Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/25/2010US20100048012 Method for fabricating nonvolatile memory device
02/25/2010US20100048011 Method of patterning a metal gate of semiconductor device
02/25/2010US20100048010 Semiconductor device gate structure including a gettering layer
02/25/2010US20100048009 Method of forming aluminum-doped metal carbonitride gate electrodes
02/25/2010US20100048008 Method for manufacturing semiconductor device
02/25/2010US20100048007 High planarizing method for use in a gate last process
02/25/2010US20100048006 Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants
02/25/2010US20100048005 Preparation of ultra-shallow semiconductor junctions using intermediate temperature ramp rates and solid interfaces for defect engineering
02/25/2010US20100048004 Semiconductor device and process for manufacturing the same
02/25/2010US20100048003 Plasma processing apparatus and method thereof
02/25/2010US20100048002 Silicon nitride layer for light emitting device, light emitting device using the same, and method of forming silicon nitride layer for light emitting device
02/25/2010US20100048001 Plasma dicing apparatus and method of manufacturing semiconductor chips
02/25/2010US20100048000 Method of manufacturing semiconductor chips
02/25/2010US20100047999 Working method for an optical device wafer
02/25/2010US20100047998 Manufacturing method of substrate provided with semiconductor films
02/25/2010US20100047997 Method for manufacturing soi substrate
02/25/2010US20100047996 Localized annealing during semiconductor device fabrication
02/25/2010US20100047995 Method for forming self-aligned phase-change semiconductor diode memory
02/25/2010US20100047994 Fabrication of integrated circuits with isolation trenches
02/25/2010US20100047993 Integration of high-k metal-gate stack into direct silicon bonding (dsb) hybrid orientation technology (hot) pmos process flow
02/25/2010US20100047992 Method of fabricating storage node with supported structure of stacked capacitor
02/25/2010US20100047991 High-k dielectric film, method of forming the same and related semiconductor device
02/25/2010US20100047990 Method of fabricating a high q factor integrated circuit inductor
02/25/2010US20100047989 Capacitor with zirconium oxide and method for fabricating the same
02/25/2010US20100047988 Methods of forming a layer, methods of forming a gate structure and methods of forming a capacitor
02/25/2010US20100047987 Method of fabricating a bipolar transistor
02/25/2010US20100047986 Group iii-v compound semiconductor based heterojunction bipolar transistors with various collector profiles on a common wafer
02/25/2010US20100047985 Method for fabricating a semiconductor device with self-aligned stressor and extension regions
02/25/2010US20100047984 Self-aligned metal-semiconductor alloy and metallization for sub-lithographic source and drain contacts
02/25/2010US20100047983 Semiconductor device and method for fabricating the same
02/25/2010US20100047982 Flash Memory Cell Arrays Having Dual Control Gates Per Memory Cell Charge Storage Element
02/25/2010US20100047981 Method of fabricating EEPROM
02/25/2010US20100047980 Process for forming differential spaces in electronics device integrated on a semiconductor substrate
02/25/2010US20100047979 Method of reducing coupling between floating gates in nonvolatile memory
02/25/2010US20100047978 Manufacture of semiconductor device with stress structure
02/25/2010US20100047977 Strained silicon with elastic edge relaxation
02/25/2010US20100047976 Method for forming nitride semiconductor laminated structure and method for manufacturing nitride semiconductor element
02/25/2010US20100047975 Method for fabricating low temperature poly-silicon thin film transistor substrate background
02/25/2010US20100047974 Method of manufacturing thin film transistor array substrate
02/25/2010US20100047973 Method for forming microwires and/or nanowires
02/25/2010US20100047972 Semiconductor structure with field shield and method of forming the structure
02/25/2010US20100047971 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
02/25/2010US20100047970 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system
02/25/2010US20100047969 Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package
02/25/2010US20100047968 Adhesive sheet for producing a semiconductor device, and a method for producing a semiconductor device using the same
02/25/2010US20100047967 Method of manufacturing stacked semiconductor package using improved technique of forming through via
02/25/2010US20100047965 Fabricating method of packaging structure
02/25/2010US20100047964 3d integrated circuit device fabrication using interface wafer as permanent carrier
02/25/2010US20100047963 Through Silicon Via Bonding Structure
02/25/2010US20100047962 Multi-chip printhead assembler
02/25/2010US20100047961 Placement Of An Integrated Circuit
02/25/2010US20100047960 Method of fabricating a phase-change memory
02/25/2010US20100047959 Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells
02/25/2010US20100047958 Method for manufacturing cis based thin film solar cell device
02/25/2010US20100047956 Methods of fabricating integrated imager and microcontroller
02/25/2010US20100047955 Interconnection system for photovoltaic modules
02/25/2010US20100047953 Method for producing wafer for backside illumination type solid imaging device
02/25/2010US20100047952 Method for manufacturing photoelectric conversion device
02/25/2010US20100047949 Stack type surface acoustic wave package, and method for manufacturing the same
02/25/2010US20100047948 Sensor and method of manufacturing the same
02/25/2010US20100047947 Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing
02/25/2010US20100047946 Thin film array panel and manufacturing method thereof
02/25/2010US20100047945 Methods Of Forming Particle-Containing Materials
02/25/2010US20100047941 High power led package and fabrication method thereof
02/25/2010US20100047937 Led package
02/25/2010US20100047936 Method for packaging light-emitting diode
02/25/2010US20100047935 Led packaging method using a screen plate
02/25/2010US20100047934 Method For Fabricating Semiconductor Component Having Encapsulated Through Wire Interconnect (TWI)
02/25/2010US20100047933 Substrate, substrate inspecting method and methods of manufacturing an element and a substrate
02/25/2010US20100047932 Substrate processing apparatus, substrate processing method, substrate processing program, and computer readable recording medium having substrate processing program therein
02/25/2010US20100047931 Semiconductor device and manufacturing method thereof
02/25/2010US20100047930 Magnetic random access memory and method of manufacturing the same
02/25/2010US20100047929 Novel underlayer for high performance magnetic tunneling junction MRAM
02/25/2010US20100047702 Resist pattern forming method
02/25/2010US20100047698 Hybrid multi-layer mask
02/25/2010US20100047563 Silicon wafer and method for manufacturing the same
02/25/2010US20100047472 Film forming method
02/25/2010US20100047471 Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
02/25/2010US20100047053 Die picker for picking printhead die from a wafer
02/25/2010US20100047045 Substrate processing apparatus and method for transferring substrate for the apparatus
02/25/2010US20100047044 Placement head for a die placing assembly
02/25/2010US20100047043 Integrated circuit placement system
02/25/2010US20100046878 Lithium niobate modulator having a doped semiconductor structure for the mitigation of dc bias drift
02/25/2010US20100046567 Propagation of misfit dislocations from buffer/si interface into si
02/25/2010US20100046566 Semiconductor light emitting device and method for manufacturing the same
02/25/2010US20100046285 Multiple phase change materials in an integrated circuit for system on a chip application
02/25/2010US20100046269 Programmable read only memory
02/25/2010US20100046266 High Speed Memory Architecture
02/25/2010US20100046188 Thin foil semiconductor package
02/25/2010US20100046183 Integrated circuit package system
02/25/2010US20100046134 Electrostatic chuck device
02/25/2010US20100046061 Mems package having inclined surface
02/25/2010US20100046058 Diffusion barrier layer for mems devices
02/25/2010US20100045981 Substrate processing apparatus, optical constant obtaining method, and storage medium storing program executing same
02/25/2010US20100045846 Image pickup device, method of manufacturing the same, and mobile terminal device
02/25/2010US20100045845 Stacked type camera module, method of manufacturing stacked type camera module, and imaging apparatus
02/25/2010US20100045584 Display Device and Method for Fabricating the Same
02/25/2010US20100045368 Semiconductor Integrated Circuit
02/25/2010US20100045365 Two terminal quantum device using mos capacitor structure
02/25/2010US20100045326 Thermal monitoring and management of integrated circuits
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