Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/25/2010US20100075506 Apparatus and method for manufacturing semiconductor element and semiconductor element manufactured by the method
03/25/2010US20100075505 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
03/25/2010US20100075504 Method of treating a semiconductor substrate
03/25/2010US20100075503 Integral patterning of large features along with array using spacer mask patterning process flow
03/25/2010US20100075502 Barrier slurry for low-k dielectrics
03/25/2010US20100075501 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
03/25/2010US20100075500 Metal polishing slurry and chemical mechanical polishing method
03/25/2010US20100075499 Method and apparatus for metal silicide formation
03/25/2010US20100075498 Semiconductor device and method for manufacturing the same, and processing liquid
03/25/2010US20100075497 Non-Plating Line Plating Method Using Current Transmitted From Ball Side
03/25/2010US20100075496 Surface preparation process for damascene copper deposition
03/25/2010US20100075495 Method Of Selectively Plating Without Plating Lines
03/25/2010US20100075494 Integration of ald tantalum nitride for copper metallization
03/25/2010US20100075493 Method of forming electrode connecting portion
03/25/2010US20100075492 Nonvolatile semiconductor memory and method of fabrication thereof
03/25/2010US20100075491 Dry etching method of silicon compound film
03/25/2010US20100075490 Defect-free junction formation using laser melt annealing of octadecaborane self-amorphizing implants
03/25/2010US20100075489 Method for producing semiconductor device and semiconductor producing apparatus
03/25/2010US20100075488 Cvd reactor with multiple processing levels and dual-axis motorized lift mechanism
03/25/2010US20100075487 Crystallization method
03/25/2010US20100075486 Formation of single crystal semiconductor nanowires
03/25/2010US20100075485 Integrated emitter formation and passivation
03/25/2010US20100075484 Soi device with contact trenches formed during epitaxial growing
03/25/2010US20100075483 Method for manufacturing nitride semiconductor device
03/25/2010US20100075482 Bonded Wafer Assembly System and Method
03/25/2010US20100075481 Method and structure of monolithically integrated ic-mems oscillator using ic foundry-compatible processes
03/25/2010US20100075480 Sti stress modulation with additional implantation and natural pad sin mask
03/25/2010US20100075479 Semiconductor Device and Method of Forming the Same
03/25/2010US20100075478 Method for photoresist pattern removal
03/25/2010US20100075477 Method of Manufacturing Semiconductor Device
03/25/2010US20100075476 Semiconductor device fabrication method
03/25/2010US20100075475 Method for producing a thin film transistor and method for forming an electrode
03/25/2010US20100075474 Silicon carbide semiconductor device and method for producing the same
03/25/2010US20100075473 Transistor Forming Methods
03/25/2010US20100075472 TFT array substrate and the fabrication method thereof
03/25/2010US20100075471 Recessed Gate Silicon-On-Insulator Floating Body Device With Self-Aligned Lateral Isolation
03/25/2010US20100075470 Method of manufacturing soi substrate
03/25/2010US20100075469 Method for making thin transistor
03/25/2010US20100075468 Methods, devices and compositions for depositing and orienting nanostructures
03/25/2010US20100075467 Non-volatile electromechanical field effect devices and circuits using same and methods of forming same
03/25/2010US20100075466 Method of forming assymetrical encapsulant bead
03/25/2010US20100075465 Method of reducing voids in encapsulant
03/25/2010US20100075464 Method of reducing voids in encapsulant
03/25/2010US20100075463 Method and apparatus for fabricating self-assembling microstructures
03/25/2010US20100075462 Method of forming semiconductor package
03/25/2010US20100075461 Method for transferring chips onto a substrate
03/25/2010US20100075460 Low Cost Die-To-Wafer Alignment/Bond For 3d IC Stacking
03/25/2010US20100075459 Thermal barrier layer for integrated circuit manufacture
03/25/2010US20100075458 Film deposition of amorphous films with a graded bandgap by electron cyclotron resonance
03/25/2010US20100075457 Method of manufacturing stacked-layered thin film solar cell with a light-absorbing layer having band gradient
03/25/2010US20100075451 Method for manufacturing a thin film structure
03/25/2010US20100075450 Method for manufacturing array substrate of liquid crystal display
03/25/2010US20100075449 Method of forming amorphous silicon layer and method of fabricating lcd using the same
03/25/2010US20100075447 Method of manufacturing a flexible device and method of manufacturing a flexible display
03/25/2010US20100075446 Method of forming assymetrical encapsulant bead
03/25/2010US20100075445 Silicon Microchannel Plate Devices With Smooth Pores And Precise Dimensions
03/25/2010US20100075444 Method of manufacturing semiconductor chip and semiconductor module
03/25/2010US20100075443 Template inspection method and manufacturing method for semiconductor device
03/25/2010US20100075442 Semiconductor wafer processing apparatus, reference angular position detection method, and semiconductor wafer
03/25/2010US20100075263 Over-coating agent for forming fine patterns and a method of forming fine patterns using such agent
03/25/2010US20100075236 Photomask blank, photomask, and methods of manufacturing the same
03/25/2010US20100075235 Writing pattern producing method, photomask manufacturing method, and semiconductor device manufacturing method
03/25/2010US20100075082 Barrier film and laminated material, container for wrapping and image display medium using the same, and manufacturing method for barrier film
03/25/2010US20100074974 Metal-rich siliceous compositions and methods of producing same
03/25/2010US20100074718 Automatic wafer storage system and a method for controlling the system
03/25/2010US20100074717 Automatic transport system and control method thereof
03/25/2010US20100074604 Apparatus and Method for Improved Control of Heating and Cooling of Substrates
03/25/2010US20100074577 Hybrid optical switch apparatus
03/25/2010US20100074511 Mask inspection apparatus, and exposure method and mask inspection method using the same
03/25/2010US20100074038 Memory Dies for Flexible Use and Method for Configuring Memory Dies
03/25/2010US20100074013 Semiconductor Device and Method of Fabricating the Same
03/25/2010US20100073993 Multi-resistive integrated circuit memory
03/25/2010US20100073893 Minimizing plating stub reflections in a chip package using capacitance
03/25/2010US20100073688 Periodic patterns and technique to control misalignment between two layers
03/25/2010US20100073658 Laser light source device, exposure device, and mask inspection device using this laser light source device
03/25/2010US20100073532 Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
03/25/2010US20100073352 Semiconductor element, electric circuit, display device and light-emitting device
03/25/2010US20100073166 Laser ablation to create pocket for die placement
03/25/2010US20100073031 Nanotube-based switching elements with multiple controls and logic circuits having said elements
03/25/2010US20100073024 Architecture and interconnect scheme for programmable logic circuits
03/25/2010US20100072976 Sensing element, manufacturing method thereof, and biological detection system employing such sensing element
03/25/2010US20100072890 Inorganic electroluminescent device and display apparatus employing the same
03/25/2010US20100072882 Organic light emitting display device and method for manufacturing the same
03/25/2010US20100072635 Protecting Sidewalls of Semiconductor Chips using Insulation Films
03/25/2010US20100072634 Planar encapsulation and mold cavity package in package system
03/25/2010US20100072632 Bond pad structure having dummy plugs and/or patterns formed therearound
03/25/2010US20100072630 Integrated circuit package system with adhesive segment spacer
03/25/2010US20100072629 Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device
03/25/2010US20100072628 Semiconductor device
03/25/2010US20100072627 Wafer including intercepting through-vias and method of making intercepting through-vias in a wafer
03/25/2010US20100072626 Wafer level packaged mems integrated circuit
03/25/2010US20100072623 Semiconductor device with improved contact plugs, and related fabrication methods
03/25/2010US20100072622 Method for forming Barrier Layer and the Related Damascene Structure
03/25/2010US20100072620 Semiconductor Chip with Backside Conductor Structure
03/25/2010US20100072619 Wire bonding structure and manufacturing method thereof
03/25/2010US20100072618 Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection
03/25/2010US20100072617 Multiple die structure and method of forming a connection between first and second dies in same
03/25/2010US20100072616 Method of manufacturing an electronic system
03/25/2010US20100072613 Inkjet printed leadframe
03/25/2010US20100072606 Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon Via and Method of the same
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