Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/14/2014US20140225273 Chip package for high-count chip stacks
08/14/2014US20140225270 Method for off-grid routing structures utilizing self aligned double patterning (sadp) technology
08/14/2014US20140225266 Semiconductor device and manufacturing method for same
08/14/2014US20140225265 Functional material systems and processes for package-level interconnects
08/14/2014US20140225263 Semiconductor device and method for manufacturing semiconductor device
08/14/2014US20140225260 Solution process for improved nanowire electrodes and devices that use the electrodes
08/14/2014US20140225259 Semiconductor module system having encapsulated through wire interconnect (twi)
08/14/2014US20140225252 On-track reverse lithography to thin mask for fabrication of dark-field features
08/14/2014US20140225249 Semiconductor device and method for manufacturing semiconductor device
08/14/2014US20140225248 Power distribution and thermal solution for direct stacked integrated circuits
08/14/2014US20140225244 Method for embedding a chipset having an intermediary interposer in high density electronic modules
08/14/2014US20140225239 Resin-encapsulated semiconductor device and method of manufacturing the same
08/14/2014US20140225237 Chip scale package structure and manufacturing method thereof
08/14/2014US20140225236 Semiconductor device, semiconductor package, and electronic device
08/14/2014US20140225232 Reducing contamination during atomic layer deposition
08/14/2014US20140225231 Modulating bow of thin wafers
08/14/2014US20140225229 Group iii nitride composite substrate and method for manufacturing the same, and method for manufacturing group iii nitride semiconductor device
08/14/2014US20140225226 Multi-Step Deposition of Ferroelectric Dielectric Material
08/14/2014US20140225222 Package with metal-insulator-metal capacitor and method of manufacturing the same
08/14/2014US20140225219 FinFETs with Reduced Parasitic Capacitance and Methods of Forming the Same
08/14/2014US20140225218 Ion reduced, ion cut-formed three-dimensional (3d) integrated circuits (ic) (3dics), and related methods and systems
08/14/2014US20140225217 Semiconductor device and method of manufacturing the same
08/14/2014US20140225209 Semiconductor device, electrical device system, and method of producing semiconductor device
08/14/2014US20140225202 Chemical sensor and method for manufacturing such a chemical sensor
08/14/2014US20140225200 Enhancing MOSFET Performance With Corner Stresses of STI
08/14/2014US20140225198 Semiconductor device and method for fabricating the same
08/14/2014US20140225196 Semiconductor device and method of manufacturing the same
08/14/2014US20140225191 Laterally difffused metal oxide semiconductor device and method of forming the same
08/14/2014US20140225189 Method of fabricating semiconductor device
08/14/2014US20140225187 Device structure and manufacturing method using hdp deposited source-body implant block
08/14/2014US20140225186 Lateral extended drain metal oxide semiconductor field effect transistor (ledmosfet) with tapered airgap field plates
08/14/2014US20140225180 Dense arrays and charge storage devices
08/14/2014US20140225176 Embedded NVM in a HKMG Process
08/14/2014US20140225170 Semiconductor device and method of manufacturing the same
08/14/2014US20140225153 P type nitride semiconductor layer doped with carbon and devices including the p type nitride semiconductor layer doped with carbon
08/14/2014US20140225125 Composite Wafer and a Method for Manufacturing Same
08/14/2014US20140225121 AlGaN TEMPLATE FABRICATION METHOD AND STRUCTURE OF THE AlGaN TEMPLATE
08/14/2014US20140225113 Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same
08/14/2014US20140225112 Die testing using top surface test pads
08/14/2014US20140225111 Semiconductor device and method of manufacturing semiconductor device
08/14/2014US20140225110 Default Trim Code Technique
08/14/2014US20140225106 Thin film, method of forming thin film, semiconductor device including thin film, and method of manufacturing semiconductor device
08/14/2014US20140225067 Nanostructure, optical device including the same, and methods of manufacturing the nanostructure and the optical device
08/14/2014US20140225007 System and method for handling multiple workpieces for matrix configuration processing
08/14/2014US20140224887 Rfid tag
08/14/2014US20140224785 Apparatus to Improve Internal Wafer Temperature Profile
08/14/2014US20140224766 Groove Design for Retaining Ring
08/14/2014US20140224763 Joining method and joining system
08/14/2014US20140224661 Current ramping and current pulsing entry of substrates for electroplating
08/14/2014US20140224445 Metal Filling Device
08/14/2014US20140224427 Dry etching apparatus and clamp therefor
08/14/2014US20140224426 Substrate support unit and plasma etching apparatus having the same
08/14/2014US20140224425 Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
08/14/2014US20140224418 Method for producing electronic component
08/14/2014US20140224409 Sintering Utilizing Non-Mechanical Pressure
08/14/2014US20140224405 Room-temperature bonding apparatus
08/14/2014US20140224309 Compound thin-film solar cell and process for producing the same
08/14/2014US20140224303 Photovoltaic system for installation on roofs, with plastic support and photovoltaic module
08/14/2014US20140224281 Methods and apparatus for cleaning flip chip assemblies
08/14/2014US20140224177 Injection member in fabrication of semiconductor device and substrate processing apparatus having the same
08/14/2014US20140224173 Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
08/14/2014US20140223757 Substrate storage container and exposure apparatus
08/14/2014DE19758244B4 Photoresist-Copolymer auf der Basis von Bicycloalkenen, Verfahren zu dessen Herstellung und dessen Verwendung Photoresist-based copolymer of bicycloalkenes, process for its preparation and its use
08/14/2014DE112012005000T5 Solarzellenherstellungsverfahren und Solarzelle Solar cells and solar cell manufacturing process
08/14/2014DE112012004884T5 Strahlungsabschirmung für einen Substrathalter Radiation shield for a substrate holder
08/14/2014DE112012004824T5 Verfahren und Struktur zum Bilden von ETSOI-Kondensatoren, -Dioden, -Widerständen und - Back-Gate-Kontakten Method and structure for forming ETSOI capacitors, diodes, and -Widerständen - back-gate contacts
08/14/2014DE112012004608T5 Optischer Aufbau zur Linienerzeugung unter Verwendung eines Mikrolinsenarrays Optical setup for production line using a microlens array
08/14/2014DE112011105826T5 Halbleitervorrichtung und Verfahren zur Herstellung selbiger A semiconductor device and method for producing Selbiger
08/14/2014DE10337542B4 Bitleitungs-Vorladeschaltungen für ein Halbleiterspeicherbauelement Bit-line precharge circuits for a semiconductor memory device
08/14/2014DE10315532B4 Stromsensorvorrichtung in integrierter Ausführung und Verfahren zum Herstellen Current sensor apparatus of the integrated type and methods for preparing
08/14/2014DE10261600B4 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
08/14/2014DE102014101712A1 Halbleiterbauelement mit Umgehungsfunktionalität und Verfahren dafür Semiconductor component with bypass functionality and method therefor
08/14/2014DE102014101265A1 Verfahren zum Kalibrieren von Zielwerten und Verarbeitungssysteme, die zum Kalibrieren der Zielwerte konfiguriert sind A method for calibrating target values ​​and processing systems that are configured to calibrate the target values
08/14/2014DE102014100083A1 Verbundwafer und ein Verfahren zur Herstellung davon Bonded wafer and a method for preparation thereof
08/14/2014DE102013202458A1 Verfahren zum freilegen einer schicht A method for exposing a layer
08/14/2014DE102013201479A1 Verfahren zur Durchkontaktierung eines Halbleitersubstrats und Halbleitersubstrat Process for through-hole plating of a semiconductor substrate and the semiconductor substrate
08/14/2014DE102013201417A1 Verfahren zur Herstellung eines MID-Bauteils, MID-Bauteil A process for the preparation of a MID component, MID component
08/14/2014DE102009047639B4 Halbleiterelement, Fin-Feldeffekttransistor und integrierte Schaltung Semiconductor element, fin field effect transistor and integrated circuit
08/13/2014EP2765612A1 Ga2O3 SEMICONDUCTOR ELEMENT
08/13/2014EP2765611A2 Vertical gallium nitride transistors and methods of fabricating the same
08/13/2014EP2765610A1 Ga2o3 semiconductor element
08/13/2014EP2765607A1 Method for manufacturing a semiconductor layer having at least two different thicknesses
08/13/2014EP2765599A1 Method for manufacturing a transistor
08/13/2014EP2765598A2 Integrated half-bridge circuit with low side and high side composite switches
08/13/2014EP2765597A2 System for sintering using a pressurized gas or liquid
08/13/2014EP2765596A1 Ion implantation at high temperature surface equilibrium conditions
08/13/2014EP2765595A1 Exposure apparatus, exposure method, and method for producing a device
08/13/2014EP2765457A1 Composition for forming silicon-containing euv resist underlayer film
08/13/2014EP2765455A1 Phase shift mask, asymmetric pattern forming method, diffraction grating manufacturing method and semiconductor device manufacturing method
08/13/2014EP2765427A1 Probe unit
08/13/2014EP2765410A1 Gas sensor package
08/13/2014EP2765226A1 Gan film manufacturing method and composite substrate used in same
08/13/2014EP2765218A1 Method and apparatus for depositing atomic layers on a substrate
08/13/2014EP2764553A1 Method of manufacturing a solar cell with local back contacts
08/13/2014EP2764551A1 Methods of processing units comprising crystalline materials, and methods of forming semiconductor-on insulator constructions
08/13/2014EP2764550A1 Ram memory point with a transistor
08/13/2014EP2764542A2 Stub minimization for assemblies without wirebonds to package substrate
08/13/2014EP2764540A1 Gate array architecture with multiple programmable regions
08/13/2014EP2764538A2 High power semiconductor electronic components with increased reliability
08/13/2014EP2764537A1 Removing conductive material to form conductive features in a substrate
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