Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/21/2014US20140231964 Multiple Layer Substrate
08/21/2014US20140231963 Uni-directional transient voltage suppressor (tvs)
08/21/2014US20140231945 Temperature-adjusted spectrometer
08/21/2014US20140231932 Methods and Apparatus of Metal Gate Transistors
08/21/2014US20140231931 In-situ nitridation of gate dielectric for semiconductor devices
08/21/2014US20140231930 Atomic Layer Deposition of Hafnium or Zirconium Alloy Films
08/21/2014US20140231923 Semiconductor structure and method for manufacturing the same
08/21/2014US20140231919 Fin Deformation Modulation
08/21/2014US20140231913 Trilayer SIT Process with Transfer Layer for FINFET Patterning
08/21/2014US20140231907 Methods of inducing a desired stress in the channel region of a transistor by performing ion implantation/anneal processes on the gate electrode
08/21/2014US20140231871 Methods of containing defects for non-silicon device engineering
08/21/2014US20140231827 Semiconductor device and manufacturing method thereof
08/21/2014US20140231826 Methods of Growing a Silicon Carbide Epitaxial Layer on a Substrate to Increase and Control Carrier Lifetime
08/21/2014US20140231825 DIAMOND GaN DEVICES AND ASSOCIATED METHODS
08/21/2014US20140231823 Electrodes for semiconductor devices and methods of forming the same
08/21/2014US20140231818 AlN CAP GROWN ON GaN/REO/SILICON SUBSTRATE STRUCTURE
08/21/2014US20140231817 Iii-n material grown on alo/aln buffer on si substrate
08/21/2014US20140231815 Package for high-power semiconductor devices
08/21/2014US20140231814 Thin film transistor array panel and method of manufacturing the same
08/21/2014US20140231813 Thin-film device, thin-film device array, and method of manufacturing thin-film device
08/21/2014US20140231812 Substrate having thin film and method of thin film formation
08/21/2014US20140231762 Method for fabricating micro electro device, method for fabricating organic light emitting display device, micro electro device and organic light emitting display device fabricated thereby
08/21/2014US20140231761 Display substrate and method of manufacturing the same
08/21/2014US20140231751 Semiconductor device
08/21/2014US20140231503 Universal IC Tag, Method of Manufacturing Same, and Communication Management System
08/21/2014US20140231393 Program controlled dicing of a substrate using a pulsed laser beam
08/21/2014US20140231306 Apparatus for storing substrates
08/21/2014US20140231305 Cassette assembly
08/21/2014US20140231263 Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures
08/21/2014US20140231126 Structures for z-axis interconnection of multilayer electronic substrates
08/21/2014US20140231017 Plasma etching apparatus
08/21/2014US20140231011 Flattening method and flattening apparatus
08/21/2014US20140231010 Chemical supplier, processing apparatus including the chemical supplier
08/21/2014US20140230915 Gas delivery system for outputting fast square waves of process gas during semiconductor processing
08/21/2014US20140230861 Purging of porogen from uv cure chamber
08/21/2014US20140230860 Methods and apparatus for wetting pretreatment for through resist metal plating
08/21/2014US20140230851 Substrate processing apparatus, substrate processing method and computer-readable medium storing program
08/21/2014US20140230848 Method of cleaning substrate
08/21/2014US20140230846 Method of producing a component of a device, and the resulting components and devices
08/21/2014US20140230730 Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition
08/21/2014US20140230170 Post-cmp cleaning apparatus and method
08/21/2014DE112013000281T5 Verfahren zur Herstellung einer Vorrichtung A method for producing a device
08/21/2014DE112012005031T5 Randabschluss für Super -Junction -MOSFET -Vorrichtungen Edge termination for Super -Junction -MOSFET flashbulbs
08/21/2014DE112012005023T5 Verwendung einer organischen Planarisierungsmaske zum Schneiden einer Vielzahl von Gate-Leitungen Using an organic planarization mask for cutting a plurality of gate lines
08/21/2014DE112012005022T5 Halbleitervorrichtung und Verfahren zu deren Fertigung A semiconductor device and method of manufacturing
08/21/2014DE112012004966T5 Verfahren zur Herstellung einer Siliziumkarbid-Halbleitervorrichtung A process for producing a silicon carbide semiconductor device
08/21/2014DE112012004597T5 Bandsäge-Schneideapparat und Verfahren zum Schneiden eines Ingots Band saw cutting apparatus and method for cutting an ingot
08/21/2014DE112012003985T5 Epitaxialwafer und Herstellungsverfahren dafür Epitaxial wafer and manufacturing method thereof
08/21/2014DE112010003657B4 Ätzanlage Etching system
08/21/2014DE112005003614B4 Halbleiterbaugruppe für ein Schaltnetzteil und Verfahren zu dessen Montage A semiconductor assembly for a switching power supply and process for its mounting
08/21/2014DE112005001962B4 Systeme und Verfahren zum Anbringen von Chips in gestapelten Chipbausteinen Systems and methods for mounting of chips in stacked chip modules
08/21/2014DE10334819B4 Siliziumkarbid-Halbleitervorrichtung Silicon carbide semiconductor device
08/21/2014DE10296913B4 Segmentiertes Laserschneiden Segmented laser cutting
08/21/2014DE102014202114A1 Einstellbare Stromabschirmung für Galvanisierverfahren Adjustable current shielding for electroplating
08/21/2014DE102014102112A1 Bauelement und Verfahren zur Herstellung eines Bauelements Device and method for manufacturing a device
08/21/2014DE102014102087A1 Vorrichtungskontaktflecke über prozesssteuerungs-/überwachungs-strukturen in einem halbleiterchip Device pads on process control / monitoring structures in a semiconductor chip
08/21/2014DE102014102006A1 Halbleitermodule und Verfahren zu deren Bildung Semiconductor modules and methods for their formation
08/21/2014DE102014101951A1 Superjunction-Halbleitervorrichtung mit Implantationszonen Superjunction semiconductor device implantation zones
08/21/2014DE102014101859A1 Superjunction-Halbleitervorrichtung mit Überkompensationszonen Superjunction semiconductor device with overcompensation zones
08/21/2014DE102014101818A1 Optische Vorrichtung als Mehrchip-Wafer-Level-Package (WLP) An optical device as a multi-chip wafer level package (WLP)
08/21/2014DE102014101058A1 Verfahren zur herstellung einer integrierten schaltung und integrierte schaltung A method of manufacturing an integrated circuit and integrated circuit
08/21/2014DE102014100055A1 Verfahren zum Bearbeiten eines Trägers, Träger, elektronische Vorrichtung und Lithographiemaske A method for processing a carrier, carriers, electronic device and lithography mask
08/21/2014DE102013223503A1 Halbleitervorrichtung Semiconductor device
08/21/2014DE102013220852A1 Integrierte Schaltungen und Verfahren zum Herstellen von integrierten Schaltungen mit Metall-Gate-Elektroden Integrated circuits and methods for manufacturing integrated circuits with metal gate electrodes
08/21/2014DE102013202851A1 Schichtsystem zur ermittlung von eigenschaften der materialien von funktionsschichten und verfahren zu seiner herstellung Layer system for determining properties of materials of functional layers, and process for its preparation
08/21/2014DE102013105974A1 Dielektrikum mit Mehrfachzusammensetzung für Halbleitereinrichtung Dielectric with multiple composition for semiconductor device
08/21/2014DE102013105504A1 Vertikale Tunnel-Feldeffekttransistor-Zelle Vertical tunnel field-effect transistor cell
08/21/2014DE102013101598A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements A method for producing an optoelectronic semiconductor component
08/21/2014DE102013101586A1 Mehrschichtige Schattenmaske Multilayer shadow mask
08/21/2014DE102013002637A1 Verfahren zur Herstellung eines Galliumarsenidsubstrats, Galliumarsenidsubstrat und Verwendung desselben The same process for the preparation of a gallium arsenide substrate, gallium arsenide substrate and using
08/21/2014DE102012009746B4 Verfahren zum Überprüfen der thermischen Kopplung zwischen einem Halbleiterbauelement und einem Kühlkörper Method for checking the thermal coupling between a semiconductor device and a heat sink
08/21/2014DE102010038035B4 Vorrichtung zur materialabtragenden Werkstückbearbeitung mit einer nach dem Bernoulli-Prinzip kontaktlos arbeitenden Werkstückhalteeinrichtung Device for the material workpiece machining with the Bernoulli principle contactless workpiece holder
08/21/2014DE102009023379B4 Erzeugen einer hydrophoben Oberfläche empfindlicher Dielektrika mit kleinem ε von Mikrostrukturbauelementen durch eine in-situ-Plasmabehandlung Generating a hydrophobic surface sensitive dielectrics with small ε microstructure devices by in-situ plasma treatment
08/21/2014DE102008054927B4 Halbleitergerät und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
08/21/2014DE102008044983B4 Verfahren zum Herstellen eines strukturierten verformten Substrats, insbesondere zur Herstellung verformter Transistoren mit geringerer Dicke der aktiven Schicht A method of manufacturing a structured substrate deformed, in particular for the production of deformed transistors with reduced thickness of the active layer
08/21/2014DE102008024519B4 Ferroelektrische Speicherzelle, Herstellungsverfahren und integrierte Schaltung mit der ferroelektrischen Speicherzelle A ferroelectric memory cell manufacturing process and integrated circuit with the ferroelectric memory cell
08/21/2014DE102007029433B4 Dynamischer Direktzugriffsspeicher Dynamic random access memory
08/21/2014DE102007004331B4 Halbleiterbauelement mit reduziertem mechanischen Stress Semiconductor device with reduced mechanical stress
08/21/2014DE102006002240B4 Schutzfilmausbildungsverfahren Protective film forming method
08/21/2014DE102005007821B4 Vorrichtung mit einem Montageträger A device with a mounting bracket
08/21/2014DE10164494B9 Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung An encapsulated device with a small overall height and methods for preparing
08/20/2014EP2768025A1 Photodiode array and method for manufacturing the same
08/20/2014EP2768020A2 Semiconductor devices and methods of fabricating the same
08/20/2014EP2768016A1 Exposure apparatus and method
08/20/2014EP2768015A1 Gold/silicon eutectic chip soldering method and transistor
08/20/2014EP2768014A1 Drive circuit substrate and manufacturing method therefor, display device, and electronic device
08/20/2014EP2768013A1 Crystal layered structure and method for manufacturing same, and semiconductor element
08/20/2014EP2768012A1 Method of detaching a disc-shaped single crystal from a base body using an electron beam
08/20/2014EP2767621A1 Methof for producing b-ga2o3 substrate and method for producing crystal laminate structure
08/20/2014EP2767620A1 P-doping of group-III-nitride buffer layer structure on a heterosubstrate
08/20/2014EP2767612A1 Cvd device, method for manufacturing susceptor in which cvd device is used, and susceptor
08/20/2014EP2767568A1 Polishing slurry, and polishing method
08/20/2014EP2767505A1 Memory device using graphene as charge-trap layer and method of operating the same
08/20/2014EP2766934A2 Semiconductor devices having a recessed electrode structure
08/20/2014EP2766933A1 Systems, devices, and methods with integrable fet-controlled lateral thyristors
08/20/2014EP2766932A1 Monolithic cell for an integrated circuit and especially a monolithic switching cell
08/20/2014EP2766927A1 Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements
08/20/2014EP2766926A1 Planarized semiconductor particles positioned on a substrate
08/20/2014EP2766925A1 Method for providing a connection between metal moulded bodies and a power semi-conductor which is used to join thick wires or strips
08/20/2014EP2766924A1 Production device and method for manufacturing microelectronic products
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