Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/23/2010US7682221 Integrated endpoint detection system with optical and eddy current monitoring
03/23/2010US7682123 Compact apparatus and method for storing and loading semiconductor wafer carriers
03/23/2010US7681779 Method for manufacturing electric connections in wafer
03/23/2010US7681521 Insulation film formation device
03/23/2010US7681308 Fabrication method of semiconductor integrated circuit device
03/23/2010US7681307 Soldering a flexible circuit
03/23/2010CA2552720C Lensed tip optical fiber and method of making the same
03/18/2010WO2010031010A1 Solar photovoltaic devices and methods of making them
03/18/2010WO2010030962A2 Structures and methods for wafer packages, and probes
03/18/2010WO2010030804A1 Signal delivery in stacked device
03/18/2010WO2010030729A2 High speed thin film deposition via pre-selected intermediate
03/18/2010WO2010030718A2 Technique for monitoring and controlling a plasma process with an ion mobility spectrometer
03/18/2010WO2010030649A1 Rapid thermal processing lamphead with improved cooling
03/18/2010WO2010030613A1 Boundary layer disruptive preconditioning in atmospheric-plasma process
03/18/2010WO2010030588A2 Implanting a solar cell substrate using a mask
03/18/2010WO2010030555A1 Shared masks for x-lines and shared masks for y-lines for fabrication of 3d memory arrays
03/18/2010WO2010030529A2 Low sloped edge ring for plasma processing chamber
03/18/2010WO2010030493A2 Transistor with a passive gate and methods of fabricating the same
03/18/2010WO2010030484A2 Methods utilizing microwave radiation during formation of semiconductor constructions
03/18/2010WO2010030468A1 Self-aligned trench formation
03/18/2010WO2010030438A1 Stencil, stencil design system and method for cell projection particle beam lithography
03/18/2010WO2010030162A2 Improved capacitive sensor and method for making the same
03/18/2010WO2010030102A2 Electrostatic chuck (esc) comprising a double buffer layer (dbl) to reduce thermal stress
03/18/2010WO2010030101A2 Electrostatic chuck comprising a double buffer layer (dbl) to reduce thermal stress
03/18/2010WO2010030068A1 Method for phase transition of amorphous material
03/18/2010WO2010030052A1 Cleaning jig of capillary for wire bonding, cleaning device of capillary for wire bonding, method for fabricating thereof and method for cleaning using the same
03/18/2010WO2010029982A1 Radiation-sensitive resin composition, and resist pattern formation method
03/18/2010WO2010029907A1 Resist processing method and use of positive resist composition
03/18/2010WO2010029885A1 Semiconductor device and manufacturing method thereof
03/18/2010WO2010029866A1 Display device
03/18/2010WO2010029865A1 Display device
03/18/2010WO2010029859A1 Semiconductor device and method for manufacturing the same
03/18/2010WO2010029836A1 Method for smoothing optical member for euvl and optical member for euvl having smoothed optical surface
03/18/2010WO2010029819A1 Semiconductor device and method for manufacturing same
03/18/2010WO2010029790A1 Bonding method、bonding device, and method of manufacturing the same
03/18/2010WO2010029776A1 Silicon carbide semiconductor device and process for producing the silicon carbide semiconductor device
03/18/2010WO2010029775A1 Nitride semiconductor optical device, epitaxial wafer for nitride semiconductor optical device, and method for manufacturing semiconductor light-emitting device
03/18/2010WO2010029772A1 Test device and test method
03/18/2010WO2010029725A1 Magnetic shield system and magnetic shield method
03/18/2010WO2010029720A1 Nitride semiconductor light emitting element and method for manufacturing same
03/18/2010WO2010029718A1 Method and device for plasma processing
03/18/2010WO2010029708A1 Method and device for synthesizing panorama image using scanning charged-particle microscope
03/18/2010WO2010029702A1 Method for manufacturing magnetoresistive element, and storage medium used in the manufacturing method
03/18/2010WO2010029701A1 Magnetoresistive element, method for manufacturing same, and storage medium used in the manufacturing method
03/18/2010WO2010029700A1 Charged particle beam device
03/18/2010WO2010029681A1 Semiconductor device and method for manufacturing the same
03/18/2010WO2010029672A1 Semiconductor device having electrostatic discharge protection circuit
03/18/2010WO2010029659A1 Semiconductor device and method for manufacturing the same
03/18/2010WO2010029655A1 Semiconductor device
03/18/2010WO2010029618A1 Memory device, method for manufacturing memory device, and method for writing data
03/18/2010WO2010029169A1 Solder material comprising a reactive filler material, carrier element or component comprising said type of solder material and use of a fluxing agent
03/18/2010WO2010029138A2 Method of etching using a multilayer masking structure
03/18/2010WO2010029075A1 Rotatable, heatable placement tool and chip mounting system comprising such a placement tool
03/18/2010WO2010028885A1 Electronic component and method for the production thereof
03/18/2010WO2010014399A3 Chamber plasma-cleaning process scheme
03/18/2010WO2010011842A3 Bonded intermediate substrate and method of making same
03/18/2010WO2010009048A3 Tube diffuser for load lock chamber
03/18/2010WO2010008747A3 Big foot lift pin
03/18/2010WO2010008721A3 Substrate temperature measurement by infrared transmission in an etch process
03/18/2010WO2010006107A3 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
03/18/2010WO2010002694A3 Selective formation of dielectric etch stop layers
03/18/2010WO2009155166A3 Techniques for measuring ion beam emittance
03/18/2010WO2009155157A3 Methods of forming buffer layer architecture on silicon and structures formed thereby
03/18/2010WO2009154890A3 Method for defining regions of differing porosity of a nitrocellulose film on a substrate
03/18/2010WO2009152127A3 Techniques for providing a multimode ion source
03/18/2010WO2009151984A3 Referenced inspection device
03/18/2010WO2009148859A3 Method and apparatus for uv curing with water vapor
03/18/2010WO2009148678A3 Optical cavity furnace for semiconductor wafer processing
03/18/2010WO2009141678A3 Mos device with integrated schottky diode in active region contact trench
03/18/2010WO2009140395A3 Semiconductor for use in harsh environments
03/18/2010WO2009134588A3 Nonplanar faceplate for a plasma processing chamber
03/18/2010WO2009131825A4 Adhesion and electromigration improvement between dielectric and conductive layers
03/18/2010WO2009126922A3 Methods and apparatus for recovery of silicon and silicon carbide from spent wafer-sawing slurry
03/18/2010WO2009126576A3 Lower liner with integrated flow equalizer and improved conductance
03/18/2010WO2009082109A8 Process monitoring apparatus and method
03/18/2010WO2009020572A8 Stack packages using reconstituted wafers
03/18/2010WO2009011696A8 A device and method for reparing a microelectromechanical system
03/18/2010WO2008106244A3 Strained metal gate structure for cmos devices
03/18/2010WO2008057616A8 Antimony and germanium complexes useful for cvd/ald of metal thin films
03/18/2010US20100070069 Microplate handling systems and related computer program products and methods
03/18/2010US20100068898 Managing thermal budget in annealing of substrates
03/18/2010US20100068897 Dielectric treatment platform for dielectric film deposition and curing
03/18/2010US20100068896 Method of processing substrate
03/18/2010US20100068895 Substrate processing apparatus and substrate processing method
03/18/2010US20100068894 forming semiconductors from silicon-containing precursors and forming silicon-containing films, e.g., films including silicon carbonitride and silicon oxycarbonitride, on a substrate using low temperature (T<550 degrees C.) chemical vapor deposition (CVD) processes
03/18/2010US20100068893 Film deposition apparatus, film deposition method, and computer readable storage medium
03/18/2010US20100068892 Substrate processing method
03/18/2010US20100068891 Method of forming barrier film
03/18/2010US20100068890 Printable medium for etching oxidic, transparent and conductive layers
03/18/2010US20100068889 Particle-containing etching pastes for silicon surfaces and layers
03/18/2010US20100068888 Dry etching method
03/18/2010US20100068887 Plasma reactor with adjustable plasma electrodes and associated methods
03/18/2010US20100068886 Method of fabricating a differential doped solar cell
03/18/2010US20100068885 Sidewall forming processes
03/18/2010US20100068884 Method of etching a layer of a semiconductor device using an etchant layer
03/18/2010US20100068883 Cmp slurry composition for forming metal wiring line
03/18/2010US20100068882 Semiconductor Device and Method for Manufacturing the Same
03/18/2010US20100068881 Method of forming metallization in a semiconductor device using selective plasma treatment
03/18/2010US20100068880 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
03/18/2010US20100068879 Contact for memory cell