device, and semiconductor device
02/25/2010US20100044862 Method of forming collapse chip connection bumps on a semiconductor substrate
02/25/2010US20100044860 Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
02/25/2010US20100044858 Product Chips and Die With a Feature Pattern That Contains Information Relating to the Product Chip, Methods for Fabricating Such Product Chips and Die, and Methods for Reading a Feature Pattern From a Packaged Die
02/25/2010US20100044857 Wlcsp target and method for forming the same
02/25/2010US20100044856 Electronic package with a thermal interposer and method of manufacturing the same
02/25/2010US20100044855 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
02/25/2010US20100044854 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
02/25/2010US20100044853 System-in-package with through substrate via holes
02/25/2010US20100044851 Flip chip packages
02/25/2010US20100044850 Advanced quad flat non-leaded package structure and manufacturing method thereof
02/25/2010US20100044849 Stacked integrated circuit package-in-package system and method of manufacture thereof
02/25/2010US20100044846 Three-dimensional structural semiconductor device
02/25/2010US20100044845 Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate
02/25/2010US20100044844 Lead frame, resin package, semiconductor device and resin package manufacturing method
02/25/2010US20100044843 Advanced quad flat non-leaded package structure and manufacturing method thereof
02/25/2010US20100044842 Semiconductor device
02/25/2010US20100044841 Semiconductor device
02/25/2010US20100044839 Semiconductor device and manufacturing method thereof
02/25/2010US20100044838 Semiconductor component with marginal region
02/25/2010US20100044837 Replication and transfer of microstructures and nanostructures
02/25/2010US20100044836 PROCESS FOR PRODUCING LOCALISED Ge0I STRUCTURES, OBTAINED BY GERMANIUM CONDENSATION
02/25/2010US20100044834 Electrostatic discharge protection circuit
02/25/2010US20100044832 Structure of trench capacitor and method for manufacturing the same
02/25/2010US20100044831 Multi-layer film capacitor with tapered film sidewalls
02/25/2010US20100044830 Method of producing an soi structure with an insulating layer of controlled thickness
02/25/2010US20100044829 Method for producing soi substrate and soi substrate
02/25/2010US20100044827 Method for making a substrate structure comprising a film and substrate structure made by same method
02/25/2010US20100044826 3d integrated circuit device fabrication with precisely controllable substrate removal
02/25/2010US20100044825 Semiconductor device and method for the production of a semiconductor device
02/25/2010US20100044819 Method for Manufacturing CMOS Image Sensor Having Microlens Therein with High Photosensitivity
02/25/2010US20100044813 Optically controlled read only memory
02/25/2010US20100044809 Sensor Device Packaging And Method
02/25/2010US20100044808 method of manufacturing a mems element
02/25/2010US20100044807 CMOS-Compatible Microstructures and Methods of Fabrication
02/25/2010US20100044806 Integrated circuit metal gate structure and method of fabrication
02/25/2010US20100044804 Novel high-k metal gate structure and method of making
02/25/2010US20100044803 Sealing structure for high-k metal gate and method of making
02/25/2010US20100044802 Semiconductor device and manufacturing method thereof
02/25/2010US20100044801 Dual metal gate corner
02/25/2010US20100044799 Method for manufacturing a p-type mos transistor, method for manufacturing a cmos-type semiconductor apparatus having the p-type mos transistor, and cmos-type semiconductor apparatus manufactured using the manufacturing method
02/25/2010US20100044798 Transistor device and a method of manufacturing the same
02/25/2010US20100044797 Semiconductor device and method of fabricating the same
02/25/2010US20100044796 Depletion mode trench MOSFET for improved efficiency of DC/DC converter applications
02/25/2010US20100044794 Asymmetric multi-gated transistor and method for forming
02/25/2010US20100044793 Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate
02/25/2010US20100044792 Charged balanced devices with shielded gate trench
02/25/2010US20100044791 Configurations and methods for manufacturing charge balanced devices
02/25/2010US20100044790 Semiconductor device and method of etc.
02/25/2010US20100044788 Semiconductor device with a charge carrier compensation structure and process
02/25/2010US20100044787 Semiconductor device and method of manufacturing the same
02/25/2010US20100044785 High aspect ratio trench structures with void-free fill material
02/25/2010US20100044784 Vertical Channel Fin Field-Effect Transistors Having Increased Source/Drain Contact Area and Methods for Fabricating the Same
02/25/2010US20100044783 Integrated circuit metal gate structure and method of fabrication
02/25/2010US20100044780 Transistor with gain variation compensation
02/25/2010US20100044778 Non-volatile memory device and method of manufacturing same
02/25/2010US20100044777 Reconfigurable semiconductor device
02/25/2010US20100044776 Nonvolatile semiconductor memory device and method for manufacturing same
02/25/2010US20100044774 Flash memory device and method of fabricating the same
02/25/2010US20100044771 Zr-Sn-Ti-O FILMS
02/25/2010US20100044770 Semiconductor device and method of fabricating the same
02/25/2010US20100044768 Reduced-edge radiation-tolerant non-volatile transistor memory cells
02/25/2010US20100044767 Structure and fabrication method for capacitors integratible with vertical replacement gate transistors
02/25/2010US20100044766 Method of manufacturing semiconductor device and semiconductor device
02/25/2010US20100044760 Self-aligned impact-ionization field effect transistor
02/25/2010US20100044759 Double-sided integrated circuit chips
02/25/2010US20100044758 Cmos with channel p-finfet and channel n-finfet having different crystalline orientations and parallel fins
02/25/2010US20100044757 Semiconductor device having a contact plug and manufacturing method thereof
02/25/2010US20100044756 Method of fabricating a self-aligning damascene memory structure
02/25/2010US20100044754 Strained transistor integration for cmos
02/25/2010US20100044752 Semiconductor device and manufacturing method
02/25/2010US20100044751 Enhancement mode iii-nitride device with floating gate and process for its manufacture
02/25/2010US20100044749 Bidirectional semiconductor device, method of fabricating the same, and semiconductor device incorporating the same
02/25/2010US20100044746 Carrier and optical semiconductor device based on such a carrier
02/25/2010US20100044743 Flip chip light emitting diode with epitaxial strengthening layer and manufacturing method thereof
02/25/2010US20100044732 Light Emitting Diode Structure and Method of Forming the Same
02/25/2010US20100044730 Organic light emitting diode display device and method of fabricating the same
02/25/2010US20100044721 Method of producing semiconductor device and semiconductor device
02/25/2010US20100044720 Semiconductor device with a reduced band gap and process
02/25/2010US20100044718 Group III Nitride Articles and Methods for Making Same
02/25/2010US20100044717 Thin film transistor panel and method of manufacturing the same
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