Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2014
10/02/2014US20140291863 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291862 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291861 Semiconductor device having groove-shaped via-hole
10/02/2014US20140291859 Electronic component built-in substrate and method of manufacturing the same
10/02/2014US20140291858 Method for making a photolithography mask intended for the formation of contacts, mask and integrated circuit corresponding thereto
10/02/2014US20140291857 Stacked structure and method of manufacturing the stacked structure
10/02/2014US20140291856 Tsv layout structure and tsv interconnect structure, and fabrication methods thereof
10/02/2014US20140291849 Multi-Level Semiconductor Package
10/02/2014US20140291847 Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system
10/02/2014US20140291844 Semiconductor device and manufacturing method thereof
10/02/2014US20140291842 Enhanced flip-chip die architecture
10/02/2014US20140291841 Semiconductor device, method for manufacturing same, and electronic component
10/02/2014US20140291839 Solder Joint Flip Chip Interconnection
10/02/2014US20140291838 Design Scheme for Connector Site Spacing and Resulting Structures
10/02/2014US20140291832 Integrated cooling modules of power semiconductor device
10/02/2014US20140291829 Adhesive bonding technique for use with capacitive micro-sensors
10/02/2014US20140291824 Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe
10/02/2014US20140291822 Integrated circuit package
10/02/2014US20140291820 Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die
10/02/2014US20140291819 Hybrid carbon-metal interconnect structures
10/02/2014US20140291818 Integrated Circuit Device Facilitating Package on Package Connections
10/02/2014US20140291817 Semiconductor device including porous low-k dielectric layer and fabrication method
10/02/2014US20140291816 Semiconductor device and method of manufacturing a semiconductor device with a continuous silicate glass structure
10/02/2014US20140291815 Processing a wafer for an electronic circuit
10/02/2014US20140291814 Insulating substrate, method of manufacturing the same, and semiconductor device
10/02/2014US20140291812 Semiconductor packages having an electric device with a recess
10/02/2014US20140291810 Methods for growing iii-v materials on a non iii-v material substrate
10/02/2014US20140291809 Semiconductor Substrate and a Method of Manufacturing the Same
10/02/2014US20140291807 Semiconductor device and method for manufacturing semiconductor device
10/02/2014US20140291799 Semiconductor device including sti structure and fabrication method
10/02/2014US20140291776 Methods of atomic-layer deposition of hafnium oxide/erbium oxide bi-layer as advanced gate dielectrics
10/02/2014US20140291774 Semiconductor device and method for manufacturing the same
10/02/2014US20140291772 Semiconductor devices with germanium-rich active layers and doped transition layers
10/02/2014US20140291770 Method of Making a FinFET Device
10/02/2014US20140291767 Semiconductor device and manufacturing method thereof
10/02/2014US20140291766 Planar device on fin-based transistor architecture
10/02/2014US20140291761 Asymmetric Spacers
10/02/2014US20140291741 Semiconductor device and fabrication method thereof
10/02/2014US20140291735 Double patterning via triangular shaped sidewall spacers
10/02/2014US20140291734 Thin Channel MOSFET with Silicide Local Interconnect
10/02/2014US20140291729 Memory unit, memory unit array and method of manufacturing the same
10/02/2014US20140291727 Method for forming semiconductor gate structure and semiconductor gate structure
10/02/2014US20140291725 Compound semiconductor device and method for manufacturing the same
10/02/2014US20140291695 Silicon Carbide Device and a Method for Manufacturing a Silicon Carbide Device
10/02/2014US20140291694 Planar nonpolar group-iii nitride films grown on miscut substrates
10/02/2014US20140291692 HIGH TEMPERATURE GaN BASED SUPER SEMICONDUCTOR AND FABRICATION PROCESS
10/02/2014US20140291680 Silicon member and method of producing the same
10/02/2014US20140291679 Semiconductor device
10/02/2014US20140291678 Semiconductor sensor reliability operation
10/02/2014US20140291669 Thin-Film Transistor, Method for Manufacturing the Same and Display Device Comprising the Same
10/02/2014US20140291606 Solution-assisted carbon nanotube placement with graphene electrodes
10/02/2014US20140291311 Heated electrostatic chuck and semiconductor wafer heater and methods for manufacturing same
10/02/2014US20140291289 Method for etching porous organosilica low-k materials
10/02/2014US20140291282 Wafer scale epitaxial graphene transfer
10/02/2014US20140291198 Reticle pod having gas guiding apparatus
10/02/2014US20140290863 Ceramic member, member for semiconductor manufacturing apparatus, and method for manufacturing ceramic member
10/02/2014US20140290859 Wet etching apparatus
10/02/2014US20140290858 Methods of forming a polymeric material via self-assembly of amphiphilic material and related template structures
10/02/2014US20140290857 Substrate processing apparatus
10/02/2014US20140290843 Method of preparing an adhesive film into a precut semiconductor wafer shape on a dicing tape
10/02/2014US20140290752 Processing method and processing apparatus
10/02/2014US20140290703 Substrate processing apparatus and substrate processing method
10/02/2014US20140290581 Deposition apparatus
10/02/2014US20140290573 Susceptor Support Portion and Epitaxial Growth Apparatus Including Susceptor Support Portion
10/02/2014US20140290566 Process of Surface Treatment for Wafer
10/02/2014US20140290564 Susceptor, vapor phase growth apparatus, and method of manufacturing epitaxial wafer
10/02/2014DE112013000362T5 Elektrisch programmierbare back-end-sicherung Electrically programmable back-end security
10/02/2014DE10238523B4 Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung An encapsulated electronic component and methods for making
10/02/2014DE102014204876A1 Inspektionsverfahren und Inspektionsvorrichtung Inspection method and inspection apparatus
10/02/2014DE102014202686A1 Verfahren zum Ausbilden von Grenzschichten für leitende Kupferstrukturen A method of forming boundary layers for copper conductive structures
10/02/2014DE102014202651A1 Halbleitervorrichtung und Halbleitermodul Semiconductor device and semiconductor module
10/02/2014DE102014104497A1 Halbleitergehäuse mit mehreren Ebenen Semiconductor package with multiple levels
10/02/2014DE102014104399A1 Leadframe, Halbleiterchipgehäuse umfassend einen Leadframe und ein Verfahren zur Herstellung eines Leadframe Lead frame, the semiconductor chip package comprising a lead frame and a method of manufacturing a lead frame
10/02/2014DE102014104236A1 Substratbearbeitungssystem und Substratbearbeitungsverfahren Substrate processing system and substrate processing method
10/02/2014DE102014104201A1 Eine Siliziumkarbidvorrichtung und ein Verfahren zum Ausbilden einer Siliziumkarbidvorrichtung A Siliziumkarbidvorrichtung and a method for forming a Siliziumkarbidvorrichtung
10/02/2014DE102014104171A1 Halbleiterbauelemente und Verfahren zum Herstellen von Halbleiterbauelementen Semiconductor devices and methods of manufacturing of semiconductor devices
10/02/2014DE102013205731A1 Siebdruckanlage zum Bedrucken von flächigen Substraten, insbesondere Solarzellen und Verfahren zum Bedrucken von Substraten Screen printing machine for printing sheetlike substrates, in particular solar cells and methods for printing substrates
10/02/2014DE102013205714A1 Organisches bauelement und herstellungsverfahren Organic-device and manufacturing processes
10/02/2014DE102013113030A1 Verfahren zur Kantenverrundung von Halbleiter-Wafern A method for edge rounding of semiconductor wafers
10/02/2014DE102013108106A1 Verpackungsmechanismen für Chips mit unterschiedlich großen Verbindern Packaging mechanisms for chips with different sized connectors
10/02/2014DE102013105426A1 Verfahren zum Laserritzen einer Solarzelle A method for laser scribing of a solar cell
10/02/2014DE102013103079A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
10/02/2014DE102012111785B4 Herstellverfahren für einen integrierten Halbleiterschaltkreis mit Metall-Gate und integrierter Halbleiterschaltkreis Manufacturing process for a semiconductor integrated circuit with metal gate and semiconductor integrated circuit
10/02/2014DE102004024659B4 Halbleiterbauteil Semiconductor device
10/01/2014EP2785152A1 Plasma generation source and vacuum plasma processing apparatus provided with same
10/01/2014EP2784837A1 Piezoelectric/electrostrictive element and wiring substrate
10/01/2014EP2784826A2 Method of manufacturing thin film solar cell and thin film solar cell manufactured by the method
10/01/2014EP2784825A1 Semiconductor device and method for manufacturing same
10/01/2014EP2784823A2 Semiconductor device and method for manufacturing the same
10/01/2014EP2784822A1 Semiconductor device
10/01/2014EP2784821A1 Silicon carbide semiconductor device and method for manufacturing same
10/01/2014EP2784806A1 Method for manufacturing semiconductor device
10/01/2014EP2784805A1 Method for manufacturing silicon carbide semiconductor device
10/01/2014EP2784804A1 PZT-based ferroelectric thin film and method of forming the same
10/01/2014EP2784803A2 Self-limiting etching method with multiple levels
10/01/2014EP2784802A1 Method of forming PNbZT ferroelectric thin film
10/01/2014EP2784587A1 Thermally reactive resist material, method for producing mold, mold, developing method, and pattern-forming material
10/01/2014EP2784585A1 Method for forming pattern, structural body, method for producing comb-shaped electrode, and secondary cell
10/01/2014EP2784180A1 Method for activating a copper surface for electroless plating
10/01/2014EP2784174A1 High-purity copper sputtering target
1 ... 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 ... 6590