Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/22/2010CN201681873U Multiple base island exposing type single-ring pin packaging structure
12/22/2010CN201681872U Encapsulation structure for multiple base-island exposure type multi-turn pins
12/22/2010CN201681871U Single-base-island exposed type multiple-circle pin packaging structure
12/22/2010CN201681870U Passive device packaging structure with single base island of projection type and multi loop pins
12/22/2010CN201681867U Multi-base island embedded type multi-turn pin encapsulation structure
12/22/2010CN201681866U Multi-base-island embedded type passive device encapsulation structure with single circle of pins
12/22/2010CN201681865U A plurality of base island embedding type pin encapsulating structure
12/22/2010CN201681864U Passive device packaging structure with embedded single base island and multi loop pins
12/22/2010CN201681863U Embedded type single-island multi-circle pin packaging structure
12/22/2010CN201681862U Embedded type island passive device packaging structure
12/22/2010CN201681861U Embedded base island encapsulation structure
12/22/2010CN201681860U Passive device packaging structure with a plurality of multi-protruding-point base islands of projection types and multi loop pins
12/22/2010CN201681859U Encapsulation structure for multiple multi-salient base-island exposure type multi-turn pins
12/22/2010CN201681858U Passive device packaging structure with a plurality of multi-protruding-point base islands of projection types and single loop pins
12/22/2010CN201681857U Multi-salient-point base-island exposed single-circle pin packaging structure
12/22/2010CN201681856U Multi-salient point single base island exposed type multi-circle pin passive device encapsulating structure
12/22/2010CN201681855U Encapsulation structure of exposed passive device with multiple salient-point base islands
12/22/2010CN201681853U Exposed multiple sinking-base multi-circle pin packaging structure
12/22/2010CN201681851U Multiple sinking base island exposing type single-ring pin packaging structure
12/22/2010CN201681849U Sunk single-base-island exposed type multi-ring lead pin encapsulation structure
12/22/2010CN201681848U Sunken-substrate-exposed packaging structure for passive components
12/22/2010CN201681847U Lead frame structure with a plurality of sinking base islands of projection types and single loop pins
12/22/2010CN201681846U Single sinking base island exposing type multi-circle pin lead frame structure
12/22/2010CN201681845U Exposed type lead frame structure of sunken base island
12/22/2010CN201681844U Lead frame structure with multiple exposed bases and multiturn pins
12/22/2010CN201681843U Lead frame structure of exposed single-ring lead feet with multiple base islands
12/22/2010CN201681842U Lead frame structure with single exposed base and multiturn pins
12/22/2010CN201681841U Lead frame structure with exposed base island
12/22/2010CN201681840U Embedded type single-island multi-circle pin packaging structure
12/22/2010CN201681839U Embedded multi-base single circle pin lead frame structure
12/22/2010CN201681838U Embedded type single-base-island multi-circle-lead-pin lead wire frame structure
12/22/2010CN201681837U Lead frame structure with embedded base island
12/22/2010CN201681836U Multi-salient-point and multi-base-island exposing type multi-circle pin and lead frame structure
12/22/2010CN201681834U Lead frame structure for multi-salient single-base-island exposure type multi-turn pins
12/22/2010CN201681833U Multi-convex-point base island exposing type lead frame structure
12/22/2010CN201681832U Lead frame structure with a plurality of sinking base islands of projection types and multi loop pins
12/22/2010CN201681828U Wafer bump structure
12/22/2010CN201681806U Wafer clamp
12/22/2010CN201681805U Device automatically lifting and rotating silicon chips
12/22/2010CN201681804U Auxiliary positioning device
12/22/2010CN201681803U Arc track accurate locating vanning device of deposit tank
12/22/2010CN201681802U Automatic feed mechanism of product
12/22/2010CN201681801U Automatic steering mechanism of product
12/22/2010CN201681800U High-temperature diffusion boat of semiconductor wafer
12/22/2010CN201681799U Photoresist sampling device
12/22/2010CN201681798U Cleaning equipment
12/22/2010CN201681797U Taking and positioning device of chip transferring machine
12/22/2010CN201677419U Lifting device
12/22/2010CN201677417U Crystal silicon cutting machine
12/22/2010CN201677236U Liquid conveying system and chemical mechanical grinding device
12/22/2010CN201676838U Substrate wet process device with multi-directional spray rinsing mechanisms
12/22/2010CN1993813B Semiconductor device manufacturing method and plasma oxidation treatment method
12/22/2010CN1976869B Structure for holding fine structure, semiconductor device, TFT driving circuit, panel, display, sensor and their manufacturing methods
12/22/2010CN1964923B Method for forming quartz glass
12/22/2010CN1961405B Method of operating a system for chemical oxide removal
12/22/2010CN1957474B III-nitride current control device and method of manufacture
12/22/2010CN1953953B Metal complex comprising beta-diketonato as ligand
12/22/2010CN1943022B Silicon semiconductor substrate heat-treatment method and silicon semiconductor substrate treated by the method
12/22/2010CN1942091B Pickup device and pickup method
12/22/2010CN1938833B Techniques promoting adhesion of porous low k film to underlying barrier layer and interconnection structure
12/22/2010CN1917155B Thin film transistor substrate and fabrication thereof
12/22/2010CN1911937B Stabilizers to inhibit the polymerization of substituted cyclotetrasiloxane
12/22/2010CN1906332B Nano-array electrode manufacturing method and photoelectric converter using same
12/22/2010CN1898409B Method and apparatus for forming a high quality low temperature silicon nitride layer
12/22/2010CN1894803B Semiconductor apparatus and method for manufacturing the same
12/22/2010CN1874874B Pad assembly for electrochemical mechanical processing
12/22/2010CN1873926B Method of manufacturing ferroelectric layer and method of manufacturing electronic device
12/22/2010CN1831644B Micronano transfer device
12/22/2010CN1823304B Material for forming fine pattern and method for forming fine pattern using the same
12/22/2010CN1812061B Semiconductor device and manufacture method thereof
12/22/2010CN1811603B Alkaline solution and manufacturing method, and alkaline solution application, solution applying device and application thereof
12/22/2010CN1799006B Micropattern formation material and method of micropattern formation
12/22/2010CN1743254B Vacuum interface between a mini-environment box and an equipment
12/22/2010CN1734736B TV and electronic apparatus and method for making semiconductor member
12/22/2010CN1728380B 半导体器件 Semiconductor devices
12/22/2010CN1692452B Semiconductor device and method of controlling the semiconductor device
12/22/2010CN1655336B Substrate support bushing
12/22/2010CN1638131B Semiconductor device having a capacitor with a stepped cylindrical structure and method of manufacturing same
12/22/2010CN1638039B Laser irradiation apparatus, laser irradiation method, and method for manufacturing crystalline semiconductor film
12/22/2010CN1345091B Semiconductor storage using tunnel magneto-resistance effect and manufacture thereof
12/22/2010CN101926232A Etching chamber having flow equalizer and lower liner
12/22/2010CN101926013A Nitride semiconductor light-emitting device
12/22/2010CN101926010A Process for manufacture of solar cells
12/22/2010CN101926007A Semiconductor element and method for manufacturing the same
12/22/2010CN101926003A Semiconductor structure and method of manufacture
12/22/2010CN101925997A Driver module structure
12/22/2010CN101925995A Method of fabricating epitaxially grown layers on composite structure
12/22/2010CN101925994A Method of fabricating composite structure with stable bonding layer of oxide
12/22/2010CN101925993A Methods and apparatus for integral local substrate center finder for I/O and chamber slit valves
12/22/2010CN101925992A Bonding wire for semiconductor
12/22/2010CN101925991A Bonding apparatus, and method for adjusting height of bonding stage on bonding apparatus
12/22/2010CN101925990A Dual capillary wirebonding
12/22/2010CN101925989A Roll-on encapsulation method for semiconductor packages
12/22/2010CN101925988A Semiconductor device and method for manufacturing the same
12/22/2010CN101925987A Method for forming strained channel PMOS devices and integrated circuits therefrom
12/22/2010CN101925986A Semiconductor device and method for production thereof
12/22/2010CN101925985A Gas modulation to control edge exclusion in bevel edge etching plasma chamber
12/22/2010CN101925984A Reducing damage to low-k materials during photoresist stripping
12/22/2010CN101925983A Process for production of microelectromechanical systems
12/22/2010CN101925982A Improved high tilt implant angle performance using in-axis tilt
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