Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2014
09/30/2014US8847221 Stacked semiconductor device and method of testing the same
09/30/2014US8847205 Spacer for a gate electrode having tensile stress and a method of forming the same
09/30/2014US8847203 Group III nitride epitaxial laminate substrate
09/30/2014US8847201 Quantum dots having composition gradient shell structure and manufacturing method thereof
09/30/2014US8847178 Charged particle beam writing apparatus and charged particle beam writing method
09/30/2014US8847122 Method and apparatus for transferring substrate
09/30/2014US8847113 Laser processing systems and methods for beam dithering and skiving
09/30/2014US8847104 Wafer cutting method and a system thereof
09/30/2014US8847059 Process for generating electrical energy in a semiconductor device and the corresponding device
09/30/2014US8846846 Naphthalene derivative, resist bottom layer material, and patterning process
09/30/2014US8846550 Silane or borane treatment of metal thin films
09/30/2014US8846549 Method of forming bottom oxide for nitride flash memory
09/30/2014US8846548 Post-passivation interconnect structure and methods for forming the same
09/30/2014US8846547 Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
09/30/2014US8846546 Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and recording medium
09/30/2014US8846545 Method of forming patterned thin film dielectric stack
09/30/2014US8846544 Reverse recovery using oxygen-vacancy defects
09/30/2014US8846543 Methods of atomic layer deposition of hafnium oxide / erbium oxide bi-layer as advanced gate dielectrics
09/30/2014US8846542 Methods for forming semiconductor constructions, and methods for selectively etching silicon nitride relative to conductive material
09/30/2014US8846541 Methods of forming fine patterns in semiconductor devices
09/30/2014US8846540 Semiconductor device with silicon-containing hard mask and method for fabricating the same
09/30/2014US8846539 Apparatus including showerhead electrode and heater for plasma processing
09/30/2014US8846538 Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
09/30/2014US8846537 Method for forming fine pitch structures
09/30/2014US8846536 Flowable oxide film with tunable wet etch rate
09/30/2014US8846535 Method of fabricating a semiconductor device
09/30/2014US8846534 Process for CMP with large feature size variation
09/30/2014US8846533 Cleaning solution for substrate for semiconductor device
09/30/2014US8846532 Method and apparatus for ultra thin wafer backside processing
09/30/2014US8846531 Method of manufacturing an ohmic electrode containing titanium, aluminum and silicon on a silicon carbide surface
09/30/2014US8846530 Method for forming semiconductor region and method for manufacturing power storage device
09/30/2014US8846529 Electroless plating of cobalt alloys for on chip inductors
09/30/2014US8846528 Method of modifying a low k dielectric layer having etched features and the resulting product
09/30/2014US8846527 Method for fabricating MOS transistors
09/30/2014US8846526 Through-hole substrate and method of producing the same
09/30/2014US8846525 Hardmask materials
09/30/2014US8846524 Plating process
09/30/2014US8846523 Process of forming through-silicon via structure
09/30/2014US8846522 Materials and methods of forming controlled void
09/30/2014US8846521 Method for manufacturing an electronic component package and electronic component package
09/30/2014US8846520 Semiconductor device and method for manufacturing semiconductor device
09/30/2014US8846519 Interconnections for fine pitch semiconductor devices and manufacturing method thereof
09/30/2014US8846518 Multilayer construction
09/30/2014US8846517 Methods of forming a pattern on a substrate
09/30/2014US8846516 Dielectric charge-trapping materials having doped metal sites
09/30/2014US8846515 Methods of forming electrical contacts
09/30/2014US8846514 Thin film transistor array panel and manufacturing method thereof
09/30/2014US8846513 Semiconductor device comprising replacement gate electrode structures and self-aligned contact elements formed by a late contact fill
09/30/2014US8846512 Incorporating impurities using a mask
09/30/2014US8846511 Methods of trimming nanowire structures
09/30/2014US8846510 Method and structure to boost MOSFET performance and NBTI
09/30/2014US8846509 Remote radical hydride dopant incorporation for delta doping in silicon
09/30/2014US8846508 Method of implanting high aspect ratio features
09/30/2014US8846507 Silicon polymers, methods of polymerizing silicon compounds, and methods of forming thin films from such silicon polymers
09/30/2014US8846506 Enhanced electron mobility at the interface between Gd2O3(100)/N-Si(100)
09/30/2014US8846505 Method of growing semiconductor micro-crystalline islands on an amorphous substrate
09/30/2014US8846504 GaN on Si(100) substrate using epi-twist
09/30/2014US8846503 Self-aligned and lateral-assembly method for integrating heterogeneous material structures on the same plane
09/30/2014US8846502 Methods for depositing thin films comprising gallium nitride by atomic layer deposition
09/30/2014US8846501 Method for equipping an epitaxy reactor
09/30/2014US8846500 Method of forming a gettering structure having reduced warpage and gettering a semiconductor wafer therewith
09/30/2014US8846499 Composite carrier structure
09/30/2014US8846498 Wafer dicing using hybrid multi-step laser scribing process with plasma etch
09/30/2014US8846496 Manufacturing method of single crystal semiconductor film and manufacturing method of electrode
09/30/2014US8846495 Bonding system and bonding method
09/30/2014US8846494 Alignment marks and alignment methods for aligning backside components to frontside components in integrated circuits
09/30/2014US8846493 Methods for producing silicon on insulator structures having high resistivity regions in the handle wafer
09/30/2014US8846492 Integrated circuit having a stressor and method of forming the same
09/30/2014US8846491 Forming a diffusion break during a RMG process
09/30/2014US8846490 Method of fabricating a FinFET device
09/30/2014US8846489 Method for forming trench isolation
09/30/2014US8846488 Semiconductor device and method for manufacturing the same
09/30/2014US8846487 Reduction of STI corner defects during SPE in semiconductor device fabrication using DSB substrate and hot technology
09/30/2014US8846486 Deep well structures with single depth shallow trench isolation regions
09/30/2014US8846485 Method for fabricating bottom electrode of capacitors of DRAM
09/30/2014US8846484 ReRAM stacks preparation by using single ALD or PVD chamber
09/30/2014US8846483 Method of manufacturing a phase change semiconductor device and the phase change semiconductor device
09/30/2014US8846482 Method and system for diffusion and implantation in gallium nitride based devices
09/30/2014US8846481 Transistor and method of forming the transistor so as to have reduced base resistance
09/30/2014US8846479 Semiconductor device and method for manufacturing semiconductor device
09/30/2014US8846478 Manufacturing method of semiconductor device
09/30/2014US8846477 Methods of forming 3-D semiconductor devices using a replacement gate technique and a novel 3-D device
09/30/2014US8846476 Methods of forming multiple N-type semiconductor devices with different threshold voltages on a semiconductor substrate
09/30/2014US8846475 Method for fabricating a semiconductor device
09/30/2014US8846474 Dual workfunction semiconductor devices and methods for forming thereof
09/30/2014US8846473 Low-resistance electrode design
09/30/2014US8846472 Method for fabricating semiconductor device
09/30/2014US8846471 Method for manufacturing a semiconductor device
09/30/2014US8846470 Metal trench capacitor and improved isolation and methods of manufacture
09/30/2014US8846469 Fabrication method of trenched power semiconductor device with source trench
09/30/2014US8846468 Methods to improve leakage of high K materials
09/30/2014US8846467 Silicidation of semiconductor devices
09/30/2014US8846466 Forming inter-device STI regions and intra-device STI regions using different dielectric materials
09/30/2014US8846465 Integrated circuit with multi recessed shallow trench isolation
09/30/2014US8846464 Semiconductor device having controlled final metal critical dimension
09/30/2014US8846463 Method to construct a 3D semiconductor device
09/30/2014US8846462 Transistor level routing
09/30/2014US8846461 Silicon layer for stopping dislocation propagation
09/30/2014US8846460 Semiconductor device and method for manufacturing the same
09/30/2014US8846459 Semiconductor device and method for manufacturing the same
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