Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/25/2014US20140289440 Systems and methods involving data bus inversion memory circuitry, configuration and/or operation
09/25/2014US20140287599 Substrate processing apparatus, process container, and method of manufacturing semiconductor device
09/25/2014US20140287598 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
09/25/2014US20140287597 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
09/25/2014US20140287596 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
09/25/2014US20140287595 Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Substrate Processing System and Non-Transitory Computer-Readable Recording Medium
09/25/2014US20140287594 Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
09/25/2014US20140287593 High throughput multi-layer stack deposition
09/25/2014US20140287592 Methods of forming a layer
09/25/2014US20140287591 Method for etching film containing cobalt and palladium
09/25/2014US20140287590 Optical Waveguide Structure and Method of Manufacture Thereof
09/25/2014US20140287589 Additive for resist underlayer film-forming composition and resist underlayer film-forming composition containing the same
09/25/2014US20140287588 Deposition Method and Deposition Apparatus
09/25/2014US20140287587 Method for Forming Fine Patterns of Semiconductor Device Using Directed Self-Assembly Process
09/25/2014US20140287586 Method of manufacturing semiconductor device
09/25/2014US20140287584 Microelectronic devices with through-silicon vias and associated methods of manufacturing
09/25/2014US20140287583 Electrically conductive paste for front electrode of solar cell and preparation method thereof
09/25/2014US20140287582 Method of manufacturing metal silicide layer
09/25/2014US20140287581 Through Silicon Via with Embedded Barrier Pad
09/25/2014US20140287580 Method for forming conductive structure, and plating apparatus and plating method
09/25/2014US20140287579 Methods for fabricating dual damascene structures in low temperature dielectric materials
09/25/2014US20140287578 Electroplating Methods for Fabricating Integrated Circuit Devices and Devices Fabricated Thereby
09/25/2014US20140287577 Methods for producing interconnects in semiconductor devices
09/25/2014US20140287576 Semiconductor device manufacturing method and semiconductor device
09/25/2014US20140287574 Method of manufacturing semiconductor device having field plate electrode
09/25/2014US20140287573 Semiconductor device manufacturing method
09/25/2014US20140287572 Manufacturing method of mis-type semiconductor device
09/25/2014US20140287571 Double-active-layer structure with a polysilicon layer and a microcrystalline silicon layer, method for manufacturing the same and its application
09/25/2014US20140287569 Method of manufacturing semiconductor device
09/25/2014US20140287568 Method for manufacturing semiconductor device and exposure mask used in the same method
09/25/2014US20140287567 Manufacturing method for semiconductor device
09/25/2014US20140287566 Method of making a semiconductor chip including identifying marks
09/25/2014US20140287563 Method of manufacturing semiconductor device
09/25/2014US20140287562 Method of fabricating a semiconductor device
09/25/2014US20140287561 Method for fabricating semiconductor device
09/25/2014US20140287558 Package including an interposer having at least one topological feature
09/25/2014US20140287557 Semiconductor device
09/25/2014US20140287555 Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
09/25/2014US20140287554 Method for plating a semiconductor package lead
09/25/2014US20140287553 Method for Forming Chip-on-Wafer Assembly
09/25/2014US20140287552 Method for processing thin film and method for manufacturing semiconductor device
09/25/2014US20140287546 Light-Emitting Device and Method for Manufacturing Light-Emitting Device
09/25/2014US20140287541 Semiconductor chip and semiconductor device
09/25/2014US20140287539 Film formation apparatus and film formation method
09/25/2014US20140287538 Warp correction device and warp correction method for semiconductor element substrate
09/25/2014US20140287536 Method of manufacturing a magnetoresistive-based device with via integration
09/25/2014US20140287373 Device for heating a substrate
09/25/2014US20140287245 Dense composite material, method for manufacturing the same, joined body, and member for semiconductor manufacturing apparatuses
09/25/2014US20140287170 Reflective liners
09/25/2014US20140287163 Method of forming copper wiring and method and system for forming copper film
09/25/2014US20140286741 Substrate processing systems and robot apparatus for transporting substrates in electronic device manufacturing
09/25/2014US20140286733 Load port and efem
09/25/2014US20140285980 Conversion of strain-inducing buffer to electrical insulator
09/25/2014US20140285943 Ceramic member and member for semiconductor manufacturing equipment
09/25/2014US20140285790 Substrate treating apparatus
09/25/2014US20140285122 Displacement devices and methods for fabrication, use and control of same
09/25/2014US20140284849 Method for manufacturing three-dimensional integrated circuit
09/25/2014US20140284821 Method of curing thermoplastics with microwave energy
09/25/2014US20140284816 Through silicon via wafer, contacts and design structures
09/25/2014US20140284814 Semiconductor device and manufacturing method thereof
09/25/2014US20140284813 Interconnect level structures for confining stitch-induced via structures
09/25/2014US20140284812 Forming array contacts in semiconductor memories
09/25/2014US20140284808 Stacked semiconductor device, and method and apparatus of manufacturing the same
09/25/2014US20140284807 Encapsulation process and associated device
09/25/2014US20140284803 Semiconductor package and fabrication method thereof
09/25/2014US20140284802 Semiconductor device and method of manufacturing the same
09/25/2014US20140284801 Semiconductor device and method for manufacturing same
09/25/2014US20140284799 Semiconductor device and method of manufacturing the same
09/25/2014US20140284798 Graphene wiring and method of manufacturing the same
09/25/2014US20140284797 Power semiconductor device fabrication method, power semiconductor device
09/25/2014US20140284796 Microelectronic devices and methods for filling vias in microelectronic devices
09/25/2014US20140284780 Method of manufacturing semiconductor device, and semiconductor device
09/25/2014US20140284778 Methods And Systems For Selectively Forming Metal Layers On Lead Frames After Die Attachment
09/25/2014US20140284775 Semiconductor device and method for manufacturing the same
09/25/2014US20140284773 Semiconductor device
09/25/2014US20140284772 Semiconductor device manufacturing method and semiconductor device thereof
09/25/2014US20140284770 Semiconductor device and method of manufacturing the same
09/25/2014US20140284769 Method of forming a strained silicon layer
09/25/2014US20140284768 Semiconductor on insulator structure with improved electrical characteristics
09/25/2014US20140284762 Integrated inductor and integrated inductor fabricating method
09/25/2014US20140284760 Integrated passive devices for finfet technologies
09/25/2014US20140284759 Semiconductor device and method of manufacturing the same
09/25/2014US20140284755 Semiconductor devices
09/25/2014US20140284749 Semiconductor device, method for manufacturing the same, and electronic device
09/25/2014US20140284728 Metal Silicide Thin Film, Ultra-Shallow Junctions, Semiconductor Device and Method of Making
09/25/2014US20140284726 Apparatus and Method for FinFETs
09/25/2014US20140284723 Finfets with different fin height and epi height setting
09/25/2014US20140284719 Method and structure for finfet cmos
09/25/2014US20140284698 Semiconductor device
09/25/2014US20140284689 Nonvolatile semiconductor memory device and method for manufacturing the same
09/25/2014US20140284686 Method for manufacturing semiconductor memory device and semiconductor memory device
09/25/2014US20140284685 Nonvolatile semiconductor memory device and method for manufacturing same
09/25/2014US20140284681 Semiconductor device and method for manufacturing semiconductor device
09/25/2014US20140284676 Semiconductor memory device and manufacturing method thereof
09/25/2014US20140284671 Semiconductor structure and process thereof
09/25/2014US20140284666 Insulated gate field effect transistor having passivated schottky barriers to the channel
09/25/2014US20140284661 Monolithic integrated circuit (mmic) structure and method for forming such structure
09/25/2014US20140284660 Method for manufacturing semiconductor wafer, and semiconductor wafer
09/25/2014US20140284641 Led packages and manufacturing method thereof
09/25/2014US20140284628 Wafer and method of fabricating the same
1 ... 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 ... 6590