Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/19/2014US8808453 System for abating the simultaneous flow of silane and arsine
08/19/2014US8808446 Composition for resist underlayer film and process for producing same
08/19/2014US8807914 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber
08/19/2014US8807911 Transfer robot and equipment front end module including transfer robot with vent part
08/19/2014US8807905 Linear semiconductor processing facilities
08/19/2014US8807075 Shutter disk having a tuned coefficient of thermal expansion
08/19/2014US8807072 Coating device
08/19/2014US8806749 Two-phase, water-based immersion-cooling apparatus with passive deionization
08/19/2014US8806741 Method of making an electronic device
08/19/2014CA2715344C Semiconductor element module and method for manufacturing the same
08/14/2014WO2014124413A1 Multi-step deposition of ferroelectric dielectric material
08/14/2014WO2014124376A1 Method of forming metal contact opening
08/14/2014WO2014124044A1 Self-similar and fractal design for stretchable electronics
08/14/2014WO2014123708A1 Semiconductor processing systems having multiple plasma configurations
08/14/2014WO2014123667A1 Gas injection apparatus and substrate process chamber incorporating same
08/14/2014WO2014123662A1 Pvd rf dc open/closed loop selectable magnetron
08/14/2014WO2014123661A1 Arrays of memory cells and methods of forming an array of memory cells
08/14/2014WO2014123623A1 Ergonomic armrests for use with hotplate
08/14/2014WO2014123620A1 Electronic fuse having a damaged region
08/14/2014WO2014123582A1 Block co-polymer photoresist
08/14/2014WO2014123415A1 Method and apparatus for depositing atomic layers on a substrate
08/14/2014WO2014123413A1 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus
08/14/2014WO2014123318A1 Thinner composition and use thereof
08/14/2014WO2014123310A1 Substrate support and substrate treating apparatus having the same
08/14/2014WO2014122534A2 Wafer back side coating as dicing tape adhesive
08/14/2014WO2014122472A1 A bipolar junction transistor structure
08/14/2014WO2014105652A8 Short pulse fiber laser for ltps crystallization
08/14/2014WO2014100506A4 Grid for plasma ion implant
08/14/2014WO2014066268A9 Cross-linked organic polymer compositions
08/14/2014WO2014014661A8 Sensors in carrier head of a cmp system
08/14/2014US20140229134 Method of Calibrating Target Values and Processing Systems Configured to Calibrate the Target Values
08/14/2014US20140227945 Chemical mechanical planarization platen
08/14/2014US20140227890 Apparatus and methods for improving the intensity profile of a beam image used to process a substrate
08/14/2014US20140227889 Laser-based materials processing apparatus, method and applications
08/14/2014US20140227888 Remote plasma radical treatment of silicon oxide
08/14/2014US20140227887 Phenol-based self-crosslinking polymer and resist underlayer film composition including same
08/14/2014US20140227886 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
08/14/2014US20140227885 Method for the conditioning of flat objects
08/14/2014US20140227884 Process and apparatus for treating surfaces of wafer-shaped articles
08/14/2014US20140227883 Substrate processing apparatus and substrate processing method
08/14/2014US20140227882 Cleaning method, processing apparatus, and storage medium
08/14/2014US20140227881 Semiconductor processing systems having multiple plasma configurations
08/14/2014US20140227880 Combinatorial Plasma Enhanced Deposition and EtchTechniques
08/14/2014US20140227879 Methods for fabricating integrated circuits with improved semiconductor fin structures
08/14/2014US20140227878 Method for Manufacturing Small-Size Fin-Shaped Structure
08/14/2014US20140227877 Method of Forming a Metal Contact Opening with a Width that is Smaller than the Minimum Feature Size of a Photolithographically-Defined Opening
08/14/2014US20140227876 Semiconductor device manufacturing method
08/14/2014US20140227875 Method for exposing a layer
08/14/2014US20140227874 Elongated via structures
08/14/2014US20140227873 Semiconductor device and process for producing the same
08/14/2014US20140227872 Methods of forming conductive structures using a sacrificial liner layer
08/14/2014US20140227871 Formation of a Masking Layer on a Dielectric Region to Facilitate Formation of a Capping Layer on Electrically Conductive Regions Separated by the Dielectric Region
08/14/2014US20140227870 Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via
08/14/2014US20140227869 Methods of forming a semiconductor device by performing a wet acid etching process while preventing or reducing loss of active area and/or isolation regions
08/14/2014US20140227868 Semiconductor device and method for fabricating the same
08/14/2014US20140227866 Method of making a gas distribution member for a plasma processing chamber
08/14/2014US20140227865 Diffusion-agent composition, method for forming impurity-diffusion layer, and solar cell
08/14/2014US20140227864 Method for Producing Group III Nitride Semiconductor
08/14/2014US20140227863 Methods of forming a metal telluride material, related methods of forming a semiconductor device structure, and related semiconductor device structures
08/14/2014US20140227862 Semiconductor nanocrystals and methods
08/14/2014US20140227861 Bottom-Up PEALD Process
08/14/2014US20140227860 Workpiece cutting method
08/14/2014US20140227859 Diffusion resistor with reduced voltage coefficient of resistance and increased breakdown voltage using cmos wells
08/14/2014US20140227858 Shallow trench isolation integration methods and devices formed thereby
08/14/2014US20140227857 Methods of Fabricating Semiconductor Devices Including Fin-Shaped Active Regions
08/14/2014US20140227856 Methods of fabricating semiconductor device having shallow trench isolation (sti)
08/14/2014US20140227855 Semiconductor device having gate trench and manufacturing method thereof
08/14/2014US20140227854 Semiconductor device and fabricating method of the same
08/14/2014US20140227848 Semiconductor device and method of fabricationg the same
08/14/2014US20140227845 Methods of forming multiple n-type semiconductor devices with different threshold voltages on a semiconductor substrate
08/14/2014US20140227844 Method for fabricating integrated circuit with different gate heights and different materials
08/14/2014US20140227843 Method of manufacturing a semiconductor device
08/14/2014US20140227842 3d structured memory devices and methods for manufacturing thereof
08/14/2014US20140227838 Method of manufacturing semiconductor device
08/14/2014US20140227835 Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)
08/14/2014US20140227834 Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
08/14/2014US20140227832 Semiconductor packages and methods of packaging semiconductor devices
08/14/2014US20140227813 Method of manufacturing light emitting element
08/14/2014US20140227807 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
08/14/2014US20140227806 Method of manufacturing white light emitting device (led) and apparatus measuring phosphor film
08/14/2014US20140227804 System and Process to Remove Film from Semiconductor Devices
08/14/2014US20140227538 Anti-Reflective Coating for Photolithography and Methods of Preparation Thereof
08/14/2014US20140227527 Inorganic materials, methods and apparatus for making same, and uses thereof
08/14/2014US20140227462 Wiring structure for display device
08/14/2014US20140227440 Device and method for coating of a carrier wafer
08/14/2014US20140227147 Microfluidic Device and Method
08/14/2014US20140227072 Wafer transfer blade and wafer transfer apparatus having the same
08/14/2014US20140226690 Device package and methods for the fabrication and testing thereof
08/14/2014US20140226297 Method of manufacturing connection structure
08/14/2014US20140226241 Electrostatic discharge protection
08/14/2014US20140226144 Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
08/14/2014US20140226137 Pattern forming method and manufacturing method of semiconductor device
08/14/2014US20140225884 Light Emitting Device, Method of Driving a Light Emitting Device, Element Substrate, and Electronic Equipment
08/14/2014US20140225661 Semiconductor Device with Bypass Functionality and Method Thereof
08/14/2014US20140225647 Semiconductor Device and a Display Device
08/14/2014US20140225472 I-Layer Vanadium-Doped Pin Type Nuclear Battery and the Preparation Process Thereof
08/14/2014US20140225335 Substrate treatment apparatus
08/14/2014US20140225284 Low-cost chip package for chip stacks
08/14/2014US20140225280 Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device
08/14/2014US20140225279 Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief
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