Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2014
10/01/2014EP2784141A2 Anisotropic conductive film and method of making conductive connection
10/01/2014EP2783833A1 Imprinting device and imprinting method
10/01/2014EP2783791A1 Positioning device in the form of a portal
10/01/2014EP2783393A2 Protective layer for protecting tsv tips during thermo-compressive bonding
10/01/2014EP2783392A1 Spectral matching based calibration
10/01/2014EP2783391A1 Method for making contact with a semiconductor and contact arrangement for a semiconductor
10/01/2014EP2783390A1 Semiconductor substrate and method of forming
10/01/2014EP2783389A1 Assist layers for euv lithography
09/2014
09/30/2014US8849446 Vacuum processing apparatus and program
09/30/2014US8848472 Fabrication and testing method for nonvolatile memory devices
09/30/2014US8848455 Nonvolatile memory device and method for manufacturing the same
09/30/2014US8848381 Power semiconductor module and power semiconductor module system
09/30/2014US8848380 Bumpless build-up layer package warpage reduction
09/30/2014US8848336 Perovskite material with anion-controlled dielectric properties, thin film capacitor device, and method for manufacturing the same
09/30/2014US8848335 Electrostatic chuck
09/30/2014US8848334 Electrostatic chuck
09/30/2014US8848185 Optical system and method for measuring in three-dimensional structures
09/30/2014US8848075 Semiconductor device, manufacturing method thereof, and electronic apparatus
09/30/2014US8847621 Single event transient and upset mitigation for silicon-on-insulator CMOS technology
09/30/2014US8847619 Apparatus and methods for through substrate via test
09/30/2014US8847413 Integrated circuit package system with leads having multiple sides exposed
09/30/2014US8847412 Microelectronic assembly with thermally and electrically conductive underfill
09/30/2014US8847411 Semiconductor device and method of manufacturing the same
09/30/2014US8847409 Compliant micro-socket hybridization method
09/30/2014US8847406 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
09/30/2014US8847405 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof
09/30/2014US8847403 Semiconductor device including two groove-shaped patterns
09/30/2014US8847401 Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure
09/30/2014US8847400 Semiconductor device, method for manufacturing the same, and data processing device
09/30/2014US8847399 Semiconductor device and method of fabricating the same
09/30/2014US8847396 Semiconductor integrated circuit and fabricating the same
09/30/2014US8847395 Microelectronic device having metal interconnection levels connected by programmable vias
09/30/2014US8847394 Laminated structure, multilayer circuit board, active matrix substrate, and electronic display
09/30/2014US8847393 Vias between conductive layers to improve reliability
09/30/2014US8847383 Integrated circuit package strip with stiffener
09/30/2014US8847382 Thermoelectric cooler system, method and device
09/30/2014US8847380 Staged via formation from both sides of chip
09/30/2014US8847378 Semiconductor package
09/30/2014US8847377 Stacked wafer level package having a reduced size
09/30/2014US8847374 Power semiconductor module and manufacturing method thereof
09/30/2014US8847372 Exposed die overmolded flip chip package and fabrication method
09/30/2014US8847371 Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same
09/30/2014US8847370 Exposed die package that helps protect the exposed die from damage
09/30/2014US8847369 Packaging structures and methods for semiconductor devices
09/30/2014US8847366 Rectifier diode
09/30/2014US8847365 Inductors and methods for integrated circuits
09/30/2014US8847364 Removing conductive material to form conductive features in a substrate
09/30/2014US8847363 Method for producing group III nitride crystal
09/30/2014US8847362 Structure of thin nitride film and formation method thereof
09/30/2014US8847361 Memory cell layout
09/30/2014US8847360 Systems and methods for enabling ESD protection on 3-D stacked devices
09/30/2014US8847359 High voltage bipolar transistor and method of fabrication
09/30/2014US8847357 Opto-electronic device
09/30/2014US8847356 Component-built-in wiring board
09/30/2014US8847354 Metal-insulator-metal capacitors with high capacitance density
09/30/2014US8847353 Semiconductor device and data processing system using the same
09/30/2014US8847352 Active matrix device including first and second capacitor electrodes and multiple capacitors
09/30/2014US8847348 Complementary bipolar inverter
09/30/2014US8847347 Integrated circuit and IC manufacturing method
09/30/2014US8847337 Processes and mounting fixtures for fabricating electromechanical devices and devices formed therewith
09/30/2014US8847334 Method of forming lutetium and lanthanum dielectric structures
09/30/2014US8847333 Techniques providing metal gate devices with multiple barrier layers
09/30/2014US8847330 Semiconductor device
09/30/2014US8847327 Layout data creation device for creating layout data of pillar-type transistor
09/30/2014US8847325 Fin field-effect transistor structure
09/30/2014US8847324 Increasing ION /IOFF ratio in FinFETs and nano-wires
09/30/2014US8847323 finFET devices
09/30/2014US8847322 Dual polysilicon gate of a semiconductor device with a multi-plane channel
09/30/2014US8847320 Decoupling capacitor and layout for the capacitor
09/30/2014US8847317 Isolated epitaxial modulation device
09/30/2014US8847316 Semiconductor device and method of manufacturing the same
09/30/2014US8847315 Complementary metal-oxide-semiconductor (CMOS) device and method
09/30/2014US8847314 SOI substrate and manufacturing method of the same, and semiconductor device
09/30/2014US8847307 Power semiconductor devices, methods, and structures with embedded dielectric layers containing permanent charges
09/30/2014US8847306 Direct contact in trench with three-mask shield gate process
09/30/2014US8847305 Semiconductor device and manufacturing method thereof
09/30/2014US8847304 Semiconductor device
09/30/2014US8847301 Semiconductor device and method for manufacturing semiconductor device
09/30/2014US8847300 Semiconductor device and method for fabricating the same
09/30/2014US8847298 Pillars for vertical transistors
09/30/2014US8847295 Structure and method for fabricating fin devices
09/30/2014US8847294 Substrate including oxide thin film transistor, method for fabricating the same, and driving circuit for liquid crystal display device using the same
09/30/2014US8847293 Gate structure for semiconductor device
09/30/2014US8847292 Method for manufacturing semiconductor device and semiconductor device
09/30/2014US8847279 Defect reduction using aspect ratio trapping
09/30/2014US8847278 Semiconductor device comprising a breakdown withstanding section
09/30/2014US8847277 Reverse-conducting power semiconductor device
09/30/2014US8847269 Organic light-emitting device
09/30/2014US8847263 Sapphire substrate having triangular projections with outer perimeter formed of continuous curve
09/30/2014US8847262 Sapphire substrate having triangular projections with bottom sides formed of outwardly curved lines
09/30/2014US8847258 Organic electroluminescent devices
09/30/2014US8847249 Solid-state optical device having enhanced indium content in active regions
09/30/2014US8847243 Semiconductor package comprising an optical semiconductor device
09/30/2014US8847238 Semiconductor device which can withstand high voltage or high current and method for fabricating the same
09/30/2014US8847236 Semiconductor substrate and semiconductor substrate manufacturing method
09/30/2014US8847234 Thin film transistor, method fabricating thereof, liquid crystal display device and method for fabricating the same
09/30/2014US8847233 Semiconductor device having a trenched insulating layer coated with an oxide semiconductor film
09/30/2014US8847231 Organic light emitting display device and manufacturing method for the same
09/30/2014US8847229 Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device
09/30/2014US8847222 Semiconductor device test structures and methods
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