Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/21/2014WO2014124980A2 Process for producing a gallium arsenide substrate, gallium arsenide substrate and use thereof
08/21/2014WO2014124795A1 Methods for providing spaced lithography features on a substrate by self-assembly of block copolymers
08/21/2014WO2014124486A1 Light emitting device using super-luminescence in semiconductor layer grown with moss-burstein effect
08/21/2014WO2014106200A3 Method for preparing samples for imaging
08/21/2014WO2014105233A3 Processes for multi-layer devices utilizing layer transfer
08/21/2014WO2014096962A3 Recessed contact to semiconductor nanowires
08/21/2014US20140236516 Method and apparatus for determining a critical dimension variation of a photolithographic mask
08/21/2014US20140236515 Cloud-based architecture for analysis and prediction of integrated tool-related and material-related data and methods therefor
08/21/2014US20140235796 Composition for forming resist underlayer film and patterning process
08/21/2014US20140235072 Thermal processing method and thermal processing apparatus for heating substrate, and susceptor
08/21/2014US20140235071 Substrate rapid thermal heating system and methods
08/21/2014US20140235070 Cover plate for wind mark control in spin coating process
08/21/2014US20140235069 Multi-plenum showerhead with temperature control
08/21/2014US20140235068 Method of manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and non-transitory computer-readable recording medium
08/21/2014US20140235067 Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
08/21/2014US20140235066 Method of manufacturing semiconductor device and method of cleaning processing vessel
08/21/2014US20140235065 Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
08/21/2014US20140235064 Etchant composition and etching method
08/21/2014US20140235063 Hybrid edge ring for plasma wafer processing
08/21/2014US20140235062 Plasma processing method and plasma processing apparatus
08/21/2014US20140235061 Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
08/21/2014US20140235060 Resist underlayer film-forming composition which contains alicyclic skeleton-containing carbazole resin
08/21/2014US20140235059 Diarylamine novolac resin
08/21/2014US20140235058 Method for Forming a Power Semiconductor Device
08/21/2014US20140235057 Pattern forming process
08/21/2014US20140235056 System, method and apparatus for ion milling in a plasma etch chamber
08/21/2014US20140235055 Method for fabricating a semiconductor integrated circuit with a litho-etch, litho-etch process for etching trenches
08/21/2014US20140235054 Tungsten diazabutadiene precursors, their synthesis, and their use for tungsten containing film depositions
08/21/2014US20140235053 Methods of Forming Through Silicon Via Openings
08/21/2014US20140235052 Methods for Fabricating Semiconductor Devices Having Through Electrodes
08/21/2014US20140235051 Structure and Method for High Performance Interconnect
08/21/2014US20140235050 Method of Semiconductor Integrated Circuit Fabrication
08/21/2014US20140235049 Semiconductor Devices and Methods of Manufacture Thereof
08/21/2014US20140235048 Method for fabricating semiconductor device
08/21/2014US20140235047 Methods of forming gates of semiconductor devices
08/21/2014US20140235046 Method of integrating a charge-trapping gate stack into a cmos flow
08/21/2014US20140235045 Method of manufacturing semiconductor device
08/21/2014US20140235044 Multi-composition dielectric for semiconductor device
08/21/2014US20140235043 Method for forming fin-shaped structure
08/21/2014US20140235042 Ion implantation method and ion implantation apparatus
08/21/2014US20140235041 Chemical vapor deposition reactor having ceramic lining for production of polysilicon
08/21/2014US20140235040 Growing III-V Compound Semiconductors from Trenches Filled with Intermediate Layers
08/21/2014US20140235039 Method for producing a protective structure
08/21/2014US20140235038 Semiconductor device and method of forming epitaxial layer
08/21/2014US20140235037 Crystal film, crystal substrate, and semiconductor device
08/21/2014US20140235036 Hot-wire method for depositing semiconductor material on a substrate and device for performing the method
08/21/2014US20140235035 Methods of Forming Semiconductor Devices
08/21/2014US20140235034 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
08/21/2014US20140235033 Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles
08/21/2014US20140235032 Method for producing transparent soi wafer
08/21/2014US20140235031 Methods for Wafer Bonding and for Nucleating Bonding Nanophases Using Wet and Steam Pressurization
08/21/2014US20140235030 Method and system for fabricating floating guard rings in gan materials
08/21/2014US20140235027 Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
08/21/2014US20140235026 Methods for forming electrostatic discharge protection clamps with increased current capabilities
08/21/2014US20140235024 Method of Making MOSFET Integrated with Schottky Diode with Simplified One-time Top-Contact Trench Etching
08/21/2014US20140235022 Semiconductor device and method of manufacturing semiconductor device
08/21/2014US20140235014 Method for manufacturing a metal-insulator-semiconductor (mis) structure for an electroluminescent diode
08/21/2014US20140235008 Back side illumination (bsi) sensors, manufacturing methods thereof, and semiconductor device manufacturing methods
08/21/2014US20140235007 Method of manufacturing semiconductor light emitting device and chemical vapor deposition apparatus
08/21/2014US20140235005 Method of producing p-type nitride semiconductor and method of manufacturing nitride semiconductor light emitting device therewith
08/21/2014US20140235000 Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same
08/21/2014US20140234995 Method of forming flexible and tunable semiconductor photonic circuits
08/21/2014US20140234994 Inspection method for semiconductor light-emitting device and manufacturing method for semiconductor light-emitting device
08/21/2014US20140234993 Sti cmp under polish monitoring
08/21/2014US20140234992 Plasma etching method and semiconductor device manufacturing method
08/21/2014US20140234991 Thermal processing apparatus for thermal processing substrate and positioning method of positioning substrate transfer position
08/21/2014US20140234664 Peeling method, semiconductor device, and peeling apparatus
08/21/2014US20140234568 Sapphire substrate
08/21/2014US20140234157 Methods for forming gold nanowires on a substrate and gold nanowires formed thereof
08/21/2014US20140234058 Substrate transfer device, substrate processing apparatus, and substrate accommodation method
08/21/2014US20140234057 Apparatus And Methods For Moving Wafers
08/21/2014US20140233004 Lithographic apparatus and device manufacturing method
08/21/2014US20140233003 Immersion photolithography system and method using microchannel nozzles
08/21/2014US20140232998 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
08/21/2014US20140232018 Silicon-containing euv resist underlayer film forming composition
08/21/2014US20140232015 Semiconductor Modules and Methods of Formation Thereof
08/21/2014US20140232013 Backside Through Vias in a Bonded Structure
08/21/2014US20140232011 Semiconductor device and manufacturing method thereof
08/21/2014US20140232010 Integrated circuits and methods of forming the same with multi-level electrical connection
08/21/2014US20140232006 Device and Method for Manufacturing a Device
08/21/2014US20140232001 Device Bond Pads Over Process Control Monitor Structures in a Semiconductor Die
08/21/2014US20140232000 Semiconductor arrangement and formatin thereof
08/21/2014US20140231998 Back End of the Line (BEOL) Interconnect Scheme
08/21/2014US20140231997 Semiconductor device and method for manufacturing the same
08/21/2014US20140231990 Wiring board and method for manufacturing the same
08/21/2014US20140231984 Molding Compound Structure
08/21/2014US20140231983 Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
08/21/2014US20140231981 Semiconductor device and method for manufacturing the same
08/21/2014US20140231980 Semiconductor grid array package
08/21/2014US20140231978 Semiconductor package with inner and outer leads
08/21/2014US20140231977 Semiconductor packages with low stand-off interconnections between chips
08/21/2014US20140231973 Semiconductor device including electromagnetic absorption and shielding
08/21/2014US20140231972 Multi-chip package and method for manufacturing the same
08/21/2014US20140231971 Chip arrangement and a method of manufacturing a chip arrangement
08/21/2014US20140231970 Method for processing a carrier, a carrier, an electronic device and a lithographic mask
08/21/2014US20140231969 Semiconductor device with a charge carrier compensation structure and method for the production of a semiconductor device
08/21/2014US20140231968 Conformal Anti-Reflective Coating
08/21/2014US20140231967 Systems and methods for post-bonding wafer edge seal
08/21/2014US20140231966 Chip package and method for forming the same
08/21/2014US20140231965 Microfine structure formation method and microfine structure formed body
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