Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/24/2010EP2166566A1 Device for charging dry air or nitrogen gas into semiconductor wafer storage container and wafer static charge removing apparatus utilizing the device
03/24/2010EP2166565A2 P-channel power mis field effect transistor and switching circuit
03/24/2010EP2166564A2 Method for removing a hardened photoresist from a semiconductor substrate
03/24/2010EP2166563A1 Method for manufacturing a microelectronic device equipped with semiconductor areas on an insulator with horizontal Ge concentration gradient
03/24/2010EP2166562A2 Method for forming a capacitor having a strontium/barium titanium oxide dielectric layer by means of ALD and memory device comprising such a capacitor
03/24/2010EP2166549A1 Capacitor, resonator, filter device, communication device and electric circuit
03/24/2010EP2166543A1 Production of electronic devices
03/24/2010EP2166366A1 Magnetic field sensor
03/24/2010EP2166131A1 Thin film manufacturing apparatus and thin film manufacturing method
03/24/2010EP2166036A1 Resin composition, embedding material, insulating layer, and semiconductor device
03/24/2010EP2165805A1 Multi-wire saw and method of cutting ingot
03/24/2010EP2165369A1 Anti-fuse memory cell
03/24/2010EP2165367A1 Improved power switching transistors
03/24/2010EP2165364A2 Vertical current controlled silicon on insulator (soi) device and method of forming same
03/24/2010EP2165362A1 Low resistance through-wafer via
03/24/2010EP2165359A1 Threshold adjustment for high-k gate dielectric cmos
03/24/2010EP2165358A1 Susceptor for improving throughput and reducing wafer damage
03/24/2010EP2165355A1 Pitch multiplication using self-assembling materials
03/24/2010EP2165354A1 Photovoltaic device including semiconductor nanocrystals
03/24/2010EP2165006A1 Device for coating substrates disposed on a susceptor
03/24/2010EP2164648A1 Low k dielectric
03/24/2010EP1566417B1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
03/24/2010EP1287550B1 Post chemical-mechanical planarization (cmp) cleaning composition
03/24/2010CN201430156Y Silicon chip suction and discharge pen
03/24/2010CN201430155Y Guiding rail positioning chopping board
03/24/2010CN201430143Y Reverse blocking diode thyristor
03/24/2010CN201430131Y Power-cut protecting device of integrated circuit encapsulating system
03/24/2010CN201430130Y Vacuum device with transmission function and used for low-temperature process
03/24/2010CN201427995Y System by using mist chemical agent to carry out single-side continuous chemical wet processing
03/24/2010CN201427275Y Weight for reduction of semiconductor wafer wear
03/24/2010CN101682988A Circuit connecting material and connecting structure for circuit member
03/24/2010CN101682170A Methods of fabricating metal contact structures for laser diodes using backside uv exposure
03/24/2010CN101681975A Main substrate of nitride-based illuminating device
03/24/2010CN101681964A Method for producing optoelectronic components, and optoelectronic component
03/24/2010CN101681944A Protection layer for fabricating a solar cell
03/24/2010CN101681934A Junction field effect transistor with a hyperabrupt junction
03/24/2010CN101681932A Method for manufacturing thin film transistor, method for manufacturing liquid crystal display, and method for forming electrode
03/24/2010CN101681930A Polycrystalline silicon thin film transistors with bridged-grain structures
03/24/2010CN101681929A Gate insulating film forming agent for thin-film transistor
03/24/2010CN101681924A Forming a non-planar transistor having a quantum well channel
03/24/2010CN101681909A Vertical current controlled silicon on insulator (soi) device and method of forming same
03/24/2010CN101681903A Electronic package and manufacturing method thereof
03/24/2010CN101681887A Method for producing a set of chips mechanically interconnected by means of a flexible connection
03/24/2010CN101681886A semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
03/24/2010CN101681885A Semiconductor device
03/24/2010CN101681884A Three dimensional NAND memory and method of making thereof
03/24/2010CN101681883A Process for producing semiconductor device and semiconductor device
03/24/2010CN101681882A Thin film capacitor, and display and memory cell employing the film capacitor, and mehtods for fabricating the thin film capacitor, the display and the memory cell
03/24/2010CN101681881A Semiconductor device, power supply provided with semiconductor device, and processing unit
03/24/2010CN101681880A Semiconductor device
03/24/2010CN101681879A Electronic device and method for operating a memory circuit
03/24/2010CN101681878A Filler cells for design optimization in a place-and-route system
03/24/2010CN101681877A Light emitting diode with vertical structure
03/24/2010CN101681876A Infrared laser wafer scribing using short pulses
03/24/2010CN101681875A Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
03/24/2010CN101681874A Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
03/24/2010CN101681873A Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
03/24/2010CN101681872A Charge reservoir structure
03/24/2010CN101681871A Device for coating a plurality of closest-packed substrates arranged on a susceptor
03/24/2010CN101681870A Dynamic temperature backside gas control for improved within-substrate processing uniformity
03/24/2010CN101681869A Method of loading a substrate on a substrate table, device manufacturing method, computer program, data carrier and apparatus
03/24/2010CN101681868A wafer supporting glass
03/24/2010CN101681867A Treating apparatus
03/24/2010CN101681866A Wafer chucking apparatus for plasma process
03/24/2010CN101681865A Transport pod interface
03/24/2010CN101681864A Apparatus for transferring wafer carrier and system for fabricating semiconductor having the same
03/24/2010CN101681863A Substrate transfer apparatus
03/24/2010CN101681862A Fpd substrate and semiconductor wafer inspection system using duplicate images
03/24/2010CN101681861A Fixing device of probe card
03/24/2010CN101681860A Method of transferring adhesive film
03/24/2010CN101681859A 半导体器件 Semiconductor devices
03/24/2010CN101681858A Electronic component connecting method and joined body
03/24/2010CN101681857A Apparatus and method for assembling display panel
03/24/2010CN101681856A Electronic component mounting device and mounting method
03/24/2010CN101681855A Electric device, connecting method and adhesive film
03/24/2010CN101681854A Package for semiconductor device and packaging method thereof
03/24/2010CN101681853A Mobile binding in an electronic connection
03/24/2010CN101681852A Flip chip with interposer, and methods of making same
03/24/2010CN101681851A connecting microsized devices using ablative films
03/24/2010CN101681850A Bonding apparatus, and bonding method
03/24/2010CN101681849A Bonding apparatus, and bonding method
03/24/2010CN101681847A Pad layout structure of semiconductor chip
03/24/2010CN101681846A Underfill anchor structure for an integrated circuit
03/24/2010CN101681845A Adhesive film and semiconductor device obtained with the same
03/24/2010CN101681844A Method of depositing materials on a non-planar surface
03/24/2010CN101681843A Method of manufacturing semiconductor device
03/24/2010CN101681842A Semiconductor device having tipless epitaxial source/drain regions
03/24/2010CN101681841A High-k/metal gate mosfet with reduced parasitic capacitance
03/24/2010CN101681840A Junction barrier schottky diode
03/24/2010CN101681839A Multiple millisecond anneals for semiconductor device fabrication
03/24/2010CN101681838A Method for suppressing lattice defects in a semiconductor substrate
03/24/2010CN101681837A Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore
03/24/2010CN101681836A Method for pretreating inner space of chamber in plasma nitridation, plasma processing method and plasma processing apparatus
03/24/2010CN101681835A Thin film and method for manufacturing semiconductor device using the thin film
03/24/2010CN101681834A Process for producing semiconductor device
03/24/2010CN101681833A Micro wave plasma processing device, micro wave plasma processing method, and micro wave transmitting plate
03/24/2010CN101681832A Plasma processing apparatus, plasma processing method and end point detecting method
03/24/2010CN101681831A High-strength columnar crystal silicon and plasma etching device part formed by high-strength columnar crystal silicon
03/24/2010CN101681830A Dry etching apparatus and dry etching method
03/24/2010CN101681829A Etching method and etching apparatus