Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2014
08/26/2014US8815691 Method of fabricating a gate all around device
08/26/2014US8815690 Tunneling device and method for forming the same
08/26/2014US8815689 Method for fabricating a semiconductor device having a saddle fin transistor
08/26/2014US8815687 Methods of manufacturing semiconductor devices having spacers disposed on an inner sidewall of a contact hole formed in a layer of the semiconductor devices, and a contact plug disposed therein
08/26/2014US8815686 Lateral trench transistor, as well as a method for its production
08/26/2014US8815685 Methods for fabricating integrated circuits having confined epitaxial growth regions
08/26/2014US8815684 Bulk finFET with super steep retrograde well
08/26/2014US8815682 Semiconductor diode and method of manufacture
08/26/2014US8815681 Nonvolatile memory devices and methods of forming the same
08/26/2014US8815680 Non-volatile memory having nano crystalline silicon hillocks floating gate
08/26/2014US8815679 Structure of metal gate MIM
08/26/2014US8815678 Method for fabricating a metal-insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD)
08/26/2014US8815677 Method of processing MIM capacitors to reduce leakage current
08/26/2014US8815676 Three dimensional semiconductor memory device and method of fabricating the same
08/26/2014US8815674 Methods of forming a semiconductor device by performing a wet acid etching process while preventing or reducing loss of active area and/or isolation regions
08/26/2014US8815673 Methods of forming MOSFET devices using nitrogen-injected oxide layers to form gate insulating layers having different thicknesses
08/26/2014US8815672 Methods of manufacturing semiconductor devices
08/26/2014US8815671 Use of contacts to create differential stresses on devices
08/26/2014US8815670 Preventing Fin erosion and limiting EPI overburden in FinFET structures by composite hardmask
08/26/2014US8815669 Metal gate structures for CMOS transistor devices having reduced parasitic capacitance
08/26/2014US8815668 Preventing FIN erosion and limiting Epi overburden in FinFET structures by composite hardmask
08/26/2014US8815667 Transistors with an extension region having strips of differing conductivity type and methods of forming the same
08/26/2014US8815666 Power device and method for manufacturing the same
08/26/2014US8815665 Methods of manufacturing the gallium nitride based semiconductor devices
08/26/2014US8815664 Method for fabricating semiconductor device
08/26/2014US8815663 Method of manufacturing thin film transistor, thin film transistor manufactured using the method, method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured using the method
08/26/2014US8815662 Method for manufacturing SOI substrate and semiconductor device
08/26/2014US8815661 MIM capacitor in FinFET structure
08/26/2014US8815659 Methods of forming a FinFET semiconductor device by performing an epitaxial growth process
08/26/2014US8815658 Hetero-structured inverted-T field effect transistor
08/26/2014US8815657 Method of manufacturing semiconductor device
08/26/2014US8815656 Semiconductor device and method with greater epitaxial growth on 110 crystal plane
08/26/2014US8815655 Method for manufacturing semiconductor device
08/26/2014US8815654 Vertical current controlled silicon on insulator (SOI) device such as a silicon controlled rectifier and method of forming vertical SOI current controlled devices
08/26/2014US8815653 Packaging and connecting electrostatic transducer arrays
08/26/2014US8815652 Semiconductor device and method of manufacturing the same and semiconductor manufacturing device
08/26/2014US8815651 Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier
08/26/2014US8815650 Integrated circuit packaging system with formed under-fill and method of manufacture thereof
08/26/2014US8815649 Multi-layer lead frame package and method of fabrication
08/26/2014US8815647 Chip package and a method for manufacturing a chip package
08/26/2014US8815646 Semiconductor device adapted to improve heat dissipation
08/26/2014US8815645 Multi-chip stacking method to reduce voids between stacked chips
08/26/2014US8815644 Wafer processing method
08/26/2014US8815643 Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die
08/26/2014US8815642 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies
08/26/2014US8815641 Diamond SOI with thin silicon nitride layer and related methods
08/26/2014US8815640 Semiconductor device and method for manufacturing the same
08/26/2014US8815637 Conductive paste for photovoltaic cell and method of producing photovoltaic cell element using the same
08/26/2014US8815636 Oxides and glasses for use with aluminum back solar cell contacts
08/26/2014US8815635 Manufacturing method of photoelectric conversion device
08/26/2014US8815634 Dark currents and reducing defects in image sensors and photovoltaic junctions
08/26/2014US8815633 Method of fabricating 3D structure on CIGS material
08/26/2014US8815632 Order vacancy compound and method of manufacturing the same
08/26/2014US8815629 Method of manufacturing an optical reflector with semiconductor nanocrystals
08/26/2014US8815627 Method of manufacturing an ionizing radiation detection device
08/26/2014US8815626 Low-profile MEMS thermal printhead die having backside electrical connections
08/26/2014US8815625 Sensor and method of manufacture thereof
08/26/2014US8815624 Method of etching and singulating a cap wafer
08/26/2014US8815623 Method for manufacturing an intergrated pressure sensor
08/26/2014US8815622 Laser liftoff structure and related methods
08/26/2014US8815621 Method of forming p-type gallium nitride based semiconductor, method of forming nitride semiconductor device, and method of forming epitaxial wafer
08/26/2014US8815619 Method of manufacturing display unit
08/26/2014US8815618 Light-emitting diode on a conductive substrate
08/26/2014US8815617 Passivation of VCSEL sidewalls
08/26/2014US8815614 Method for improving prompt dose radiation response of mixed-signal integrated circuits
08/26/2014US8815613 Method of manufacturing touch sensing panel
08/26/2014US8815612 Ferroelectric memory device and fabrication process thereof, fabrication process of a semiconductor device
08/26/2014US8815495 Pattern forming method and manufacturing method of semiconductor device
08/26/2014US8815494 Resist underlayer film forming composition containing silicon having anion group
08/26/2014US8815400 Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof
08/26/2014US8815333 Manufacturing method of metal structure in multi-layer substrate
08/26/2014US8815123 Fabrication method for ibiiiavia-group amorphous compound and ibiiiavia-group amorphous precursor for thin-film solar cells
08/26/2014US8815112 Liquid processing method, recording medium having recorded program for executing liquid processing method therein and liquid processing apparatus
08/26/2014US8815110 Composition and method for polishing bulk silicon
08/26/2014US8815108 Method of depositing localized coatings
08/26/2014US8815107 Method of etching surface layer portion of silicon wafer and method of analyzing metal contamination of silicon wafer
08/26/2014US8815106 Method of supplying etching gas and etching apparatus
08/26/2014US8815071 Manipulation, detection, and assay of small scale biological particles
08/26/2014US8815048 Substrate processing apparatus and substrate processing method
08/26/2014US8815047 Plasma chemical reactor
08/26/2014US8815017 Method of manufacturing semiconductor device and method of cleaning semiconductor substrate
08/26/2014US8815012 Emissivity profile control for thermal uniformity
08/26/2014US8814954 Method of manufacturing products having a metal surface
08/26/2014US8814489 Substrate processing system and substrate processing method
08/26/2014US8814488 Substrate processing apparatus and semiconductor device manufacturing method
08/26/2014US8814298 Semiconductor device, method of manufacturing semiconductor device, and liquid discharge apparatus
08/26/2014US8814239 Techniques for handling media arrays
08/26/2014US8813678 Substrate processing apparatus
08/26/2014US8813353 Method of manufacturing a dielectric structure
08/26/2014CA2563775C Arrayed ultrasonic transducer
08/21/2014WO2014127150A1 Electrodes for semiconductor devices and methods of forming the same
08/21/2014WO2014127027A2 Method and apparatus for plasma dicing a semi-conductor wafer
08/21/2014WO2014126896A1 Vacuum chuck with polymeric embossments
08/21/2014WO2014126872A1 Non-conventional method of silicon wafer sawing using a plurality of wafer saw rotational angles
08/21/2014WO2014126849A1 Replaceable locking insert for susceptor interface
08/21/2014WO2014126798A1 Ion reduced, ion cut-formed three-dimensional (3d) integrated circuits (ic) (3dics), and related methods and systems
08/21/2014WO2014126318A1 Inlet and reacting system having the same
08/21/2014WO2014126001A1 Programmable logic device and semiconductor device
08/21/2014WO2014125317A1 Integrated circuit with integrated current sensor
08/21/2014WO2014125092A1 P-doping of group-iii-nitride buffer layer structure on a heterosubstrate