Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/29/2010CN1917221B Display substrate, method of manufacturing the same and display device having the same
12/29/2010CN1901209B Thin film transistor array panel and manufacturing method thereof
12/29/2010CN1899003B Etching solution, method of etching and printed wiring board
12/29/2010CN1896877B Decision method and exposure method
12/29/2010CN1896876B Polarized radiation in lithographic apparatus and device manufacturing method
12/29/2010CN1871695B High aspect ratio etch using modulation of RF powers of various frequencies
12/29/2010CN1841200B Salt suitable for acid generator and chemical amplifying type corrosion-resistant composition containing the same
12/29/2010CN1658389B Semiconductor device and method for manufacturing the same
12/29/2010CN101933402A Multiple phase RF power for electrode of plasma chamber
12/29/2010CN101933170A Method for the production of a semiconductor structure
12/29/2010CN101933149A Semiconductor device, and method for manufacturing the same
12/29/2010CN101933148A Semiconductor element and method for manufacturing the same
12/29/2010CN101933147A Power transistor with protected channel
12/29/2010CN101933146A Silicon carbide semiconductor device
12/29/2010CN101933137A Semiconductor storage device
12/29/2010CN101933136A Semiconductor storage device
12/29/2010CN101933135A Semiconductor storage device and memory embedded semiconductor device, and manufacturing method thereof
12/29/2010CN101933134A Semiconductor storage device
12/29/2010CN101933133A A method for fabricating a dual-orientation group-iv semiconductor substrate
12/29/2010CN101933132A Method for fabricating a semiconductor on insulator type substrate
12/29/2010CN101933131A Processing system for fabricating compound nitride semiconductor devices
12/29/2010CN101933130A Defect inspection device and defect inspection method for silicon wafer
12/29/2010CN101933129A Method for manufacturing electronic component device
12/29/2010CN101933128A Component mounting apparatus and method
12/29/2010CN101933127A Methods and compositions for depositing silver onto a metal surface
12/29/2010CN101933126A Fabrication process of semiconductor device
12/29/2010CN101933125A Edge-contacted vertical carbon nanotube transistor
12/29/2010CN101933124A Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
12/29/2010CN101933123A Method of etching asymmetric wafer, solar cell including the asymmetrically etched wafer, and method of manufacturing the same
12/29/2010CN101933122A Load-lock apparatus and substrate cooling method
12/29/2010CN101933121A Substrate supporting unit, substrate processing apparatus, and method of manufacturing substrate supporting unit
12/29/2010CN101933120A Atmosphere cleaning device
12/29/2010CN101933119A Information processing apparatus, information processing method and program
12/29/2010CN101932758A Method for growing alxga1-xn single crystal
12/29/2010CN101932756A Zno-based substrate, method for processing zno-based substrate, and zno-based semiconductor device
12/29/2010CN101932751A Deposition apparatus and deposition method
12/29/2010CN101932750A Vacuum processing apparatus and operating method for vacuum processing apparatus
12/29/2010CN101932663A Conductive inks
12/29/2010CN101932618A Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having insulating film
12/29/2010CN101931035A Separation method of nitride semiconductor layer, semiconductor device, semiconductor wafer, and manufacturing method thereof
12/29/2010CN101931010A 二极管及其制造方法 Diode and its manufacturing method
12/29/2010CN101931009A Thin film transistor and method of producing thin film transistor
12/29/2010CN101931008A PD SOI device with body contact structure
12/29/2010CN101931005A Semiconductor device, method of manufacturing the same and power-supply device using the same
12/29/2010CN101931002A Reverse blocking diode thyristor
12/29/2010CN101931000A Semiconductor device and method for forming same
12/29/2010CN101930998A Bipolar transistor structure and method including emitter-base interface
12/29/2010CN101930996A 半导体结构及其形成方法 And a method for forming a semiconductor structure
12/29/2010CN101930995A Insulated gate bipolar transistor (IGBT) collector electrode made of germanium/aluminum and manufacturing method thereof
12/29/2010CN101930991A Active driving organic electroluminescence device and preparation method thereof
12/29/2010CN101930990A Active driving organic electroluminescent device and preparation method thereof
12/29/2010CN101930989A Phase-change memory and method of making same
12/29/2010CN101930986A Semiconductor device, camera module and method of manufacturing semiconductor device
12/29/2010CN101930981A Dynamic random access memory(DRAM) cell
12/29/2010CN101930980A Semiconductor device having saddle fin-shaped channel and method for manufacturing the same
12/29/2010CN101930979A CMOSFETs structure for controlling threshold voltage of device and manufacturing method thereof
12/29/2010CN101930978A Semiconductor assembly and manufacturing method thereof
12/29/2010CN101930977A Power metal oxide semiconductor field effect transistor (MOSFET) device with tungsten spacing layer in contact hole and preparation method thereof
12/29/2010CN101930975A Optimized configurations to integrate steering diodes in low capacitance transient voltage suppressor (tvs)
12/29/2010CN101930974A Bottom source nmos triggered zener clamp for configuring an ultra-low voltage transient voltage suppressor (tvs)
12/29/2010CN101930973A Electrostatic discharge structures and methods of manufacture
12/29/2010CN101930971A Multi-chip package and method for forming same
12/29/2010CN101930969A Semiconductor package with electromagnetic interference protection cover
12/29/2010CN101930967A Semiconductor device and method of fabricating the same
12/29/2010CN101930966A Circuit layout structure and method for narrowing integrated circuit layout
12/29/2010CN101930965A Structure of power grid for semiconductor devices and method of making the same
12/29/2010CN101930963A Segment difference type ceramic copper-clad plate unit and manufacturing method thereof
12/29/2010CN101930960A Ic chip package and forming method
12/29/2010CN101930959A Copper conductive paste, method of manufacturing substrate with copper conductor filled in through-hole, circuit substrate, electronic component, semiconductor package
12/29/2010CN101930958A Semiconductor packaging element and production method thereof
12/29/2010CN101930957A Power semiconductor device package and fabrication method
12/29/2010CN101930956A Chip packaging structure and manufacturing method thereof
12/29/2010CN101930955A Packaging structure and making method thereof
12/29/2010CN101930952A Compliant multilayered thermally-conductive interface assemblies and memory modules including the same
12/29/2010CN101930949A Method for improving defects of photoresist coating in manufacturing process of flash memory
12/29/2010CN101930948A Method for producing nitride read-only memory
12/29/2010CN101930947A CMOS (Complementary Metal-Oxide-Semiconductor) transistor and making method thereof
12/29/2010CN101930946A Integrated circuit system with high voltage transistor and method of manufacture thereof
12/29/2010CN101930945A Preparation method of DMOS (Domplementary Metal Oxide Semiconductor) with self-aligned channel in BCD (Bipolar CMOS DMOS) process
12/29/2010CN101930944A Method of manufacturing solid state imaging device, and solid state imaging device
12/29/2010CN101930943A Semiconductor device manufacturing method and semiconductor device
12/29/2010CN101930942A Cutting method of semiconductor wafer
12/29/2010CN101930941A Manufacturing method of shallow trench isolation structure
12/29/2010CN101930940A Semiconductor shallow trench isolation method
12/29/2010CN101930939A Semiconductor package case
12/29/2010CN101930938A Method for monitoring uniformity of film thickness
12/29/2010CN101930937A Packaging method of photoelectric component and packaging carrier structure thereof
12/29/2010CN101930936A Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
12/29/2010CN101930935A Lead frame design to improve reliability
12/29/2010CN101930934A Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof
12/29/2010CN101930933A Method for manufacturing semiconductor device
12/29/2010CN101930932A LED light-emitting module processing method
12/29/2010CN101930931A Packaging circuit substrate structure and manufacturing method thereof
12/29/2010CN101930930A Method for forming Cr-Al-Cr metal routing on indium tin oxid glass substrate
12/29/2010CN101930929A Manufacturing method of packaging base plate provided with side surface lines
12/29/2010CN101930928A Manufacturing method of thin base plate for packaging semiconductor
12/29/2010CN101930927A Self-aligned U-shaped groove manufacturing method
12/29/2010CN101930926A LDMOS (Lateral Diffused Metal Oxide Semiconductor) manufacturing method
12/29/2010CN101930925A Method for preparing self-aligned channel-type laterally diffused metal oxide semiconductor
12/29/2010CN101930924A Fabrication method of MOS (Metal Oxide Semiconductor) transistor
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