Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/22/2010EP2264751A1 SOI semiconductor product with backgate connection on the upper side and method for producing same
12/22/2010EP2264750A1 Article transportation facility
12/22/2010EP2264749A2 Automatic storage system
12/22/2010EP2264748A2 Electric component mounting apparatus
12/22/2010EP2264747A2 Method of making a high-voltage transistor
12/22/2010EP2264746A2 Method of making a high-voltage field-effect transistor
12/22/2010EP2264745A2 Apparatus having integrated circuits made of TFT devices, and methods of manufacture thereof
12/22/2010EP2264744A1 Dipping solution for use in production of siliceous film and process for producing siliceous film using the dipping solution
12/22/2010EP2264743A1 Group iii nitride semiconductor element and epitaxial wafer
12/22/2010EP2264742A1 Method for transferring a thin layer to a target substrate having a different thermal expansion coefficient to that of the thin layer
12/22/2010EP2264741A2 Silicon carbide dimpled substrate
12/22/2010EP2264740A1 DRAM cell with magnetic capacitor
12/22/2010EP2264739A2 Drive system for ion scanning a workpiece
12/22/2010EP2264714A1 Unit cell of nonvolatile memory device and nonvolatile memory device with the same
12/22/2010EP2264600A2 Enhanced embedded logic analyzer
12/22/2010EP2264599A2 Enhanced embedded logic analyzer
12/22/2010EP2264598A2 Enhanced embedded logic analyzer
12/22/2010EP2264558A2 Method of controlling operation of a processing system
12/22/2010EP2264527A1 Method for processing work having photoresist layer
12/22/2010EP2264524A2 High-resolution overlay alignement methods and systems for imprint lithography
12/22/2010EP2264523A2 A method of forming a pattern on a substrate in imprint lithographic processes
12/22/2010EP2264522A2 Method of forming a pattern on a substrate
12/22/2010EP2264511A1 Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method
12/22/2010EP2264223A2 Micropipe-free silicon carbide and related method of manufacture
12/22/2010EP2264219A1 Material for chemical vapor deposition, silicon-containing insulating film and process for production thereof
12/22/2010EP2264218A1 Precursors for cvd silicon carbo-nitride films
12/22/2010EP2264215A2 Copper alloy sputtering target, process for producing the same and semiconductor element wiring
12/22/2010EP2264113A2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive
12/22/2010EP2264112A2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive
12/22/2010EP2264007A1 Novel salt having fluorine-containing carbanion structure, derivative thereof, photoacid generator, resist material using the photoacid generator, and pattern forming method
12/22/2010EP2263792A1 Surface treatment apparatus
12/22/2010EP2263663A1 Compositions comprising curcuminoids and either alpha or beta acids for use in the treatment of diabetes
12/22/2010EP2263271A1 Method of forming a magnetic tunnel junction structure
12/22/2010EP2263259A2 High aspect ratio openings
12/22/2010EP2263255A1 Process for adjusting the coefficient of friction and/or adhesion between surfaces of two solid objects
12/22/2010EP2263254A1 Dual gate lateral diffused mos transistor
12/22/2010EP2263253A2 Method for forming porous material in microcavity or micropassage by mechanochemical polishing
12/22/2010EP2263252A1 Methods for etching carbon nano-tube films for use in non-volatile memories
12/22/2010EP2263251A1 Method of transfer using a ferroelectric substrate
12/22/2010EP2263120A1 Low chlorine epoxy resin formulations
12/22/2010EP1846321B1 Method of fabricating a silicon-on-insulator structure
12/22/2010EP1617533B1 Method of manufacturing a semiconductor device
12/22/2010EP1609196B1 Organic semiconductor device
12/22/2010EP1507888B1 Plasma-enhanced chemical vapour deposition method for depositing silicon nitride or silicon oxynitrid in an mim-capacitor
12/22/2010EP1472916B1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
12/22/2010EP1425802B1 Power mosfet having a trench gate electrode and method of making the same
12/22/2010EP1208589B1 Method for treating substrates for microelectronics
12/22/2010EP1200988B1 Method for milling a target area in a charged particle beam system
12/22/2010CN201681943U Automobile rectifying bridge diode
12/22/2010CN201681939U Junction gate field-effect twin-transistor
12/22/2010CN201681938U Non-paddle multiturn pin passive device packaging structure
12/22/2010CN201681937U Packaging structure of passive component of electrostatic release ring with no basic island
12/22/2010CN201681936U Passive component packaging structure without substrate
12/22/2010CN201681935U Non-paddle multiturn pin static release ring passive device packaging structure
12/22/2010CN201681934U Encapsulating structure for passive device with base island and multi-ring pins
12/22/2010CN201681933U Pin-type packaging structure with direct placement of chip and reactive device
12/22/2010CN201681930U Encapsulation structure for passive device with multiple base-island embedded multi-turn pins
12/22/2010CN201681924U Exposing type passive-component packaging structure of base island
12/22/2010CN201681920U Multi-salient-point base island embedded type base island multi-circle pin and passive device packaging structure
12/22/2010CN201681919U Multi-salient-point base-island exposed and embedded base-island multi-circle pin packaging structure
12/22/2010CN201681918U Packaging structure for passive device with multi-salient point exposed bases and embedded bases
12/22/2010CN201681917U Multi-convex-point base island exposing and embedding type base island single-ring pin encapsulating structure
12/22/2010CN201681916U Package structure of base-sunken and multi-projection base-bared type multi-pin passive elements
12/22/2010CN201681915U Sunk substrate exposure-type and multi-emboss substrate exposure-type multiturn pin packaging structure
12/22/2010CN201681914U Packaging structure of sinkage base and multi-projection base bared passive device
12/22/2010CN201681913U Sinking pad exposed type and multi-bump pad exposed type single ring pin package structure
12/22/2010CN201681912U Sunken pad exposed-type and embedded-type pad multi-turn pin passive device packaging structure
12/22/2010CN201681911U Sunken base island exposing and embedding type base island multi-ring pin encapsulating structure
12/22/2010CN201681910U Sunken base island exposing and embedding type base island passive device encapsulating structure
12/22/2010CN201681908U Insular base exposure and multi-convex-point insular base exposure type multi-circle lead foot passive device packaging structure
12/22/2010CN201681907U Substrate-exposed and multi-projection-substrate-exposed type packaging structure with multiple circles of pins
12/22/2010CN201681906U Base island exposed and multi-bump base island exposed single-circle pin passive device encapsulation structure
12/22/2010CN201681905U Substrate-exposed and multi-projection-substrate-exposed type packaging structure
12/22/2010CN201681904U Base island exposed type and embedded type base island multi-circle pin passive device encapsulating structure
12/22/2010CN201681903U Encapsulation structure of base-island exposed and sinking base-island exposed passive device
12/22/2010CN201681902U Substrate-exposed and sunken-substrate-exposed type packaging structure with multiple circles of pins
12/22/2010CN201681901U Exposed base and exposed sinking-base multi-circle pin passive device packaging structure
12/22/2010CN201681900U Exposing type and embedded type base-island packaging structure
12/22/2010CN201681899U Island exposing and embedding and base-island passive device encapsulating structure
12/22/2010CN201681898U Base island and sunken base island exposing type encapsulating structure
12/22/2010CN201681896U No-paddle dap packaging structure
12/22/2010CN201681894U Substrate-free lead frame structure with multiple circles of pins
12/22/2010CN201681893U Lead frame structure with base islands
12/22/2010CN201681892U Basic island packaging structure
12/22/2010CN201681891U Direct-chip-placing multi-turn pin type encapsulation structure
12/22/2010CN201681890U Lead frame structure for direct placement by chip
12/22/2010CN201681889U Sinking base island exposed and embedded base island multi-circle pin lead frame structure
12/22/2010CN201681888U Base island lead wire frame structure with exposed type or embedded type sinking base island
12/22/2010CN201681887U Sunken substrate exposed type and multi-bump substrate exposed type lead frame structure with multiple circles of pins
12/22/2010CN201681886U Sunken-substrate-exposed and multi-projection-substrate-exposed type lead frame structure
12/22/2010CN201681885U Substrate embedded and multi-bump-substrate exposed type lead frame structure with multiple circles of pins
12/22/2010CN201681884U Embedded type base island and multi-convex-point base island lead wire frame structure
12/22/2010CN201681883U Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures
12/22/2010CN201681882U Substrate-exposed and sunken-substrate-exposed type lead frame structure
12/22/2010CN201681880U Base island exposed type and embedded type base island lead frame structure
12/22/2010CN201681879U Base island exposure type and multi-bump base island exposure type multi-circle pin lead frame structure
12/22/2010CN201681878U Base-island exposing type and multi-protruding-point base-island exposing lead frame structures
12/22/2010CN201681877U Sinking base island exposed encapsulation structure
12/22/2010CN201681876U Packaging structure with exposed multiple-salient point bases
12/22/2010CN201681874U Insular base exposure type packaging structure
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