Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/13/2014CN103985734A 一种透明显示装置及其制作方法 A transparent display device and manufacturing method thereof
08/13/2014CN103985725A 半导体结构及其制备方法 Semiconductor structure and preparation method
08/13/2014CN103985717A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, a display device
08/13/2014CN103985716A 薄膜晶体管阵列基板制造方法及薄膜晶体管阵列基板 The method of manufacturing a thin film transistor array substrate and a thin film transistor array substrate,
08/13/2014CN103985715A 一种阵列基板及其制作方法、液晶显示装置 One kind of array substrate and method of manufacturing the liquid crystal display device
08/13/2014CN103985714A 阵列基板及其制造方法 The method of manufacturing the array substrate and
08/13/2014CN103985713A Tft阵列基板及其制造方法 Tft array substrate and manufacturing method thereof
08/13/2014CN103985712A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/13/2014CN103985711A 具有减少的寄生电容量的FinFET及其制造方法 FinFET and its manufacturing method having a reduced parasitic capacitance
08/13/2014CN103985709A 半导体器件和用于制造半导体器件的方法 The semiconductor device and a method for manufacturing a semiconductor device
08/13/2014CN103985708A 薄膜晶体管阵列基板及其制作方法 The thin film transistor array substrate and manufacturing method thereof
08/13/2014CN103985700A 封装结构的联机构件及其制法 Online member Jiqizhifa package structure
08/13/2014CN103985698A 具有嵌入式滤波器的多层电子结构 Multilayer electronic structure with embedded filter
08/13/2014CN103985697A 互连接触结构及其制造方法 Interconnection contact structure and its manufacturing method
08/13/2014CN103985696A 具有金属-绝缘体-金属电容器的封装件及其制造方法 Having a metal - insulator - metal package and method for manufacturing a capacitor
08/13/2014CN103985695A 一种扇出型封装结构及其制作工艺 One kind of fan-out package structure and production process
08/13/2014CN103985693A 无刷直流电机集成驱动电路的封装结构及其封装方法 Package and packaging method integrated brushless DC motor drive circuit
08/13/2014CN103985692A Ac-dc电源电路的封装结构及其封装方法 Package and packaging method Ac-dc power supply circuit
08/13/2014CN103985690A 树脂密封型半导体装置及其制造方法 Resin sealing type semiconductor device and manufacturing method
08/13/2014CN103985685A 功率半导体芯片的铜金属化结构及其制备方法 Power semiconductor chip copper metallization structure and preparation method
08/13/2014CN103985684A 晶片封装结构及其制作方法 Chip package structure and production methods
08/13/2014CN103985682A 基板结构及其制造方法 Substrate structure and manufacturing method
08/13/2014CN103985680A 适用于发热器件的散热装置及其制备方法 The heat sink and its preparation method is applicable to the heat generating device
08/13/2014CN103985677A 超薄塑封半导体元器件框架、元器件及其制备方法 Ultra-thin plastic semiconductor components framework, components and preparation method
08/13/2014CN103985676A 复合晶片及其制造方法 Composite and method of manufacturing a wafer
08/13/2014CN103985673A 制造半导体器件的方法 The method of manufacturing a semiconductor device
08/13/2014CN103985672A 从半导体器件去除膜的方法 Remove the film from the semiconductor device method
08/13/2014CN103985671A 阵列基板制备方法和阵列基板、显示装置 Preparation array substrate and the array substrate, a display device
08/13/2014CN103985670A 阻挡层的去除方法和装置 The barrier layer removal method and apparatus
08/13/2014CN103985669A 金属互连结构及其制造方法 Metal interconnect structure and manufacturing method
08/13/2014CN103985668A 铜互连的制备方法 Preparation of copper interconnects
08/13/2014CN103985667A 电性连接结构及其制备方法 Electrical connection structure and preparation method
08/13/2014CN103985666A 一种环形硅深孔及环形硅深孔电极的制备方法 A toroidal ring of silicon and silicon deep hole electrode preparation
08/13/2014CN103985665A 一种柔性显示器的制作方法 A method of manufacturing a flexible display
08/13/2014CN103985664A 硅基氮化镓外延层剥离转移的方法 GaN epitaxial silicon layer peeling transfer
08/13/2014CN103985663A 一种用于超薄石英基片上光刻刻蚀双面薄膜电路图形的方法 A double-sided etching method of a lithographic pattern on the thin film circuit for the quartz substrate
08/13/2014CN103985662A 一种对位装置及对位平台 A kind of digital device and on-bit platforms
08/13/2014CN103985661A 半导体制造装置 The semiconductor manufacturing apparatus
08/13/2014CN103985660A 湿法刻蚀系统、湿法刻蚀方法 Wet etching systems, wet etching method
08/13/2014CN103985659A 一种mocvd半导体处理装置及制作方法 A semiconductor processing apparatus and method of making mocvd
08/13/2014CN103985658A 一种化学机械研磨后的清洗装置 A chemical mechanical polishing after washing apparatus
08/13/2014CN103985657A 桶式炉和半导体制造方法 Barrel-type furnace and a method of manufacturing a semiconductor
08/13/2014CN103985656A 硅片正反面的识别装置及方法 Positive and negative wafer identification apparatus and method
08/13/2014CN103985655A GaAs/AlGaAs半导体异质结结构栅极电控量子点的制备方法及其测量方法 Preparation and measurement methods GaAs / AlGaAs heterostructure semiconductor quantum dots electronically controlled gates
08/13/2014CN103985654A 检查结晶化的装置和方法 Check the crystallization apparatus and method
08/13/2014CN103985653A 一种晶片应力测量方法 A wafer stress measurement method
08/13/2014CN103985652A 一种晶片应力测量装置及测量方法 A wafer stress measurement apparatus and measurement method
08/13/2014CN103985651A 一种低温快速连接活化金属表面与微纳米连接材料的方法 A cryogenic quick connect activation of the metal surface and the method of micro and nano-connecting material
08/13/2014CN103985650A 封装模具及封装方法 Packaging mold and encapsulation method
08/13/2014CN103985649A 晶圆级封装方法及晶圆 Wafer and wafer-level packaging method
08/13/2014CN103985648A 半导体的晶圆级封装方法和半导体封装件 The semiconductor wafer-level packaging method and a semiconductor package
08/13/2014CN103985647A 一种制备铜柱凸点的方法 A method for the preparation of pillars bumps
08/13/2014CN103985646A 替代氢气炉进行芯片烧结的方法 Chip replacement of hydrogen sintering furnace method
08/13/2014CN103985645A 一种半导体封装件及制造方法 A semiconductor package and method of manufacture
08/13/2014CN103985644A 树脂密封型半导体装置的制造方法以及引脚架 The method of manufacturing a resin sealing type semiconductor device and a lead frame
08/13/2014CN103985643A 一种用于半导体芯片封装制程的贴片工艺 A semiconductor chip technology for chip packaging process
08/13/2014CN103985642A 晶圆级封装方法及封装结构 Wafer-level packaging method and package structure
08/13/2014CN103985641A 穿过衬底形成导电通孔的方法及由其产生的结构和组合件 Forming conductive vias through the substrate and the structure and method of assembly is produced by
08/13/2014CN103985640A 填充头设备 Filling head equipment
08/13/2014CN103985639A 一种薄膜晶体管及其制备方法、显示基板、显示装置 A thin film transistor and a preparation method thereof, a display substrate, a display device
08/13/2014CN103985638A 一种低温多晶硅薄膜晶体管及其制备方法和显示器件 Low-temperature polysilicon thin film transistor and its preparation method and display devices
08/13/2014CN103985637A 低温多晶硅薄膜晶体管及其制作方法和显示装置 Low-temperature polysilicon thin film transistor and a display device and manufacturing method thereof
08/13/2014CN103985636A 调整多阈值电压的FinFET/三栅极沟道掺杂 Adjust the multi-threshold voltage FinFET / tri-gate channel doping
08/13/2014CN103985635A 一种mos晶体管的制备方法 Method for preparing mos transistor
08/13/2014CN103985634A 一种pmos晶体管的制造方法 Method for producing a pmos transistor
08/13/2014CN103985633A 一种pmos晶体管的制备方法 Preparation method of pmos transistor
08/13/2014CN103985632A 一种工艺管排气装置 A process pipe exhaust system
08/13/2014CN103985631A 调整纳米线结构的方法 The method of adjusting the configuration of the nanowire
08/13/2014CN103985630A 液体内吸附传输方法 Transfer the liquid adsorption method
08/13/2014CN103985629A 自对准双层图形半导体结构的制作方法 Self-aligned method of making a double pattern of the semiconductor structure
08/13/2014CN103985628A 用于晶片转移的方法 Methods for wafer transfer
08/13/2014CN103985627A 提高tmbs良率的工艺方法 Improve process yield method tmbs
08/13/2014CN103984212A 改善光阻曝光形貌的方法、图案化半导体衬底的方法 Method for improving the morphology of the exposed resist, a method of patterning a semiconductor substrate
08/13/2014CN103984171A 一种阵列基板及其制造方法、液晶显示器 One kind of a method of manufacturing the array substrate, a liquid crystal display
08/13/2014CN103984170A 阵列基板及其制造方法、液晶显示器 Array substrate and a method of manufacturing a liquid crystal display
08/13/2014CN103984166A 有源矩阵基板、有源矩阵基板的制造方法和液晶显示装置 The active matrix substrate, method of manufacturing the active matrix substrate and the liquid crystal display device
08/13/2014CN103984160A 阵列基板及其制造方法和液晶显示器件 Array substrate and method of manufacturing the liquid crystal display device
08/13/2014CN103983540A 一种判断体铁测试值可信度的方法 A body iron test method to determine the value of confidence
08/13/2014CN103977981A 改进内部晶圆温度分布的装置 Improved temperature distribution inside the device wafer
08/13/2014CN103333748B 一种硅片清洗液、制备方法、用途和硅片清洗方法 One kind of a silicon wafer cleaning solution, preparation method, uses and wafer cleaning methods
08/13/2014CN103091981B 利用自组装小球制作用于光刻版的金属网格模板的方法 Making use of the self-assembly of small ball for a lithographic printing plate of metal mesh template method
08/13/2014CN103081079B 半导体装置及其制造方法 Semiconductor device and manufacturing method
08/13/2014CN103035694B 一种具有终端保护结构的igbt芯片及其制造方法 Igbt and method of manufacturing a chip terminal protection structure has
08/13/2014CN102832174B 一种提高静态随机储存器读出冗余度的方法 A static random access memory readout method to improve redundancy
08/13/2014CN102820260B 提高通孔图形性能表现的方法 Methods to improve the graphics performance of the through-hole
08/13/2014CN102800627B 电子可编程熔丝器件制作方法 Electrically programmable fuse device fabrication method
08/13/2014CN102738220B Ono结构及其制造方法 Ono structure and manufacturing method
08/13/2014CN102738081B Tft液晶显示器array板的制备方法 Preparation Tft LCD monitor array panels
08/13/2014CN102738052B 一种工具以及使用了该工具的电子元件镀膜方法 The use of a tool and the tool's electronic component deposition method
08/13/2014CN102717185B 一种全自动半导体晶片激光加工装置及其加工方法 A fully automated semiconductor wafer processing method and laser processing apparatus
08/13/2014CN102655170B 锗硅异质结双极晶体管工艺中可变电容及制造方法 SiGe heterojunction bipolar transistor process variable capacitor and method of manufacture
08/13/2014CN102651316B 过孔的刻蚀方法、阵列基板、液晶面板及显示设备 Etching vias, the array substrate, a liquid crystal panel and a display device
08/13/2014CN102637596B 直拉硅片制造高频高压二极管的方法 Czochralski silicon wafer manufacturing method of high frequency high voltage diodes
08/13/2014CN102623409B 一种形成双应力层氮化硅薄膜的方法 A method of double-stress layer formed on a silicon nitride film
08/13/2014CN102610659B 电压控制变容器及其制备方法 Voltage controlled varactors and preparation method
08/13/2014CN102610644B 抑制辐射引起的背栅泄漏电流的soi器件及其制备方法 Suppression device and fabrication method soi back gate radiation-induced leakage current
08/13/2014CN102593085B 芯片封装结构以及芯片封装制程 Chip package and chip packaging process
08/13/2014CN102569373B 一种具有低导通饱和压降的igbt及其制造方法 Igbt its manufacturing method having a low saturation voltage of the conduction
08/13/2014CN102549734B 在线表征 Online characterization
08/13/2014CN102543961B 防静电破坏及防电磁波干扰的封装件及其制法 Anti-static and anti-electromagnetic interference undermine package Jiqizhifa
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