| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/01/2010 | US20100078661 Machined surface led assembly |
| 04/01/2010 | US20100078655 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same |
| 04/01/2010 | US20100078654 Semiconductor device and method of fabricating the same |
| 04/01/2010 | US20100078653 Transistor having a high-k metal gate stack and a compressively stressed channel |
| 04/01/2010 | US20100078651 Electronic field effect devices and methods for their manufacture |
| 04/01/2010 | US20100078648 Gallium nitride-based epitaxial wafer and method of fabricating epitaxial wafer |
| 04/01/2010 | US20100078645 Semiconductor device comprising a buried poly resistor |
| 04/01/2010 | US20100078644 Insulating film pattern, method for manufacturing the same, and method for manufacturing thin film transistor substrate using the same |
| 04/01/2010 | US20100078642 Layered structure and electron device that uses such a layered structure, fabrication process thereof, electron device array and display apparatus |
| 04/01/2010 | US20100078641 Display substrate, method of manufacturing the same, and display apparatus having the same |
| 04/01/2010 | US20100078639 Thin film semiconductor device fabrication method and thin film semiconductor device |
| 04/01/2010 | US20100078635 Semiconductor device |
| 04/01/2010 | US20100078634 Semiconductor device |
| 04/01/2010 | US20100078633 Insulated gate type transistor and display device |
| 04/01/2010 | US20100078626 P-type semiconductor material, semiconductor device, organic electroluminescent device, and method for manufacturing p-type semiconductor material |
| 04/01/2010 | US20100078622 Nonvolatile memory device and method for manufacturing same |
| 04/01/2010 | US20100078619 Resistive memory cell and method for manufacturing a resistive memory cell |
| 04/01/2010 | US20100078618 Self-assembly process for memory array |
| 04/01/2010 | US20100078617 Method to reduce a via area in a phase change memory cell |
| 04/01/2010 | US20100078616 Nonvolatile memory device and manufacturing process thereof |
| 04/01/2010 | US20100078615 Semiconductor memory device |
| 04/01/2010 | US20100078601 Preparation of Lanthanide-Containing Precursors and Deposition of Lanthanide-Containing Films |
| 04/01/2010 | US20100078130 creping adhesive and modifier comprises polyethylene; for use on cylinder such as a Yankee dryer |
| 04/01/2010 | US20100078129 Mounting table for plasma processing apparatus |
| 04/01/2010 | US20100078128 Substrate processing apparatus |
| 04/01/2010 | US20100078073 Semiconductor component with contacts made of alloyed-in metal wires |
| 04/01/2010 | US20100078055 laminating thermoplastic film, sheet comprising surface layers made of acid copolymers, ionomers, and inner layer of ethylene acrylate ester copolymers, with encapsulant layer |
| 04/01/2010 | US20100077839 In situ monitoring of metal contamination during microstructure processing |
| 04/01/2010 | US20100077772 Cooling apparatus and method for liquid crystal display device and method of manufacturing liquid crystal display device |
| 04/01/2010 | DE112008001108T5 Wafer-Halterung, vertikales Wärmebehandlungsschiffchen, welches eine Wafer-Halterung einschliesst, sowie Verfahren für die Herstellung einer Wafer-Halterung Wafer holder, vertical Wärmebehandlungsschiffchen which includes a wafer holder, and to processes for the preparation of a wafer holder |
| 04/01/2010 | DE112008000279T5 Verfahren zur Herstellung von Gruppe III-V-Verbindungshalbleitern A process for the production of group III-V compound semiconductors |
| 04/01/2010 | DE10240748B4 Verfahren zur Planarisierung einer Halbleiterprobe Method for planarizing a semiconductor sample |
| 04/01/2010 | DE102009042324A1 Voltage reducing method for III-nitride structure of semiconductor structure, involves supplying continuous III-nitride layer with reduced voltage by implementing lateral growth of unetched parts of hardened III-nitride layer |
| 04/01/2010 | DE102009040632A1 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device |
| 04/01/2010 | DE102009039573A1 Bipolartransistor des Typs mit Poly-Emitter, Bipolar-CMOS-DMOS-Bauelement und Verfahren zur Herstellung eines Bipolartransistors des Typs mit Poly-Emitter und eines Bipolar-CMOS-DMOS-Bauelements Bipolar transistor of the type having poly-emitter, bipolar-CMOS-DMOS device and method for fabricating a bipolar transistor of the type having poly-emitter and of a bipolar-CMOS-DMOS device |
| 04/01/2010 | DE102009038701A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 04/01/2010 | DE102008050000A1 Verfahren zum gleichzeitigen mechanischen und elektrischen Verbinden von zwei Teilen Method for simultaneous mechanical and electrical connection of two parts |
| 04/01/2010 | DE102008049663A1 Method for manufacturing acceptors in semiconductor body, involves providing semiconductor body and bringing foreign matter into semiconductor body |
| 04/01/2010 | DE102008049303A1 Method for manufacturing silicon wafer for solar cells, involves forming silicon layer on substrate, where silicon powder or suspension containing silicon powder formed as silicon-paste is applied layer like on substrate |
| 04/01/2010 | DE102008047955A1 Method for production of semiconductor layers, involves providing substrate and producing aerosol and liquid droplets, which are chemically combined with semiconductor material |
| 04/01/2010 | DE102008047863A1 Semiconductor components separating method, involves changing crystal structure within wafer along cut line, supporting crystal structure at front side and at rear side, and forming trench at rear side of wafer along cut line |
| 04/01/2010 | DE102008042450A1 Verfahren zum Strukturieren von Siliziumcarbid mittels fluorhaltiger Verbindungen Method for structuring of silicon carbide using fluorine-containing compounds |
| 04/01/2010 | DE102008042432A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 04/01/2010 | DE102008037404A1 Verfahren zur chemischen Behandlung eines Substrats A process for the chemical treatment of a substrate |
| 04/01/2010 | DE102007032385B4 Verfahren zur Reinigung einer Halbleiterscheibe nach CMP A method for cleaning a semiconductor wafer after CMP |
| 04/01/2010 | DE102007030021B4 Verfahren zum Ausbilden einer Halbleiterstruktur mit einem Feldeffekttransistor, der ein verspanntes Kanalgebiet aufweist und Halbleiterstruktur A method of forming a semiconductor structure with a field effect transistor having a stressed channel region and the semiconductor structure |
| 04/01/2010 | DE102005032520B4 Konfigurierbarer Prober zum Testen eines TFT LCD Arrays Configurable prober for testing a TFT LCD array |
| 04/01/2010 | DE102004031741B4 Verfahren zur Herstellung einer Kontaktanordnung für Feldeffekttransistorstrukturen mit Gateelektroden mit einer Metalllage und Verwendung des Verfahrens zur Herstellung von Feldeffekttransistoranordnungen in einem Zellenfeld A method for fabricating a contact assembly for field effect transistor structures with gate electrodes having a metal layer and using the method for the preparation of field effect transistor devices in a cell array |
| 04/01/2010 | DE102004013478B4 Verfahren zur Herstellung eines Bipolartransistors mit verbessertem Basisanschluss A method of manufacturing a bipolar transistor with an improved base terminal |
| 04/01/2010 | DE10195941B4 Halbleiter-Bearbeitungsverfahren zum Entfernen leitfähigen Materials Semiconductor processing method of removing conductive material |
| 04/01/2010 | CA2738433A1 Printed circuit board for harsh environments |
| 03/31/2010 | EP2169722A1 Pn diode, electric circuit device and power conversion device |
| 03/31/2010 | EP2169717A1 Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same |
| 03/31/2010 | EP2169716A1 Method for transferring chips onto a substrate |
| 03/31/2010 | EP2169715A2 Integrated switching assembly with condenser and production method |
| 03/31/2010 | EP2169714A2 Free standing thickness of single crystal material and method having carrier lifetimes |
| 03/31/2010 | EP2169713A1 Method for manufacturing electronic device, method for manufacturing epitaxial substrate, iii nitride semiconductor element and gallium nitride epitaxial substrate |
| 03/31/2010 | EP2169712A1 Quantitative evaluation device of atomic vacancies existing in silicon wafer, method for the device, silicon wafer manufacturing method, and thin-film oscillator |
| 03/31/2010 | EP2169711A1 Semiconductor device, semiconductor device manufacturing method, display device and display device manufacturing method |
| 03/31/2010 | EP2169710A1 Metal film polishing liquid and polishing method |
| 03/31/2010 | EP2169709A1 Diamond semiconductor device |
| 03/31/2010 | EP2169708A2 Silicon wafer and fabrication method thereof |
| 03/31/2010 | EP2169707A1 Sintered silicon wafer |
| 03/31/2010 | EP2169706A1 Method and apparatus for processing wafer surfaces |
| 03/31/2010 | EP2168934A1 Sintered silicon wafer |
| 03/31/2010 | EP2168917A1 Microspheres of silicon and photonic sponges, method for production and uses thereof in the manufacture of photonic devices |
| 03/31/2010 | EP2168165A1 Printing of contact metal and interconnect metal via seed printing and plating |
| 03/31/2010 | EP2168163A1 Junction field effect transistor with a hyperabrupt junction |
| 03/31/2010 | EP2168162A1 Hetero-structure field effect transistor, integrated circuit including a hetero-structure field effect transistor and method for manufacturing a hetero-structure field effect transistor |
| 03/31/2010 | EP2168155A2 Integrated circuits on a wafer and methods for manufacturing integrated circuits |
| 03/31/2010 | EP2168153A2 A technique for forminig an interlayer dielectric material of increased reliability above a structure including closely spaced lines |
| 03/31/2010 | EP2168150A1 Suppression of oxygen precipitation in heavily doped single crystal silicon substrates |
| 03/31/2010 | EP2168149A1 A method and system for removing impurities from low-grade crystalline silicon wafers |
| 03/31/2010 | EP2168147A2 Composite nanorods |
| 03/31/2010 | EP2168146A2 Single crystal growth on a mis-matched substrate |
| 03/31/2010 | EP2168145A1 Recrystallization of semiconductor wafers in a thin film capsule and related processes |
| 03/31/2010 | EP2168144A1 Subassembly that includes a power semiconductor die and a heat sink and method of forming same |
| 03/31/2010 | EP2168008A1 Spacer lithography |
| 03/31/2010 | EP2168001A2 Microalignment using laser-softened glass bumps |
| 03/31/2010 | EP2167703A2 Reactive flow deposition and synthesis of inorganic foils |
| 03/31/2010 | EP2167701A1 Method for providing a crystalline germanium layer on a substrate |
| 03/31/2010 | EP2167440A2 Synthetic quartz glass body, process for producing the same, optical element, and optical apparatus |
| 03/31/2010 | EP2167285A1 Gripper, in particular a bernoulli gripper |
| 03/31/2010 | EP2167224A1 Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus |
| 03/31/2010 | EP1986832B1 Method of manufacturing a semiconductor device and a semiconductor device produced thereby |
| 03/31/2010 | EP1434261B1 Circuit device mounting method and press |
| 03/31/2010 | EP1410418B1 Method and apparatus for micro-jet enabled, low energy ion generation and transport in plasma processing |
| 03/31/2010 | EP0974158B1 Method of manufacturing a semiconductor device |
| 03/31/2010 | CN201435385Y Novel delivery device used for lead frame |
| 03/31/2010 | CN201435384Y Adjustable combination type tray |
| 03/31/2010 | CN201435383Y Bridge type rectification integrated block detecting marker |
| 03/31/2010 | CN201435382Y Wax melter for semiconductor wafer manufacturing |
| 03/31/2010 | CN201432248Y Finishing device for wafer grinding pad |
| 03/31/2010 | CN201432228Y Silicon block chamfering processing device |
| 03/31/2010 | CN101689601A Process for producing magnetic device, apparatus for producing magnetic device, and magnetic device |
| 03/31/2010 | CN101689600A Magnetoresistive element and magnetic random access memory |
| 03/31/2010 | CN101689599A Tunnel magnetoresistive thin film and magnetic multilayer film formation apparatus |
| 03/31/2010 | CN101689592A III nitride semiconductor light emitting element, method for manufacturing the iii nitride semiconductor light emitting element, and lamp |
| 03/31/2010 | CN101689582A Thin-film solar cell manufacturing system and common substrate storage rack |
| 03/31/2010 | CN101689566A Semiconductor device, semiconductor device manufacturing method and image display device |