| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/01/2010 | US20100081295 Process model evaluation method, process model generation method and process model evaluation program |
| 04/01/2010 | US20100081294 Pattern data creating method, pattern data creating program, and semiconductor device manufacturing method |
| 04/01/2010 | US20100081293 Methods for forming silicon nitride based film or silicon carbon based film |
| 04/01/2010 | US20100081292 Gas treatment method and computer readable storage medium |
| 04/01/2010 | US20100081291 Very Low Dielectric Constant Plasma-Enhanced CVD Films |
| 04/01/2010 | US20100081290 Method of forming a gate dielectric by in-situ plasma |
| 04/01/2010 | US20100081289 Method of depositing materials on a non-planar surface |
| 04/01/2010 | US20100081288 Substrate processing apparatus and semiconductor device producing method |
| 04/01/2010 | US20100081287 Dry etching method |
| 04/01/2010 | US20100081286 Method of etching carbon-containing layer, method of forming contact hole using the same, and method of manufacturing semiconductor device using the same |
| 04/01/2010 | US20100081285 Apparatus and Method for Improving Photoresist Properties |
| 04/01/2010 | US20100081284 Methods and apparatus for improving flow uniformity in a process chamber |
| 04/01/2010 | US20100081283 Method for manufacturing semiconductor device |
| 04/01/2010 | US20100081282 Process for adjusting the size and shape of nanostructures |
| 04/01/2010 | US20100081281 Abrasive compositions for chemical mechanical polishing and methods for using same |
| 04/01/2010 | US20100081280 Method of producing a mixed substrate |
| 04/01/2010 | US20100081279 Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices |
| 04/01/2010 | US20100081278 Methods for Nanoscale Feature Imprint Molding |
| 04/01/2010 | US20100081277 Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device |
| 04/01/2010 | US20100081276 Method for forming cobalt tungsten cap layers |
| 04/01/2010 | US20100081275 Method for forming cobalt nitride cap layers |
| 04/01/2010 | US20100081274 Method for forming ruthenium metal cap layers |
| 04/01/2010 | US20100081273 Method for fabricating conductive pattern |
| 04/01/2010 | US20100081272 Methods of Forming Electrical Interconnects Using Electroless Plating Techniques that Inhibit Void Formation |
| 04/01/2010 | US20100081271 Method of forming a diffusion barrier and adhesion layer for an interconnect structure |
| 04/01/2010 | US20100081270 Method and Apparatus for Strapping Two Polysilicon Lines in a Semiconductor Integrated Circuit Device |
| 04/01/2010 | US20100081269 Method for manufacturing semiconductor device having electrode for external connection |
| 04/01/2010 | US20100081268 Damascene process for carbon memory element with miim diode |
| 04/01/2010 | US20100081267 Method for forming self-aligned dielectric cap above floating gate |
| 04/01/2010 | US20100081266 Semiconductor memory integrated circuit and its manufacturing method |
| 04/01/2010 | US20100081265 Method for manufacturing semiconductor device |
| 04/01/2010 | US20100081264 Methods for simultaneously forming n-type and p-type doped regions using non-contact printing processes |
| 04/01/2010 | US20100081262 Method for forming metal gates in a gate last process |
| 04/01/2010 | US20100081261 Method of fabricating silicon carbide (SiC) layer |
| 04/01/2010 | US20100081260 Method for forming a semiconductor film |
| 04/01/2010 | US20100081259 Dislocation engineering using a scanned laser |
| 04/01/2010 | US20100081258 die bonding a semiconductor chip onto an adherent substrate and a lead frame; dicing die-bonding film; excellent adhesion and has preferable peel/pickup properties; surface free energy before heat curing is 37 mJ/m.sup.2 or more and less than 40 mJ/m2; 15 to 30% thermoplastic and 60 to 70% thermosetting |
| 04/01/2010 | US20100081257 Dice by grind for back surface metallized dies |
| 04/01/2010 | US20100081256 Method for producing group III nitride compound semiconductor element |
| 04/01/2010 | US20100081255 Methods for reducing defects through selective laser scribing |
| 04/01/2010 | US20100081254 Method for manufacturing soi substrate and method for manufacturing single crystal semiconductor layer |
| 04/01/2010 | US20100081253 Method for manufacturing semiconductor substrate |
| 04/01/2010 | US20100081252 Method for manufacturing semiconductor device |
| 04/01/2010 | US20100081251 Method for manufacturing soi substrate |
| 04/01/2010 | US20100081250 Semiconductor device having an oxide film formed on a semiconductor substrate sidewall of an element region and on a sidewall of a gate electrode |
| 04/01/2010 | US20100081249 Method to reduce leakage in a protection diode structure |
| 04/01/2010 | US20100081248 Method for manufacturing semiconductor device |
| 04/01/2010 | US20100081247 Semiconductor device and method for manufacturing the same |
| 04/01/2010 | US20100081246 Method of manufacturing a semiconductor |
| 04/01/2010 | US20100081245 Methods for fabricating mos devices having highly stressed channels |
| 04/01/2010 | US20100081244 Transistor device comprising an asymmetric embedded semiconductor alloy |
| 04/01/2010 | US20100081243 Method for manufacturing semiconductor device |
| 04/01/2010 | US20100081242 Methods Of Forming DRAM Arrays |
| 04/01/2010 | US20100081241 Semiconductor device and fabrication method therefor, capacitive element and fabrication method therefor, and mis type semiconductor device and fabrication method therefor |
| 04/01/2010 | US20100081240 Semiconductor device and method of manufacturing semiconductor device |
| 04/01/2010 | US20100081239 Efficient Body Contact Field Effect Transistor with Reduced Body Resistance |
| 04/01/2010 | US20100081238 Mixed-scale electronic interface |
| 04/01/2010 | US20100081237 Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device |
| 04/01/2010 | US20100081236 Method of manufacturing semiconductor device with embedded interposer |
| 04/01/2010 | US20100081235 Method for manufacturing rf powder |
| 04/01/2010 | US20100081234 Method of forming a package with exposed component surfaces |
| 04/01/2010 | US20100081233 Method of manufacturing integrated circuit having stacked structure and the integrated circuit |
| 04/01/2010 | US20100081232 Layer transfer process and functionally enhanced integrated circuits produced thereby |
| 04/01/2010 | US20100081231 Method for forming semiconductor thin film and method for manufacturing electronic device |
| 04/01/2010 | US20100081229 Method of assembling integrated circuit components |
| 04/01/2010 | US20100081227 Luminous device and method of manufacturing the same |
| 04/01/2010 | US20100081226 A method of growing semiconductor heterostructures based on gallium nitride |
| 04/01/2010 | US20100081225 Mask pattern for selective area growth of semiconductor layer and selective area growth method using the mask pattern for semiconductor layer |
| 04/01/2010 | US20100081224 Method of forming diffraction grating and method of fabricating distributed feedback laser diode |
| 04/01/2010 | US20100081223 Array substrate for a reflective liquid crystal display device and manufacturing method for the same |
| 04/01/2010 | US20100081222 Array substrate for a liquid crystal display device having multi-layered metal line and fabricating method thereof |
| 04/01/2010 | US20100081220 Method for manufacturing light-emitting diode |
| 04/01/2010 | US20100081219 Method of manufacturing a semiconductor device |
| 04/01/2010 | US20100081217 Defect inspection apparatus, defect inspection method, and semiconductor device manufacturing method |
| 04/01/2010 | US20100081094 Mask pattern forming method, fine pattern forming method, and film deposition apparatus |
| 04/01/2010 | US20100081069 preparing a plate-like substrate with a rectangular main surface, forming a marker for identifying the substrate on each of at least a plurality of end faces among four end faces of the substrate, the four end faces continuous with sides of the main surface; avoiding defective portion; semiconductors |
| 04/01/2010 | US20100081067 Mask blank substrate set and mask blank set |
| 04/01/2010 | US20100080680 Substrate conveying arm |
| 04/01/2010 | US20100080673 Transporting device for a vacuum processing apparatus, drive device for a component of a vacuum processing apparatus, and a vacuum processing apparatus |
| 04/01/2010 | US20100080672 Direct loading to and from a conveyor system |
| 04/01/2010 | US20100080671 Setup method of substrate processing apparatus |
| 04/01/2010 | US20100080647 Manufacturing method of semiconductor device and manufacturing method of mask |
| 04/01/2010 | US20100080444 Processing apparatus, processing method, method of recognizing target object and storage medium |
| 04/01/2010 | US20100079957 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing |
| 04/01/2010 | US20100079924 Method of patterning a metal on a vertical sidewall of an excavated feature, method of forming an embedded MIM capacitor using same, and embedded memory device produced thereby |
| 04/01/2010 | US20100079651 Image sensor and method for manufacturing the same |
| 04/01/2010 | US20100079640 Image Sensor and Method For Manufacturing the Same |
| 04/01/2010 | US20100079635 Optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device |
| 04/01/2010 | US20100079246 Integrated circuit with a rectifier element |
| 04/01/2010 | US20100079200 Process/design methodology to enable high performance logic and analog circuits using a single process |
| 04/01/2010 | US20100079063 Organic EL Display Panel and Method of Manufacturing the Same |
| 04/01/2010 | US20100078865 Sheet clamping apparatus |
| 04/01/2010 | US20100078834 Semiconductor Device and Method of Forming a Protective Layer on a Backside of the Wafer |
| 04/01/2010 | US20100078833 Circuit device and method of manufacturing the same |
| 04/01/2010 | US20100078832 Sensor node module |
| 04/01/2010 | US20100078831 Integrated circuit package system with singulation process |
| 04/01/2010 | US20100078829 Stacked device conductive path connectivity |
| 04/01/2010 | US20100078828 Integrated circuit package system with mounting structure |
| 04/01/2010 | US20100078827 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
| 04/01/2010 | US20100078826 Substrate package with through holes for high speed i/o flex cable |