Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2010
12/23/2010US20100323491 Semiconductor device and method of manufacturing the same
12/23/2010US20100323490 Self-Aligned Cross-Point Memory Fabrication
12/23/2010US20100323489 Method of forming a vertical diode and method of manufacturing a semiconductor device using the same
12/23/2010US20100323488 Semiconductor device and method of manufacturing the same
12/23/2010US20100323487 Radiation hardened device
12/23/2010US20100323486 Triple-gate transistor with reverse shallow trench isolation
12/23/2010US20100323485 Pn junction and mos capacitor hybrid resurf transistor
12/23/2010US20100323484 Method of manufacturing semiconductor device
12/23/2010US20100323483 Method of fabricating memory
12/23/2010US20100323482 Tft array substrate and the fabrication method thereof
12/23/2010US20100323481 Systems and devices including multi-gate transistors and methods of using, making, and operating the same
12/23/2010US20100323480 Multiple select gates with non-volatile memory cells
12/23/2010US20100323479 Semiconductor Component with Surface Mountable Devices and Method for Producing the Same
12/23/2010US20100323478 Method for fabricating through-silicon via structure
12/23/2010US20100323477 Interconnections of an integrated electronic circuit
12/23/2010US20100323476 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
12/23/2010US20100323474 Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
12/23/2010US20100323469 Methods for separating individual semiconductor devices from a carrier
12/23/2010US20100323467 Force input control device and method of fabrication
12/23/2010US20100323465 Molded chip fabrication method and apparatus
12/23/2010US20100323463 Method for manufacturing liquid discharge head
12/23/2010US20100323462 Process environment variation evaluation
12/23/2010US20100323461 Lithographic Method and Arrangement
12/23/2010US20100323460 Defect inspecting method
12/23/2010US20100323459 Method of and device for determining and controlling the distance between an integrated circuit and a substrate
12/23/2010US20100323458 METHOD FOR MAKING P(VDF/TrFE) COPOLYMER LAYER SENSORS, AND CORRESPONDING SENSOR
12/23/2010US20100323282 method of correcting a flare and computer program product
12/23/2010US20100323281 Pellicle
12/23/2010US20100323124 Sealed plasma coatings
12/23/2010US20100322754 Apparatus for Substrate Alignment, Apparatus for Substrate Processing Having the Same, and Substrate Alignment Method
12/23/2010US20100322745 Conveyor robot
12/23/2010US20100322285 Apparatus and method for measuring local surface temperature of semiconductor device
12/23/2010US20100322276 Group-iii nitride semiconductor laser device, and method for fabricating group-iii nitride semiconductor laser device
12/23/2010US20100322013 Nonvolatile Semiconductor Memory Device
12/23/2010US20100321993 Methods of forming spin torque devices and structures formed thereby
12/23/2010US20100321992 Phase change memory elements using energy conversion layers, memory arrays and systems including same, and methods of making and using same
12/23/2010US20100321990 Memory Including Vertical Bipolar Select Device and Resistive Memory Element
12/23/2010US20100321985 Boosted gate voltage programming for spin-torque MRAM array
12/23/2010US20100321979 Resistance change memory
12/23/2010US20100321914 Multilayer printed wiring board
12/23/2010US20100321843 Semiconductor ESD Device and Method of Making Same
12/23/2010US20100321842 Electrostatic Discharge Structures and Methods of Manufacture
12/23/2010US20100321840 Bottom source NMOS triggered zener clamp for configuring an ultra-low voltage transient voltage suppressor (TVS)
12/23/2010US20100321705 Semiconductor device and method of manufacturing the same
12/23/2010US20100321652 Lithographic apparatus and device manufacturing method
12/23/2010US20100321648 Substrate transfer method and apparatus
12/23/2010US20100321544 Semiconductor device, camera module and method of manufacturing semiconductor device
12/23/2010US20100321357 Image Sensor and Image Sensor Integrated Type Active Matrix Type Display Device
12/23/2010US20100321281 EL Display Device and Electronic Device
12/23/2010US20100321095 Semiconductor device, manufacturing method of semiconductor device, semiconductor chip and system
12/23/2010US20100321044 Sensing element integrating silicon nanowire gated-diodes, manufacturing method and detecting system thereof
12/23/2010US20100320873 Semiconductor device and method of fabricating the semiconductor device
12/23/2010US20100320624 Die package including encapsulated die and method of manufacturing the same
12/23/2010US20100320623 Semiconductor device and method for manufacturing the same
12/23/2010US20100320622 Electronic component built-in wiring substrate and method of manufacturing the same
12/23/2010US20100320621 Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof
12/23/2010US20100320619 Integrated circuit packaging system with interposer and method of manufacture thereof
12/23/2010US20100320618 Interconnection substrate, semiconductor device, and production method of semiconductor device
12/23/2010US20100320616 Semiconductor device and method of manufacturing the same
12/23/2010US20100320612 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
12/23/2010US20100320611 Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer
12/23/2010US20100320610 Semiconductor package with substrate having single metal layer and manufacturing methods thereof
12/23/2010US20100320609 Wetting pretreatment for enhanced damascene metal filling
12/23/2010US20100320608 Semiconductor Substrate Contact VIA
12/23/2010US20100320606 Method for Forming MEMS Devices Having Low Contact Resistance and Devices Obtained Thereof
12/23/2010US20100320605 Semiconductor device and method of fabricating the same
12/23/2010US20100320604 Application of mn for damage restoration after etchback
12/23/2010US20100320603 Integrated circuit package system with redistribution layer and method for manufacturing thereof
12/23/2010US20100320602 High-Speed Memory Package
12/23/2010US20100320601 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof
12/23/2010US20100320598 Semiconductor device and fabrication method thereof
12/23/2010US20100320596 Method for fabricating semiconductor package and semiconductor package using the same
12/23/2010US20100320595 Hybrid hermetic interface chip
12/23/2010US20100320594 Semiconductor device with reinforcement plate and method of forming same
12/23/2010US20100320593 Chip Package Structure and Manufacturing Methods Thereof
12/23/2010US20100320592 Semiconductor device and method for manufacturing the same
12/23/2010US20100320591 Integrated circuit packaging system with contact pads and method of manufacture thereof
12/23/2010US20100320590 Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof
12/23/2010US20100320589 Integrated circuit packaging system with bumps and method of manufacture thereof
12/23/2010US20100320588 Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die
12/23/2010US20100320587 Integrated circuit packaging system with underfill and method of manufacture thereof
12/23/2010US20100320586 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
12/23/2010US20100320585 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
12/23/2010US20100320583 Integrated circuit packaging system with a dual substrate package and method of manufacture thereof
12/23/2010US20100320582 Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof
12/23/2010US20100320576 Die-warpage compensation structures for thinned-die devices, and methods of assembling same
12/23/2010US20100320575 Thru silicon enabled die stacking scheme
12/23/2010US20100320571 Bipolar transistor structure and method including emitter-base interface impurity
12/23/2010US20100320569 Carbon nanotube resistor, semiconductor device, and manufacturing method thereof
12/23/2010US20100320567 Integrated circuit comprising a capacitor with metal electrodes and process for fabrcating such a capacitor
12/23/2010US20100320565 Wafer and method for improving yield rate of wafer
12/23/2010US20100320564 Nanowire memory device and method of manufacturing the same
12/23/2010US20100320561 Method for forming a one-time programmable metal fuse and related structure
12/23/2010US20100320559 Semiconductor device including independent active layers and method for fabricating the same
12/23/2010US20100320556 Continuous large area imaging and display arrays using readout arrays fabricated in silicon-on-glass substrates
12/23/2010US20100320555 Controlling electromechanical behavior of structures within a microelectromechanical systems device
12/23/2010US20100320550 Spin-Torque Magnetoresistive Structures with Bilayer Free Layer
12/23/2010US20100320549 Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices
12/23/2010US20100320548 Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device Fabrication
12/23/2010US20100320547 Scavanging metal stack for a high-k gate dielectric
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