Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/22/2010CN101925981A Annealing apparatus
12/22/2010CN101925980A CVD apparatus
12/22/2010CN101925979A Method for manufacturing III nitride semiconductor, method for manufacturing III nitride semiconductor light emitting element, III nitride semiconductor light emitting element, and lamp
12/22/2010CN101925978A Processing for bonding two substrates
12/22/2010CN101925977A Apparatus for repairing photomask and repairing method using same
12/22/2010CN101925976A Illuminating apparatus, exposure apparatus, exposure method and device manufacturing method
12/22/2010CN101925862A Lithography robustness monitor
12/22/2010CN101925690A Insulating film material, film forming method using insulating film material, and insulating film
12/22/2010CN101925663A Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device
12/22/2010CN101925526A Substrate detecting apparatus and substrate transfer apparatus
12/22/2010CN101924299A One-touch popping device of memory module test socket
12/22/2010CN101924174A Light emitting device, method of manufacturing the same, light emitting device package, and lighting system
12/22/2010CN101924169A Package structure of optical chip and manufacturing method thereof
12/22/2010CN101924161A Method for manufacturing photodetector and relevant thin film transistor baseplate
12/22/2010CN101924142A GaAs Schottky variable capacitance diode and manufacture method thereof
12/22/2010CN101924139A Strain channel field-effect transistor and preparation method thereof
12/22/2010CN101924138A MOS (Metal Oxide Semiconductor) device structure for preventing floating-body effect and self-heating effect and preparation method thereof
12/22/2010CN101924137A Nano-tubes semiconductor device and preparation method thereof
12/22/2010CN101924135A Semiconductor device, method for manufacturing same, and solid-state image sensing device
12/22/2010CN101924134A Semiconductor device and manufacturing method thereof
12/22/2010CN101924133A Fin FETs and methods for forming the same
12/22/2010CN101924131A Transverse-diffusion MOS (Metal Oxide Semiconductor) device and manufacturing method thereof
12/22/2010CN101924130A Grooved MOSFET with grooved contact hole and preparation method thereof
12/22/2010CN101924129A Field effect transistor
12/22/2010CN101924127A Reduced process sensitivity of electrode-semiconductor rectifiers
12/22/2010CN101924123A Organic light emitting device, display unit including the same, and illuminating device including the same
12/22/2010CN101924122A Active matrix/organic light emitting display and manufacturing method thereof
12/22/2010CN101924121A Active matrix/organic light emitting display and manufacturing method thereof
12/22/2010CN101924120A Organic electroluminescent display device and method of fabricating the same
12/22/2010CN101924118A Controlling the circuitry and memory array relative height in a phase change memory feol process flow
12/22/2010CN101924117A Light emitting device with light emitting cells arrayed
12/22/2010CN101924116A Extensible oversize light-emitting diode (LED) chip and manufacture method thereof
12/22/2010CN101924113A Image sensor and semiconductor manufacture technology
12/22/2010CN101924111A Semiconductor device and method of manufacturing the same
12/22/2010CN101924110A SOI (Silicon On Insulator) transistor structure of body contact and preparation method thereof
12/22/2010CN101924109A Structure and method for improving data storage capability of silicon oxide nitride oxide semiconductor (SONOS) flash memory
12/22/2010CN101924108A Semiconductor memory device and production method therefor
12/22/2010CN101924107A Stress enhanced CMOS (Complementary Metal-Oxide-Semiconductor) transistor structure
12/22/2010CN101924106A Integrated circuit structure
12/22/2010CN101924105A 集成电路结构 Integrated circuit structure
12/22/2010CN101924104A Metal-oxide semiconductor structure and manufacturing method thereof
12/22/2010CN101924103A Groove type power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) and manufacturing method thereof
12/22/2010CN101924101A Structure of semiconductor passive device and making method thereof
12/22/2010CN101924096A Through-silicon via structure and a process for forming the same
12/22/2010CN101924095A Interconnection structure of semiconductor integrated circuit and method for making the same
12/22/2010CN101924094A Semiconductor device and method of manufacturing semiconductor device
12/22/2010CN101924093A Semiconductor device and method of manufacturing semiconductor device
12/22/2010CN101924092A Semiconductor device
12/22/2010CN101924090A 半导体封装元件及其制造方法 Semiconductor package device and manufacturing method
12/22/2010CN101924087A Inversed-chip lug structure and manufacturing process thereof
12/22/2010CN101924085A Circuit device and method for manufacturing the circuit device
12/22/2010CN101924084A Packaged semiconductor piece and production method thereof
12/22/2010CN101924083A Packaged semiconductor and production method thereof
12/22/2010CN101924080A Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module
12/22/2010CN101924078A Method for manufacturing flash memory
12/22/2010CN101924077A Manufacturing method for reducing area of SONOS storage unit
12/22/2010CN101924076A Preparation method of SONOS (Silicon Oxide Nitride Oxide Semiconductor) structure
12/22/2010CN101924075A Flash memory manufacturing method
12/22/2010CN101924074A CMOS (Complementary Metal Oxide Semiconductor) sensor and manufacturing method thereof
12/22/2010CN101924073A CMOS (Complementary Metal-Oxide-Semiconductor Transistor) sensor and manufacture method thereof
12/22/2010CN101924072A Phase change memory having stabilized microstructure and manufacturing method
12/22/2010CN101924071A Active matrix/organic light emitting display and manufacturing method thereof
12/22/2010CN101924070A Active matrix/organic light emitting display and manufacturing method thereof
12/22/2010CN101924069A Preparation method of high-peed and high-density three-dimensional resistance conversion storage structure
12/22/2010CN101924068A Resistance storage and manufacturing method of integrated circuit comprising same
12/22/2010CN101924067A Method for separating flexible membrane from carrier plate and manufacturing method of flexible electronic device
12/22/2010CN101924066A Method for separating flexible substrate from support plate and manufacturing method of flexible electronic device
12/22/2010CN101924065A Method for reducing injury caused by laser peeling
12/22/2010CN101924064A Making method of thin film transistor array substrate
12/22/2010CN101924063A Integrated circuit system employing low-K dielectrics and method of manufacture thereof
12/22/2010CN101924062A Memory device and method for manufacturing an integrated circuit device
12/22/2010CN101924061A Processing method of integrated circuit metal layer
12/22/2010CN101924060A Method for controlling height of holes in dielectric layers between interconnects
12/22/2010CN101924059A Field insulation manufacturing method
12/22/2010CN101924058A Method for reducing chip warpage
12/22/2010CN101924057A Carrier plate and continuous plasma coating device
12/22/2010CN101924056A Dicing tape-integrated film for semiconductor back surface
12/22/2010CN101924055A Dicing tape-integrated film for semiconductor back surface
12/22/2010CN101924054A Method for measuring change of resistance of high-resistance semiconductor substrate with change of thermal budgets
12/22/2010CN101924053A System and method for inspecting a wafer
12/22/2010CN101924052A Method for quickly detecting drift defects of epitaxial patterns
12/22/2010CN101924051A Method and structure for detecting silicon nitride residue after direct chemically mechanical polishing of trench isolation process
12/22/2010CN101924050A Die bonder providing a large bonding force
12/22/2010CN101924049A Fabrication method of semiconductor integrated circuit device
12/22/2010CN101924048A Method of manufacturing electronic component
12/22/2010CN101924047A Semiconductor device and method of manufacturing the same
12/22/2010CN101924046A Method for forming wire bonding in semiconductor device
12/22/2010CN101924045A Method of forming connecting salient points on semiconductor device
12/22/2010CN101924044A Method for producing a high power semiconductor module and high power semiconductor module with a connection device
12/22/2010CN101924043A Method for producing a current converter system with cooling device and a current converter system
12/22/2010CN101924042A Method of forming stacked-die packages
12/22/2010CN101924041A Method for assembling stackable semiconductor packaging
12/22/2010CN101924040A Chip repairing method and chip stack structure
12/22/2010CN101924039A Packaged semiconductor piece and production method thereof
12/22/2010CN101924038A An electronic device package and method of manufacture
12/22/2010CN101924037A Method for manufacturing coreless capsulation substrates
12/22/2010CN101924036A Flat-bottom junction power field effect transistor and manufacturing method thereof
12/22/2010CN101924035A Method of forming a semiconductor device and its gate structure
12/22/2010CN101924034A Method for adjusting threshold voltage of high k gate medium and metal gate structured pMOSFET (p type Metal-Oxide -Semiconductor Field Effect Transistor) apparatus
12/22/2010CN101924033A Method for manufacturing P-channel metal oxide semiconductor (PMOS) of germanium-silicon grid
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