Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/23/2014US8842295 System having a plurality of scanning units of a position measuring device
09/23/2014US8842278 Exposure method, exposure apparatus, and device manufacturing method
09/23/2014US8842257 Substrate treatment method, substrate treatment apparatus, and non-transitory computer storage medium
09/23/2014US8842230 Liquid crystal display device
09/23/2014US8841783 Semiconductor device and method of manufacturing semiconductor device
09/23/2014US8841782 Integrated circuit package system with mold gate
09/23/2014US8841779 Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
09/23/2014US8841778 Three dimensional memory structure
09/23/2014US8841777 Bonded structure employing metal semiconductor alloy bonding
09/23/2014US8841775 Semiconductor device having groove-shaped via-hole
09/23/2014US8841773 Multi-layer interconnect structure for stacked dies
09/23/2014US8841771 Semiconductor device
09/23/2014US8841770 Semiconductor interconnect structure having enhanced performance and reliability
09/23/2014US8841769 Semiconductor device having metal plug and method of manufacturing the same
09/23/2014US8841767 Bumping process and structure thereof
09/23/2014US8841762 Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus
09/23/2014US8841760 Stacked semiconductor device and method of manufacturing the same
09/23/2014US8841759 Semiconductor package and manufacturing method thereof
09/23/2014US8841757 Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device
09/23/2014US8841756 Fabrication of optical-quality facets vertical to a (001) orientation substrate by selective epitaxial growth
09/23/2014US8841755 Through silicon via and method of forming the same
09/23/2014US8841754 Semiconductor devices with stress relief layers
09/23/2014US8841751 Through silicon vias for semiconductor devices and manufacturing method thereof
09/23/2014US8841749 Semiconductor device comprising a capacitor and an electrical connection via, and fabrication method
09/23/2014US8841748 Semiconductor device comprising a capacitor and an electrical connection via and fabrication method
09/23/2014US8841747 Capacitor structure with metal bilayer and method for using the same
09/23/2014US8841746 On-die programming of integrated circuit bond pads
09/23/2014US8841742 Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods
09/23/2014US8841737 MEMS device and process
09/23/2014US8841733 Semiconductor device and method of fabricating the same
09/23/2014US8841731 Integrated high-k/metal gate in CMOS process flow
09/23/2014US8841729 Semiconductor device and method of manufacturing semiconductor device
09/23/2014US8841728 Semiconductor device and method of manufacturing the same
09/23/2014US8841725 Semiconductor device having channel dose region and method for manufacturing semiconductor device
09/23/2014US8841722 Semiconductor device and method of forming the same
09/23/2014US8841716 Retrograde substrate for deep trench capacitors
09/23/2014US8841715 Floating body cell structures, devices including same, and methods for forming same
09/23/2014US8841711 Methods of increasing space for contact elements by using a sacrificial liner and the resulting device
09/23/2014US8841710 Semiconductor device and method for manufacturing the same
09/23/2014US8841706 Compound semiconductor device and manufacturing method of the same
09/23/2014US8841699 Semiconductor device including insulated gate bipolar transistor and diode
09/23/2014US8841698 Method for providing semiconductors having self-aligned ion implant
09/23/2014US8841692 Lead frame, its manufacturing method, and semiconductor light emitting device using the same
09/23/2014US8841686 Light emitting diode
09/23/2014US8841682 Transistors with a gate insulation layer having a channel depleting interfacial charge and related fabrication methods
09/23/2014US8841681 Wide-gap semiconductor substrate and method to fabricate wide-gap semiconductor device using the same
09/23/2014US8841680 Semiconductor device
09/23/2014US8841678 Thin-film transistor device and method for manufacturing thin-film transistor device
09/23/2014US8841674 Field transistor structure manufactured using gate last process
09/23/2014US8841668 Array substrate and method of manufacturing the same
09/23/2014US8841665 Method for manufacturing oxide thin film transistor
09/23/2014US8841661 Staggered oxide semiconductor TFT semiconductor device and manufacturing method thereof
09/23/2014US8841649 Three dimensional memory array architecture
09/23/2014US8841352 Method for producing semiconductor microparticles and the microparticles
09/23/2014US8841221 MOCVD reactor having cylindrical gas inlet element
09/23/2014US8841220 Gallium nitride based semiconductor light-emitting element, light source, and method for forming unevenness structure
09/23/2014US8841219 Lithography processes utilizing extreme ultraviolet rays and methods of manufacturing semiconductor devices using the same
09/23/2014US8841218 Resist underlayer composition and process of producing integrated circuit devices using same
09/23/2014US8841217 Chemical sensor with protruded sensor surface
09/23/2014US8841216 Method and composition for chemical mechanical planarization of a metal
09/23/2014US8841215 Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
09/23/2014US8841214 Dual damascene process
09/23/2014US8841213 Method for manufacturing interposer
09/23/2014US8841212 Method of making a copper interconnect having a barrier liner of multiple metal layers
09/23/2014US8841211 Methods for forming interconnect structures
09/23/2014US8841210 Semiconductor device manufacturing method and semiconductor device
09/23/2014US8841209 Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
09/23/2014US8841208 Method of forming vertical electronic fuse interconnect structures including a conductive cap
09/23/2014US8841207 Reusable substrates for electronic device fabrication and methods thereof
09/23/2014US8841206 Method of forming polycrystalline silicon layer, and thin film transistor and organic light emitting device including the polycrystalline silicon layer
09/23/2014US8841205 Manufacturing method and apparatus for semiconductor device
09/23/2014US8841204 High yield substrate assembly
09/23/2014US8841203 Method for forming two device wafers from a single base substrate utilizing a controlled spalling process
09/23/2014US8841202 Method of producing a hybrid substrate by partial recrystallization of a mixed layer
09/23/2014US8841201 Systems and methods for post-bonding wafer edge seal
09/23/2014US8841200 Simultaneously forming a through silicon via and a deep trench structure
09/23/2014US8841199 Semiconductor devices and methods of forming the same
09/23/2014US8841198 Isolation layer having a bilayer structure for a semiconductor device and method for forming the same
09/23/2014US8841197 Method for forming fin-shaped structures
09/23/2014US8841196 Selective deposition of silver for non-volatile memory device fabrication
09/23/2014US8841195 Semiconductor device with multi-layered storage node and method for fabricating the same
09/23/2014US8841194 Method of forming polysilicon layer and method of manufacturing thin film transistor using the polysilicon layer
09/23/2014US8841193 Semiconductor structure and method for slimming spacer
09/23/2014US8841192 Methods of forming silicide regions and resulting MOS devices
09/23/2014US8841191 Semiconductor device and method of manufacturing same
09/23/2014US8841189 Transistor having all-around source/drain metal contact channel stressor and method to fabricate same
09/23/2014US8841188 Bulk finFET with controlled fin height and high-K liner
09/23/2014US8841186 Manufacturing of a semiconductor device and corresponding semiconductor device
09/23/2014US8841185 High density bulk fin capacitor
09/23/2014US8841184 Dielectric layer for semiconductor device and method of manufacturing the same
09/23/2014US8841183 Nonvolatile semiconductor memory device and method for manufacturing the same
09/23/2014US8841182 Silane and borane treatments for titanium carbide films
09/23/2014US8841181 Method for fabricating semiconductor device and PMOS device fabricated by the method
09/23/2014US8841180 Strain-inducing semiconductor regions
09/23/2014US8841179 Nitride semiconductor device using selective growth and manufacturing method thereof
09/23/2014US8841178 Strained silicon nFET and silicon germanium pFET on same wafer
09/23/2014US8841177 Co-integration of elemental semiconductor devices and compound semiconductor devices
09/23/2014US8841175 Vertical trench IGBT and method for manufacturing the same
09/23/2014US8841174 Silicon controlled rectifier with integral deep trench capacitor
09/23/2014US8841173 Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof
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