Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2010
03/31/2010CN101689565A 半导体元件 Semiconductor device
03/31/2010CN101689564A Hetero-structure field effect transistor, integrated circuit including a hetero-structure field effect transistor and method for manufacturing a hetero-structure field effect transistor
03/31/2010CN101689559A Organic el display panel and manufacturing method thereof
03/31/2010CN101689551A Method of fabricating a self-aligning damascene memory structure
03/31/2010CN101689547A Memory device and its reading method
03/31/2010CN101689546A Power semiconductor device, power semiconductor device manufacturing method, and motor drive device
03/31/2010CN101689540A methods for manufacturing integrated circuits
03/31/2010CN101689538A Method for the production of a rigid power module
03/31/2010CN101689532A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/31/2010CN101689531A Laser processing of light reflective multilayer target structure
03/31/2010CN101689530A Method for recycling a substrate, laminated water fabricating method and suitable recycled donor substrate
03/31/2010CN101689529A techniques for handling substrates
03/31/2010CN101689528A Substrate treatment apparatus, substrate treatment method and storage medium
03/31/2010CN101689527A Integrated circuits on a wafer and method of producing integrated circuits
03/31/2010CN101689526A Apparatus for object processing
03/31/2010CN101689525A Vacuum transportation device
03/31/2010CN101689524A Device and method for exposing wafers to a liquid
03/31/2010CN101689523A Method for manufacturing electronic device, method for manufacturing epitaxial substrate, iii nitride semiconductor element and gallium nitride epitaxial substrate
03/31/2010CN101689522A Testing apparatus
03/31/2010CN101689521A Method and apparatus for monitoring vias in a semiconductor fab
03/31/2010CN101689520A Electronic assemblies without solder and methods for their manufacture
03/31/2010CN101689519A Bonding wire for semiconductor devices
03/31/2010CN101689518A Adhesive for circuit member connection
03/31/2010CN101689517A Semiconductor device bonding wire and wire bonding method
03/31/2010CN101689516A Semiconductor element mounting structure, method for manufacturing the semiconductor element mounting structure, semiconductor element mounting method and pressurizing tool
03/31/2010CN101689515A Under bump metallization structure having a seed layer for electroless nickel deposition
03/31/2010CN101689514A Method for packaging semiconductor
03/31/2010CN101689513A Multifunctional die attachment film and semiconductor packaging method using the same
03/31/2010CN101689512A Component placing apparatus
03/31/2010CN101689511A Substrate for the epitaxial growth of gallium nitride
03/31/2010CN101689510A Semiconductor device, semiconductor device manufacturing method, display device and display device manufacturing method
03/31/2010CN101689509A Method for forming a dual metal gate structure
03/31/2010CN101689508A Method for forming a dual metal gate structure
03/31/2010CN101689507A An extended drain transistor and a method of manufacturing the same
03/31/2010CN101689506A Semiconductor device with stressors and methods thereof
03/31/2010CN101689505A Substrate heating apparatus
03/31/2010CN101689504A Suppression of oxygen precipitation in heavily doped single crystal silicon substrates
03/31/2010CN101689503A intermetallic conductors
03/31/2010CN101689502A Cu wiring film
03/31/2010CN101689501A Lubricating oil composition for buffer
03/31/2010CN101689500A Film forming apparatus and film forming method
03/31/2010CN101689499A Vaporizer and film forming apparatus
03/31/2010CN101689498A Plasma processing with enhanced charge neutralization and process control
03/31/2010CN101689497A Plasma monitoring device and method
03/31/2010CN101689496A Ashing apparatus
03/31/2010CN101689495A Polishing apparatus
03/31/2010CN101689494A Polishing liquid for metal film and polishing method
03/31/2010CN101689493A Polishing composition and method for manufacturing semiconductor integrated circuit device
03/31/2010CN101689492A Apparatus and method for processing a substrate edge region
03/31/2010CN101689491A Apparatus and method for drying substrates
03/31/2010CN101689490A Filming method, and treating system
03/31/2010CN101689489A Silicide forming method and system thereof
03/31/2010CN101689488A Cathode having electron production and focusing grooves, ion source and related method
03/31/2010CN101689487A Diffusion control in heavily doped substrates
03/31/2010CN101689486A Placement table structure and heat treatment device
03/31/2010CN101689485A Laminated film manufacturing method, semiconductor device manufacturing method, semiconductor device and display device
03/31/2010CN101689484A Single crystal growth on a mis-matched substrate
03/31/2010CN101689483A Nitride semi-conductor component layer structure on a group IV substrate surface
03/31/2010CN101689482A Method of providing patterned embedded conducive layer using laser aided etching of dielectric build-up layer
03/31/2010CN101689481A Stage for substrate temperature control unit
03/31/2010CN101689480A System for continuously using resist stripper liquid based on nanofiltration
03/31/2010CN101689479A Semiconductor device and its manufacturing method
03/31/2010CN101689478A Soi wafer manufacturing method
03/31/2010CN101689477A Method and apparatus for dispensing a viscous material on a substrate
03/31/2010CN101689426A Thermally imageable dielectric layers, thermal transfer donors and receivers
03/31/2010CN101689412A Insulating film material, multilayer wiring board and process for producing the multilayer wiring board, and semiconductor apparatus and process for producing the semiconductor device
03/31/2010CN101689411A Organic insulating material, varnish for organic insulating film using the same, organic insulating film and semiconductor device
03/31/2010CN101689410A Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
03/31/2010CN101689409A Anisotropic conductive material, connected structure, and production method thereof
03/31/2010CN101688325A Mg-containing Zno mixed single crystal, laminate thereof and their production methods
03/31/2010CN101688307A Device for coating substrates disposed on a susceptor
03/31/2010CN101688303A Vacuum processing system
03/31/2010CN101688300A Method in depositing metal oxide materials
03/31/2010CN101688296A Vacuum processing system and substrate transfer method
03/31/2010CN101688295A Electrostatic chuck with separated electrodes
03/31/2010CN101688104A Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these
03/31/2010CN101688099A Adhesive composition, film-like adhesive, and connection structure for circuit member
03/31/2010CN101688086A Base material with junction film, method of joining and junction structure
03/31/2010CN101688085A Base material with junction film, method of joining and junction structure
03/31/2010CN101688084A Junction structure and method of joining
03/31/2010CN101687992A Diamine compound, polyamic acid, soluble polyimide, composition, wettability changing film, electrode, and method of manufacturing a wettability changing film
03/31/2010CN101687980A Heat curable resin compositon
03/31/2010CN101687781A Compound for photoacid generator, resist composition using the same, and pattern-forming method
03/31/2010CN101687696A Method for removing foreign matter from glass substrate surface and method for processing glass substrate surface
03/31/2010CN101687694A Mechanically flexible and durable substrates and method of making
03/31/2010CN101687409A Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming
03/31/2010CN101687322A Gripper, in particular a bernoulli gripper
03/31/2010CN101687307A Stacked polishing pad for high temperature applications
03/31/2010CN101687306A Multi-wire saw and method of cutting ingot
03/31/2010CN101687305A Polishing apparatus and polishing method
03/31/2010CN101687304A polishing apparatus
03/31/2010CN101687277A Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
03/31/2010CN101687276A Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
03/31/2010CN101687228A Cleaning process and apparatus
03/31/2010CN101687214A Coat film forming method and coat film forming apparatus
03/31/2010CN101687154A Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus
03/31/2010CN101686626A Composite type radiator, manufacturing method and application thereof
03/31/2010CN101686612A Manufacture of a layer including a component
03/31/2010CN101686611A Multilayer circuit board, manufacture method thereof and communication equipment
03/31/2010CN101685847A Light emitting device and manufacturing method therefor