Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/25/2010US20100044715 Thin film transistor array substrate and method of fabricating the same
02/25/2010US20100044713 Liquid crystal display device and electronic device provided with the same
02/25/2010US20100044709 Thin film transistor, manufacturing method thereof and display device
02/25/2010US20100044708 Thin film transistor, pixel structure and fabrication methods thereof
02/25/2010US20100044707 Thin film transistor array substrate, method for manufacturing the same and system for inspecting the substrate
02/25/2010US20100044705 Doped substrate to be heated
02/25/2010US20100044704 Vertical thermoelectric structures
02/25/2010US20100044702 Semiconductor element, method for manufacturing same, and electronic device including same
02/25/2010US20100044699 Thin film transistor and method of fabricating the same
02/25/2010US20100044698 Semiconductor Film Composition
02/25/2010US20100044679 Method For Producing Carbon Nanotube Transistor And Carbon Nanotube Transistor Thereby
02/25/2010US20100044671 Methods for increasing carbon nano-tube (cnt) yield in memory devices
02/25/2010US20100044670 Semiconductor device structures having single-crystalline switching device on conducting lines and methods thereof
02/25/2010US20100044669 Integrated circuit including memory cell having cup-shaped electrode interface
02/25/2010US20100044668 Hybrid mrar array structure and operation
02/25/2010US20100044665 Electronic component, and a method of manufacturing an electronic component
02/25/2010US20100044664 Memory devices and methods of forming the same
02/25/2010US20100044085 Wiring, display device and method of manufacturing the same
02/25/2010US20100043976 Plasma processing apparatus
02/25/2010US20100043975 Movable gas introduction structure and substrate processing apparatus having same
02/25/2010US20100043974 Plasma processing method and apparatus
02/25/2010US20100043973 Plasma processor
02/25/2010US20100043888 Ald apparatus and method
02/25/2010US20100043873 Semiconducting devices and methods of making the same
02/25/2010US20100043839 Substrate processing method
02/25/2010US20100043712 Substrate processing apparatus
02/25/2010US20100043707 Cleaning method of semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
02/25/2010US20100043702 Semiconductor thin film, thin film transistor, method for manufacturing same, and manufacturing equipment of semiconductor thin film
02/25/2010US20100043546 Sensor and method of manufacturing the same
02/25/2010US20100043226 Segmented contactor
02/25/2010US20100043221 External electrode forming method
02/25/2010US20100043214 Integrated circuit dice pick and lift head
02/25/2010US20100043160 Wafer cleaning roller
02/25/2010DE202008012449U1 Herstellvorrichtung für Strings Fabrication for Strings
02/25/2010DE112008000264T5 Elektronisches Bauelement und Verfahren zum Herstellen desselben The same electronic device and methods for making
02/25/2010DE112005002630B4 Verfahren zum Ausbilden eines Halbleiterbauelements mit einer vollständig silizidierten Gateelektrode (FUSI) sowie integrierter Schaltungschip A method of forming a semiconductor device with a fully silicided gate electrode (FUSI) and integrated circuit chip
02/25/2010DE10392500B4 Lottragendes Bauteil und Verfahren zum Halten einer Lotmasse darauf Lottragendes component and method for holding a solder mass on it,
02/25/2010DE10361707B4 Verfahren zum Herstellen eines Flash-Speichers A method of manufacturing a flash memory
02/25/2010DE10358769B4 Verfahren zum Herstellen eines Flashspeicherbauelements A method of manufacturing a flash memory device
02/25/2010DE10311824B4 Periphere Schaltkreisstruktur eines Halbleiterspeicherbauelements Peripheral circuit structure of a semiconductor memory device
02/25/2010DE10261306B4 Haltering mit reduzierter Abnutzungs- und Kontaminationsrate für einen Polierkopf einer CMP-Anlage und Polierkopf und CMP-Vorrichtung mit Haltering Retaining ring for minimal wear and contamination rate for a polishing head of a CMP-conditioning and polishing head and CMP apparatus with retaining ring
02/25/2010DE102009032037A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
02/25/2010DE102009014424A1 Stoff aus Metall und Milchsäurekondensat sowie elektronisches Bauteil Fabric made of metal and lactic acid condensate and electronic component
02/25/2010DE102008049718B3 Transistorbauelement mit einer asymmetrischen eingebetteten Halbleiterlegierung und Herstellungsverfahren dafür Transistor device with an asymmetric embedded semiconductor alloy and manufacturing method thereof
02/25/2010DE102008041250A1 Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern Method and apparatus for thermal processing of plastic discs, especially Moldwafern
02/25/2010DE102008039183A1 Verfahren zum Herstellen eines zinkoxidhaltigen Materials und ein Halbleiterbauelement mit einem zinkoxidhaltigen Material A method for producing a zinc oxide-containing material and a semiconductor device with a zinc oxide-containing material
02/25/2010DE102008038184A1 Verfahren und Vorrichtung zur temporären elektrischen Kontaktierung einer Solarzelle Method and apparatus for the temporary electrical contact of a solar cell
02/25/2010DE102008038175A1 Semiconductor arrangement for use in electronic system, has mold for covering semiconductor chip, and set of flexible elements arranged in recesses, where flexible elements connect set of contact elements with mold
02/25/2010DE102008037951A1 Verfahren zum elektronenstrahlinduzierten Ätzen von mit Gallium verunreinigten Schichten A method for electron beam induced etching layers contaminated with gallium
02/25/2010DE102008037943A1 Verfahren zum elektronenstrahlinduzierten Ätzen A method for electron beam induced etching
02/25/2010DE102008035805A1 Gatedielektrika mit unterschiedlicher Dicke in PMOS- und NMOS-Transistoren Gate dielectrics having different thicknesses in PMOS and NMOS transistors
02/25/2010DE102007049961A9 ESD-Schutz für integrierte Schaltungen ESD Protection for Integrated Circuits
02/24/2010EP2157697A1 Configurable circuit and configuration method
02/24/2010EP2157613A1 Method for monolithic integration of a pseudomorphic integrated telephone and data network and a transistor made from III-V materials
02/24/2010EP2157612A1 Semiconductor device
02/24/2010EP2157606A1 Metallized substrate and process for producing the same
02/24/2010EP2157603A1 Method for manufacturing localised GeOI structures, obtained by germanium enrichment
02/24/2010EP2157602A1 A method of manufacturing a plurality of fabrication wafers
02/24/2010EP2157601A1 Method for dry cleaning plasma processing apparatus
02/24/2010EP2157479A1 Resist composition for negative development and method of forming pattern therewith
02/24/2010EP2157477A1 Resist composition for negative working-type development, and method for pattern formation using the resist composition
02/24/2010EP2157402A1 Device for measuring the alignment of attached structures
02/24/2010EP2157107A1 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
02/24/2010EP2156466A1 Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity
02/24/2010EP2155434A1 Stacked polishing pad for high temperature applications
02/24/2010EP1782462B1 Method of detaching a thin semiconductor circuit from its base
02/24/2010EP1706889B1 Gas distribution plate assembly for plasma reactors
02/24/2010EP1699077B1 Plasma processing apparatus
02/24/2010EP1573791B1 Strained silicon-on-insulator (ssoi) and method to form the same
02/24/2010EP1499905B1 Method and arrangement for protecting a chip and checking its authenticity
02/24/2010EP1392449B1 Over-clocking in a microdeposition control system to improve resolution
02/24/2010EP1377138B1 Device and control method for micro wave plasma processing
02/24/2010EP1371271B1 Plasma installation and method for producing a functional coating
02/24/2010EP1278612B1 Flip chip Interconnection structure and method of obtaining the same
02/24/2010EP1116282B1 VERTICAL GEOMETRY InGaN LED
02/24/2010CN201413829Y Automatic transferring and detecting device for sunshine electric panel
02/24/2010CN201413819Y Combined jig of DIP tube shell used for parallel seal welding
02/24/2010CN201413818Y Sheet bearing platform of thick-film through-hole printing machine
02/24/2010CN201413817Y Mask plate transfer machine
02/24/2010CN201410642Y Semiconductor grinding and cleaning device
02/24/2010CN101657895A Semiconductor device
02/24/2010CN101657894A Method and apparatus for singulated die testing
02/24/2010CN101657893A Detecting materials on wafer and repair system and method thereof
02/24/2010CN101657892A Specimen inspection stage implemented with processing stage coupling mechanism
02/24/2010CN101657891A Convex die attachment method
02/24/2010CN101657890A Method for manufacturing chip with adhesive
02/24/2010CN101657889A Improved process for preparing cleaned surfaces of strained silicon
02/24/2010CN101657888A Method of cleaning powdery source supply system, storage medium, substrate treating system and method of substrate treatment
02/24/2010CN101657887A Etching solution
02/24/2010CN101657886A Wafer electroless plating system and associated methods
02/24/2010CN101657885A Oxide semiconductor target, method of forming the same, method of forming oxide semiconductor layer using the same and method of manufacturing semiconductor device using the same
02/24/2010CN101657884A Trench structure and method of forming the trench structure
02/24/2010CN101657883A Method for forming fine patterns
02/24/2010CN101657882A Display device, method for manufacturing display device, and SOI substrate
02/24/2010CN101657881A Wafer holding robot end effecter vertical position determination in ion implanter system
02/24/2010CN101657292A laser machining
02/24/2010CN101656233A Method for manufacturing thin film transistor substrate
02/24/2010CN101656232A Method for manufacturing thin film transistor array substrate
02/24/2010CN101656231A Method for manufacturing semiconductor device integrated with CMOS component and BJT component
02/24/2010CN101656230A Method of manufacturing thin film transistor array substrate