Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/04/2010US20100055809 Process of fabricating a workpiece using a test mask
03/04/2010US20100055808 Substrate processing apparatus and method of manufacturing semiconductor device
03/04/2010US20100055807 Plasma ashing apparatus and endpoint detection process
03/04/2010US20100055806 Piezoelectrically Actuated Ultrananocrystalline Diamond Tip Array Integrated With Ferroelectric Or Phase Change Media For High-Density Memory
03/04/2010US20100055805 Semiconductor device manufacturing method
03/04/2010US20100055804 Method for patterning semiconductor device having magnetic tunneling junction structure
03/04/2010US20100055699 Method of manufacturing a semiconductor sensor device and semiconductor sensor device obtained with such method
03/04/2010US20100055619 A method for manufacturing a surface having a multiplicity of slightly different patterns comprising the steps of writing a surface with a set of characters for forming the patterns on the surface and reducing shot count or total write time by use of a character varying techniques; stencil masks
03/04/2010US20100055616 Method for fabricating saddle type fin transistor
03/04/2010US20100055422 Electroless Deposition of Platinum on Copper
03/04/2010US20100055408 Organic anti-reflective layer composition containing ring-opened phthalic anhydride and method for preparation thereof
03/04/2010US20100055400 Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features
03/04/2010US20100055398 Single-Sided Textured Sheet Wafer
03/04/2010US20100054905 Load lock chamber for large area substrate processing system
03/04/2010US20100054897 Reduced capacity carrier, transport, load port, buffer system
03/04/2010US20100054653 Salicide structures for heat-influenced semiconductor applications
03/04/2010US20100054577 Photomask inspection method, semiconductor device inspection method, and pattern inspection apparatus
03/04/2010US20100054293 Laser light source device and manufacturing method for manufacturing laser light source device
03/04/2010US20100054292 Semiconductor laser device and manufacturing method thereof
03/04/2010US20100054289 Solid-state laser
03/04/2010US20100054043 Split Gate Non-Volatile Flash Memory Cell Having a Floating Gate, Control Gate, Select Gate and an Erase Gate with an Overhang Over the Floating Gate, Array and Method of Manufacturing
03/04/2010US20100054030 Programmable resistance memory
03/04/2010US20100054028 STT-MRAM Bit Cell Having a Rectangular Bottom Electrode Plate And Improved Bottom Electrode Plate Width And Interconnect Metal Widths
03/04/2010US20100054027 Symmetric STT-MRAM Bit Cell Design
03/04/2010US20100054021 Memory Device with Multiple Capacitor Types
03/04/2010US20100054014 High density resistance based semiconductor device
03/04/2010US20100053931 Solid State Lighting Compositions And Systems
03/04/2010US20100053929 LED Packaging Methods And LED-Based Lighting Products
03/04/2010US20100053922 Micropackaging method and devices
03/04/2010US20100053920 Packaging substrate with embedded semiconductor component and method for fabricating the same
03/04/2010US20100053891 System and method for miniaturization of synthetic jets
03/04/2010US20100053841 Wafer processing apparatus having a tunable electrical resistivity
03/04/2010US20100053727 Display Device
03/04/2010US20100053716 Method of fabricating a structure by anisotropic etching, and silicon substrate with an etching mask
03/04/2010US20100053580 Computer readable medium and exposure method
03/04/2010US20100053578 Apparatus for imprint lithography using an electric field
03/04/2010US20100053517 Liquid crystal display and method of manufacturing liquid crystal display
03/04/2010US20100053404 Charge-transfer apparatus, method for driving charge-transfer apparatus, and imaging apparatus
03/04/2010US20100053400 Solid-state imaging device and method for manufacturing the same
03/04/2010US20100053319 Method and apparatus for pattern inspection
03/04/2010US20100052775 Voltage supply with low power and leakage current
03/04/2010US20100052524 Color display device and method for manufacturing the same
03/04/2010US20100052192 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module and method for manufacturing electronic element module, and electronic information device
03/04/2010US20100052191 Metrology Mark with Elements Arranged in a Matrix, Method of Manufacturing Same and Alignment Method
03/04/2010US20100052189 Electronic component mounting structure and method for manufacturing the same
03/04/2010US20100052188 Semiconductor Chip with Solder Joint Protection Ring
03/04/2010US20100052187 Stacked semiconductor package and method for fabricating the same
03/04/2010US20100052185 Semiconductor device and method for fabricating the same
03/04/2010US20100052184 Interconnects with improved tddb
03/04/2010US20100052182 Semiconductor device and method of producing the same
03/04/2010US20100052181 Using a cap layer in metallization systems of semiconductor devices as a cmp and etch stop layer
03/04/2010US20100052180 Semiconductor Device for Low-Power Applications and a Method of Manufacturing Thereof
03/04/2010US20100052179 Mems structure and method for fabricating the same
03/04/2010US20100052178 Semiconductor Device and Method for Making Same
03/04/2010US20100052177 Method for manufacturing a crossbar circuit device
03/04/2010US20100052176 Semiconductor device and manufacturing method thereof
03/04/2010US20100052175 Reducing leakage and dielectric breakdown in dielectric materials of metallization systems of semiconductor devices by forming recesses
03/04/2010US20100052174 Copper pad for copper wire bonding
03/04/2010US20100052173 Semiconductor device and semiconductor device manufacturing method
03/04/2010US20100052172 Method of fabricating copper damascene and dual damascene interconnect wiring
03/04/2010US20100052171 Cu wire in semiconductor device and production method thereof
03/04/2010US20100052170 Metal line of semiconductor device having a diffusion barrier and method for forming the same
03/04/2010US20100052169 Metal line of semiconductor device having a diffusion barrier and method for forming the same
03/04/2010US20100052168 Metal line having a multi-layered diffusion layer in a semiconductor device and method for forming the same
03/04/2010US20100052167 METAL LINE HAVING A MOxSiy/Mo DIFFUSION BARRIER OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
03/04/2010US20100052166 Sandwiched metal structure silicidation for enhanced contact
03/04/2010US20100052165 Semiconductor device including columnar electrodes having planar size greater than that of connection pad portion of wiring line, and manufacturing method thereof
03/04/2010US20100052164 Wafer level package and method of manufacturing the same
03/04/2010US20100052163 Semiconductor device, method of manufacturing same and method of repairing same
03/04/2010US20100052162 Semiconductor device and method for fabricating semiconductor device
03/04/2010US20100052160 Bump structure and method for fabricating the same
03/04/2010US20100052159 Methods of forming C4 metal stud bump for fine pitch packaging applications and structures formed thereby
03/04/2010US20100052157 Channel for a semiconductor die and methods of formation
03/04/2010US20100052156 Chip scale package structure and fabrication method thereof
03/04/2010US20100052154 Surface smoothened ultrahigh conductivity composite lid for improved marking permanency of semiconductor packaged devices
03/04/2010US20100052153 Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same
03/04/2010US20100052151 Ball Grid Array Package Having One or More Stiffeners
03/04/2010US20100052150 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
03/04/2010US20100052149 Semiconductor device and method of manufacturing the same
03/04/2010US20100052147 Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability
03/04/2010US20100052146 Semiconductor package and fabrication method thereof
03/04/2010US20100052144 Semiconductor package substrate and method, in particular for mems devices
03/04/2010US20100052142 Semiconductor device and method for fabricating semiconductor device
03/04/2010US20100052141 Qfn package
03/04/2010US20100052139 Semiconductor device and method for manufacturing the same, and semiconductor sealing resin
03/04/2010US20100052138 Resin molded semiconductor device and manufacturing method thereof
03/04/2010US20100052137 Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structure
03/04/2010US20100052135 Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
03/04/2010US20100052134 3-d integrated semiconductor device comprising intermediate heat spreading capabilities
03/04/2010US20100052133 Stack type semiconductor device with reinforcing resin
03/04/2010US20100052129 Multi-chip package and manufacturing method
03/04/2010US20100052128 Device for detecting an attack against an integrated circuit
03/04/2010US20100052125 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
03/04/2010US20100052124 Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device
03/04/2010US20100052123 Low stress cavity package
03/04/2010US20100052121 Semiconductor system-in-a-package containing micro-layered lead frame
03/04/2010US20100052119 Molded Ultra Thin Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same
03/04/2010US20100052118 Micro-layered lead frame semiconductor packages
03/04/2010US20100052116 Fabrication of self-assembled nanowire-type interconnects on a semiconductor device
03/04/2010US20100052115 Volatile Precursors for Deposition of C-Linked SiCOH Dielectrics
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