Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/22/2010CN101266736B Display device and method of manufacturing the same
12/22/2010CN101262003B Solid-state image capturing device and electronic information device
12/22/2010CN101256966B Semiconductor component and method of manufacture
12/22/2010CN101238762B Surface mounting component having magnetic layer thereon and method of forming same
12/22/2010CN101236896B Crystallized heat treatment system for noncrystalline silicon
12/22/2010CN101223000B Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
12/22/2010CN101213647B Sheet adhering apparatus and sheet adhering method
12/22/2010CN101211946B Image sensor and method for manufacturing the same
12/22/2010CN101211808B Picker for use in a handler and method for enabling the picker to place packaged chips
12/22/2010CN101211768B Grid electrode and method for forming same
12/22/2010CN101210951B Built-in illuminating source photo-sensor detection device and test bench possessing same
12/22/2010CN101196668B Display device and method of producing the same
12/22/2010CN101154046B Manufacturing method for double-mosaic structure
12/22/2010CN101144770B Method for measuring silicon base body and membrane base combination intensity
12/22/2010CN101135861B Method and apparatus for performing dark field double dipole lithography
12/22/2010CN101131922B Underlay aligner with easy maintenance
12/22/2010CN101118880B Integrated passive device substrate
12/22/2010CN101118380B Imprint method and imprint device
12/22/2010CN101099223B Light emitting diode with conducting metal substrate
12/22/2010CN101099114B Resist pattern forming method
12/22/2010CN101097409B Substrate processing apparatus and method
12/22/2010CN101093786B UV curing system
12/22/2010CN101084327B Film-forming method and recording medium
12/22/2010CN101075659B Method for manufacturing film transistor and film transistor and display device
12/22/2010CN101064763B Image sensor and manufacturing method thereof
12/22/2010CN101061253B Substrate processing apparatus using a batch processing chamber
12/22/2010CN101060093B Substrate transportation and processing apparatus
12/22/2010CN101040375B Long-term heat-treated integrated circuit arrangements and methods for producing the same
12/22/2010CN101032068B Linear motor, stage apparatus and exposure apparatus
12/22/2010CN101027770B Integrated circuit with metal gate electrode and method for manufacturing metal gate electrode
12/22/2010CN101026119B Etch resistant wafer processing apparatus and method for producing the same
12/21/2010USRE42004 Method for fabricating a semiconductor storage device having an increased dielectric film area
12/21/2010US7856606 Apparatus, method and program product for suppressing waviness of features to be printed using photolithographic systems
12/21/2010US7856288 Imprint system and imprint method
12/21/2010US7856253 Power supply IC having switching regulator and series regulator
12/21/2010US7855920 Semiconductor memory device having a floating storage bulk region capable of holding/emitting excessive majority carriers
12/21/2010US7855919 Non-volatile memory and semiconductor device
12/21/2010US7855894 Printed circuit board
12/21/2010US7855593 Semiconductor integrated circuit device
12/21/2010US7855549 Integrated process condition sensing wafer and data analysis system
12/21/2010US7855463 Method for producing a circuit module comprising at least one integrated circuit
12/21/2010US7855451 Device having a contacting structure
12/21/2010US7855442 Silicon based package
12/21/2010US7855440 Functional device-mounted module and a process for producing the same
12/21/2010US7855439 Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same
12/21/2010US7855438 Deep via construction for a semiconductor device
12/21/2010US7855431 Capacitor unit and method of forming the same
12/21/2010US7855429 Electronic circuit device having silicon substrate
12/21/2010US7855428 Conductive liner at an interface between a shallow trench isolation structure and a buried oxide layer
12/21/2010US7855427 Semiconductor device with a plurality of isolated conductive films
12/21/2010US7855424 Method for packaging semiconductor device and package structure thereof
12/21/2010US7855423 Semiconductor mount
12/21/2010US7855416 Semiconductor device and manufacturing method thereof
12/21/2010US7855415 Power semiconductor devices having termination structures and methods of manufacture
12/21/2010US7855413 Diode with low resistance and high breakdown voltage
12/21/2010US7855404 Bipolar complementary semiconductor device
12/21/2010US7855397 Electronic assemblies providing active side heat pumping
12/21/2010US7855386 N-type group III nitride semiconductor layered structure
12/21/2010US7855381 Device including resin film
12/21/2010US7855380 Semiconductor device and method for fabricating the same
12/21/2010US7855363 Inspection method and apparatus using an electron beam
12/21/2010US7855342 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
12/21/2010US7855156 Method of and apparatus for inline deposition of materials on a non-planar surface
12/21/2010US7855155 Process for producing semiconductor device using optical absorption layer
12/21/2010US7855154 cap layer and a photoresist layer are each formed over the photopatternable layer; cap layer absorbs or reflects radiation and protects the photopatternable layer from a first wavelength of radiation used in patterning photoresist layer; photopatternable material is convertible to a SiO2 based material
12/21/2010US7855153 Method for manufacturing semiconductor device
12/21/2010US7855152 Method of producing active matrix substrate
12/21/2010US7855151 Formation of a slot in a silicon substrate
12/21/2010US7855150 Plasma system and method for anisotropically etching structures into a substrate
12/21/2010US7855149 Treatment method for surface of substrate, method of fabricating image sensor by using the treatment method, and image sensor fabricated by the same
12/21/2010US7855148 Methods of isolating array features during pitch doubling processes and semiconductor device structures having isolated array features
12/21/2010US7855147 Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer
12/21/2010US7855146 Photo-focus modulation method for forming transistor gates and related transistor devices
12/21/2010US7855145 Gap filling method and method for forming semiconductor memory device using the same
12/21/2010US7855144 Method of forming metal lines and bumps for semiconductor devices
12/21/2010US7855143 Interconnect capping layer and method of fabrication
12/21/2010US7855142 Methods of forming dual-damascene metal interconnect structures using multi-layer hard masks
12/21/2010US7855141 Semiconductor device having multiple wiring layers and method of producing the same
12/21/2010US7855140 Method of forming vias in semiconductor substrates and resulting structures
12/21/2010US7855139 Systems and methods for controlling the effective dielectric constant of materials used in a semiconductor device
12/21/2010US7855138 Semiconductor device and method for manufacturing the same
12/21/2010US7855137 Method of making a sidewall-protected metallic pillar on a semiconductor substrate
12/21/2010US7855136 Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
12/21/2010US7855135 Method to reduce parastic capacitance in a metal high dielectric constant (MHK) transistor
12/21/2010US7855134 Semiconductor device and manufacturing method of the same
12/21/2010US7855133 Formation of carbon and semiconductor nanomaterials using molecular assemblies
12/21/2010US7855132 Method of manufacturing bonded wafer
12/21/2010US7855131 Manufacturing method of a semiconductor device
12/21/2010US7855130 Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
12/21/2010US7855129 Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method
12/21/2010US7855128 Back-illuminated imager using ultra-thin silicon on insulator substrates
12/21/2010US7855127 Method for manufacturing semiconductor substrate
12/21/2010US7855126 Methods of fabricating a semiconductor device using a cyclic selective epitaxial growth technique and semiconductor devices formed using the same
12/21/2010US7855125 Method for manufacturing semiconductor device and semiconductor device
12/21/2010US7855124 Method for forming a semiconductor device
12/21/2010US7855123 Method of integrating an air gap structure with a substrate
12/21/2010US7855121 Method of forming organic thin film and method of manufacturing semiconductor device using the same
12/21/2010US7855120 Methods for forming resistors including multiple layers for integrated circuit devices
12/21/2010US7855119 Method for forming polycrystalline thin film bipolar transistors
12/21/2010US7855118 Drive current increase in transistors by asymmetric amorphization implantation
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