Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/30/2010US20100328446 Method and apparatus for inspecting pattern defects
12/30/2010US20100328290 Liquid crystal display and method of manufacturing the same
12/30/2010US20100328288 Semiconductor integrated circuit and method of driving the same
12/30/2010US20100328028 Flexible semiconductor device and identification label
12/30/2010US20100328022 Method for fabricating metal gate and polysilicon resistor and related polysilicon resistor structure
12/30/2010US20100327980 Heterojunction bipolar transistor and method for manufacturing the same, and power amplifier using the same
12/30/2010US20100327911 Semiconductor Device and a Display Device
12/30/2010US20100327902 Power saving termination circuits for dram modules
12/30/2010US20100327863 Device for transporting magnetic head, device for inspecting magnetic head, and method for manufacturing magnetic head
12/30/2010US20100327783 Staggered composition quantum well method and device
12/30/2010US20100327466 Technique for fabricating microsprings on non-planar surfaces
12/30/2010US20100327465 Package process and package structure
12/30/2010US20100327464 Layered chip package
12/30/2010US20100327461 Electrical interconnect for die stacked in zig-zag configuration
12/30/2010US20100327455 Semiconductor device including two heat sinks and method of manufacturing the same
12/30/2010US20100327453 Semiconductor Device and Method of Manufacturing the Same
12/30/2010US20100327452 Mounting structure and method of manufacturing the same
12/30/2010US20100327450 Semiconductor device bonding wire and wire bonding method
12/30/2010US20100327449 Semiconductor device and manufacturing method of semiconductor device
12/30/2010US20100327448 Semiconductor with Bottom-Side Wrap-Around Flange Contact
12/30/2010US20100327447 Method of manufacturing semiconductor device and semiconductor device
12/30/2010US20100327446 Via gouged interconnect structure and method of fabricating same
12/30/2010US20100327445 Structure of power grid for semiconductor devices and method of making the same
12/30/2010US20100327444 Sheet structure, semiconductor device and method of growing carbon structure
12/30/2010US20100327443 Joining structure and a substrate-joining method using the same
12/30/2010US20100327435 Electronic component and manufacture method thereof
12/30/2010US20100327434 Semiconductor device and method of manufacturing the same
12/30/2010US20100327433 High Density MIM Capacitor Embedded in a Substrate
12/30/2010US20100327429 Semiconductor package structure and package method thereof
12/30/2010US20100327428 Package manufacturing method and semiconductor device
12/30/2010US20100327427 Semiconductor device and method for manufacturing the same
12/30/2010US20100327426 Semiconductor chip package and method of manufacturing the same
12/30/2010US20100327425 Flat chip package and fabrication method thereof
12/30/2010US20100327424 Multi-chip package and method of providing die-to-die interconnects in same
12/30/2010US20100327423 Semiconductor packaging structure and method for manufacturing the same
12/30/2010US20100327422 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
12/30/2010US20100327421 Ic package design with stress relief feature
12/30/2010US20100327420 Semiconductor device with embedded interconnect pad
12/30/2010US20100327419 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
12/30/2010US20100327416 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
12/30/2010US20100327415 Silicon epitaxial wafer and manufacturing method thereof
12/30/2010US20100327414 Method For Producing A Semiconductor Wafer
12/30/2010US20100327413 Hardmask open and etch profile control with hardmask open
12/30/2010US20100327412 Method of semiconductor manufacturing for small features
12/30/2010US20100327410 Semiconductor device having a high aspect cylindrical capacitor and method for fabricating the same
12/30/2010US20100327409 Semiconductor device comprising capacitive element
12/30/2010US20100327407 Interconnection wiring structure of a semiconductor device and method for manufacturing same
12/30/2010US20100327406 Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
12/30/2010US20100327405 Electrical property altering, planar member with solder element in ic chip package
12/30/2010US20100327404 Inductor structures for integrated circuit devices
12/30/2010US20100327403 Semiconductor chip, semiconductor wafer, method of manufacturing semiconductor chip
12/30/2010US20100327402 Fuse structure for high integrated semiconductor device
12/30/2010US20100327399 Electrically programmable fuse using anisometric contacts and fabrication method
12/30/2010US20100327397 Method for manufacturing simox wafer and simox wafer
12/30/2010US20100327396 Pattern structure and method of forming the same
12/30/2010US20100327395 Semiconductor device on direct silicon bonded substrate with different layer thickness
12/30/2010US20100327393 Method and structures for etching cavity in silicon under dielectric membrane
12/30/2010US20100327387 Avalanche Photodiode
12/30/2010US20100327383 Semiconductor device including through-electrode and method of manufacturing the same
12/30/2010US20100327380 Method of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducer
12/30/2010US20100327379 Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps
12/30/2010US20100327377 Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same
12/30/2010US20100327376 Metal High-K Transistor Having Silicon Sidewall For Reduced Parasitic Capacitance, And Process To Fabricate Same
12/30/2010US20100327375 Shallow extension regions having abrupt extension junctions
12/30/2010US20100327374 Low cost transistors using gate orientation and optimized implants
12/30/2010US20100327373 Uniform high-k metal gate stacks by adjusting threshold voltage for sophisticated transistors by diffusing a metal species prior to gate patterning
12/30/2010US20100327372 Semiconductor device and method of fabricating the same
12/30/2010US20100327371 Memory device and method of fabricating the same
12/30/2010US20100327370 Non-planar embedded polysilicon resistor
12/30/2010US20100327368 Enhancing selectivity during formation of a channel semiconductor alloy by a wet oxidation process
12/30/2010US20100327365 Method of manufacturing semiconductor device and semiconductor device
12/30/2010US20100327364 Semiconductor device with metal gate
12/30/2010US20100327363 Semiconductor device and method for fabricating the same
12/30/2010US20100327362 Non-insulating stressed material layers in a contact level of semiconductor devices
12/30/2010US20100327361 Low cost symmetric transistors
12/30/2010US20100327360 FET With Replacement Gate Structure and Method of Fabricating the Same
12/30/2010US20100327358 Semiconductor element formed in a crystalline substrate material and comprising an embedded in situ n-doped semiconductor material
12/30/2010US20100327357 Semiconductor device and method for fabricating the same
12/30/2010US20100327354 Thin film transistor having long lightly doped drain on soi substrate and process for making same
12/30/2010US20100327352 Semiconductor device and method for manufacturing the same
12/30/2010US20100327351 Semiconductor device and method for manufacturing the same
12/30/2010US20100327350 Electronic device including an integrated circuit with transistors coupled to each other
12/30/2010US20100327349 Semiconductor device and method of manufacturing the same
12/30/2010US20100327348 Semiconductor device, method of manufacturing the same and power-supply device using the same
12/30/2010US20100327347 Electronic device including a well region
12/30/2010US20100327346 Semiconductor device and method for forming the same
12/30/2010US20100327341 Nonvolatile semiconductor memory device having charge storage layers and manufacturing method thereof
12/30/2010US20100327339 Nonvolatile semiconductor memory device and method for manufacturing same
12/30/2010US20100327338 Semiconductor memory device including multi-layer gate structure
12/30/2010US20100327337 Semiconductor memory device and method for fabricating the same
12/30/2010US20100327336 Concentric or Nested Container Capacitor Structure for Integrated Circuits
12/30/2010US20100327335 Method of building compensated isolated p-well devices
12/30/2010US20100327334 Floating body memory cell apparatus and methods
12/30/2010US20100327329 Semiconductor device and method of fabricating the same
12/30/2010US20100327323 Three-dimensional nonvolatile memory device and method for fabricating the same
12/30/2010US20100327322 Transistor with Enhanced Channel Charge Inducing Material Layer and Threshold Voltage Control
12/30/2010US20100327319 Control of tunneling junction in a hetero tunnel field effect transistor
12/30/2010US20100327318 Semiconductor device and manufacturing method of the same
12/30/2010US20100327317 Germanium on insulator using compound semiconductor barrier layers
12/30/2010US20100327316 Method for Manufacturing an III-V Engineered Substrate and the III-V Engineered Substrate Thereof
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