Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2014
10/07/2014US8853079 Fuse device
10/07/2014US8853078 Method of depositing material
10/07/2014US8853077 Through silicon via packaging structures and fabrication method
10/07/2014US8853076 Self-aligned contacts
10/07/2014US8853075 Method for forming a titanium-containing layer on a substrate using an atomic layer deposition (ALD) process
10/07/2014US8853074 Method of manufacturing semiconductor device
10/07/2014US8853073 Method for producing vias
10/07/2014US8853072 Methods of forming through-substrate interconnects
10/07/2014US8853071 Electrical connectors and methods for forming the same
10/07/2014US8853070 Functionalization of a substrate
10/07/2014US8853069 Field effect transistor and method of fabrication
10/07/2014US8853068 Method of fabricating dual high-k metal gate for MOS devices
10/07/2014US8853067 Method of isolating nanowires from a substrate
10/07/2014US8853066 Method for manufacturing pixel structure
10/07/2014US8853065 Methods for fabricating semiconductor devices having reduced implant contamination
10/07/2014US8853064 Method of manufacturing substrate
10/07/2014US8853063 Method and system for carbon doping control in gallium nitride based devices
10/07/2014US8853061 Methods for manufacturing nonplanar graphite-based devices having multiple bandgaps
10/07/2014US8853060 Epitaxial process
10/07/2014US8853059 Method of uniform selenization and sulfurization in a tube furnace
10/07/2014US8853058 Method of making surface mount stacked semiconductor devices
10/07/2014US8853057 Method for fabricating semiconductor devices
10/07/2014US8853056 Wafer dicing using femtosecond-based laser and plasma etch
10/07/2014US8853055 Method for manufacturing semiconductor device, epitaxial substrate for use therein and semi-finished semiconductor device
10/07/2014US8853054 Method of manufacturing silicon-on-insulator wafers
10/07/2014US8853053 Capacitive element, manufacturing method of the same, solid-state imaging device, and imaging apparatus
10/07/2014US8853052 Method of manufacturing a semiconductor device
10/07/2014US8853051 Methods of recessing an active region and STI structures in a common etch process
10/07/2014US8853050 Methods of forming capacitors
10/07/2014US8853049 Single-sided non-noble metal electrode hybrid MIM stack for DRAM devices
10/07/2014US8853048 Streamlined process for vertical semiconductor devices
10/07/2014US8853047 Self aligned fin-type programmable memory cell
10/07/2014US8853046 Using TiON as electrodes and switching layers in ReRAM devices
10/07/2014US8853045 Low capacitance precision resistor
10/07/2014US8853044 Phase-change random access memory device and method of manufacturing the same
10/07/2014US8853043 Silicon germanium (SiGe) heterojunction bipolar transistor (HBT)
10/07/2014US8853042 Carbon and nitrogen doping for selected PMOS transistors on an integrated circuit
10/07/2014US8853041 Method for fabricating semiconductor device
10/07/2014US8853040 Strained thin body CMOS device having vertically raised source/drain stressors with single spacer
10/07/2014US8853039 Defect reduction for formation of epitaxial layer in source and drain regions
10/07/2014US8853038 Raised source/drain structure for enhanced strain coupling from stress liner
10/07/2014US8853037 Methods for fabricating integrated circuits
10/07/2014US8853036 Semiconductor device and method of manufacturing the same
10/07/2014US8853035 Tucked active region without dummy poly for performance boost and variation reduction
10/07/2014US8853034 Doped graphene films with reduced sheet resistance
10/07/2014US8853033 Method for fabricating semiconductor device
10/07/2014US8853032 Semiconductor device and method for manufacturing the same
10/07/2014US8853031 Resist underlayer film composition and patterning process using the same
10/07/2014US8853030 Method for production of selective growth masks using underfill dispensing and sintering
10/07/2014US8853029 Method of making vertical transistor with graded field plate dielectric
10/07/2014US8853028 Thin film transistor array substrate and method for fabricating the same
10/07/2014US8853026 Semiconductor device having deep wells and fabrication method thereof
10/07/2014US8853025 FinFET/tri-gate channel doping for multiple threshold voltage tuning
10/07/2014US8853024 Method of manufacturing semiconductor device
10/07/2014US8853023 Method for stressing a thin pattern and transistor fabrication method incorporating said method
10/07/2014US8853022 High voltage device
10/07/2014US8853021 Embedded transistor
10/07/2014US8853020 Method of manufacturing semiconductor device
10/07/2014US8853018 Method of manufacturing semiconductor device having multi-channels
10/07/2014US8853017 Organic thin film transistor, production method thereof, and electronic device
10/07/2014US8853016 Double gate thin-film transistor and OLED display apparatus including the same
10/07/2014US8853015 Method of forming a FinFET structure
10/07/2014US8853014 Method of fabricating a thin-film transistor
10/07/2014US8853013 Method for fabricating field effect transistor with fin structure
10/07/2014US8853012 Display device and method for manufacturing the same
10/07/2014US8853011 Repairing method, repairing device, and repairing structure for disconnected defect
10/07/2014US8853010 Semiconductor device and method of fabricating the same
10/07/2014US8853009 Method for manufacturing reverse-blocking semiconductor element
10/07/2014US8853008 Counter-doped low-power FinFET
10/07/2014US8853006 Method of manufacturing semiconductor device and semiconductor device
10/07/2014US8853005 Method for manufacturing semiconductor device
10/07/2014US8853004 Method of manufacturing semiconductor device
10/07/2014US8853003 Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
10/07/2014US8853002 Methods for metal bump die assembly
10/07/2014US8853001 Semiconductor device and method of forming pad layout for flipchip semiconductor die
10/07/2014US8853000 Package on package structrue and method for manufacturing same
10/07/2014US8852999 System-in-a-package based flash memory card
10/07/2014US8852998 Method to fabricate micro and nano diamond devices
10/07/2014US8852997 Method for removing residual extrinsic impurities in an N type ZnO or ZnMgO substrate, for P-type doping of this substrate
10/07/2014US8852995 Preparation method for patternization of metal electrodes in silicon solar cells
10/07/2014US8852994 Method of fabricating bifacial tandem solar cells
10/07/2014US8852993 Absorber layer for a thin film photovoltaic device with a double-graded band gap
10/07/2014US8852992 Method of manufacturing solar cell
10/07/2014US8852991 Methods of manufacturing solar cell
10/07/2014US8852989 Back-contact for thin film solar cells optimized for light trapping for ultrathin absorbers
10/07/2014US8852987 Method of manufacturing image pickup device
10/07/2014US8852985 Graphene pressure sensors
10/07/2014US8852984 Technique for forming a MEMS device
10/07/2014US8852983 Method of fabricating a capacitive environment sensor
10/07/2014US8852982 Photoelectric device and manufacturing method thereof
10/07/2014US8852981 Electrical contacts to nanostructured areas
10/07/2014US8852980 Laser-induced flaw formation in nitride semiconductors
10/07/2014US8852979 Micro-pattern forming method, and micro-channel transistor and micro-channel light-emitting transistor forming method using same
10/07/2014US8852978 Method of fabricating a thin film transistor and method of fabricating an organic light-emitting display device
10/07/2014US8852977 Method for producing light-emitting elements
10/07/2014US8852976 Method for manufacturing semiconductor light emitting device
10/07/2014US8852975 Array substrate for fringe field switching mode liquid crystal display device and method for fabricating the same
10/07/2014US8852974 Semiconductor light-emitting device and method for manufacturing the same
10/07/2014US8852972 Semiconductor light emitting device and method of manufacturing the same
10/07/2014US8852971 Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object