Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
10/1995
10/12/1995EP0701636A4 Method and apparatus for the electrolytic production of copper wire
10/12/1995DE4412463A1 Palladiumkolloid-Lösung und deren Verwendung Palladium colloid solution and the use thereof
10/11/1995CN1109923A Surface-treated wire for use in composite elements of elastomeric material and manufacturing process
10/03/1995US5454926 Electrodeposited copper foil
10/03/1995CA1337188C Massive anode as a mosaic of modular anodes
09/1995
09/28/1995WO1995025908A1 Sliding bearing
09/27/1995CN1109200A Lead-provided porous metal sheet and method for manufacturing the sheet
09/26/1995US5453293 Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
09/26/1995US5453173 Process for manufacturing a three-dimensional electroformed mold shell
09/13/1995EP0670914A1 Sliding element and process for producing the same.
09/05/1995US5447615 Plating device for wafer
08/1995
08/30/1995EP0669409A1 Surface-treated wire for use in composite elements of elastomeric material and relative manufacturing process
08/23/1995EP0668374A1 Process for electroplating one or both sides of a thin polymer foil provided with a conductive coating
08/22/1995US5443707 Apparatus for electroplating the main surface of a substrate
08/16/1995EP0667403A1 Method of manufacturing tin plated strips or plates of copper or copper alloy
08/16/1995EP0666936A1 Device for electrolytically coating one side of metal strips.
08/15/1995US5441629 Automatic transfer of substrate using robot that moves only in vertical or horizontal directions
08/15/1995US5441619 Electroplating apparatus
08/15/1995CA1336697C Method and apparatus for the electrolytic coating of one side of a moving metal strip
08/10/1995DE4402596A1 Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben The same electrolytic process in horizontal flow systems and apparatus for carrying out
08/03/1995WO1995020692A1 Process and device for the electrolytic metal coating or etching of articles
08/01/1995US5437777 Apparatus for forming a metal wiring pattern of semiconductor devices
08/01/1995US5437733 A treatment liquid held between the surface and liquid holder having apertures; noncontamination; cleaning and etching semiconductor; removing photoresists
07/1995
07/26/1995EP0579701B1 Process for the metallization of non-conductors, in particular circuit boards, using nitrogen-containing quaternary salts in the process
07/19/1995EP0580730B1 Electrode for an electrolytic cell, use thereof and method using same
07/18/1995US5433840 Polyoxyalkylene glycol ethers, copper salts and acid
07/13/1995WO1995018849A1 Cracking processes
07/12/1995CN1029326C Deep-hole sizing chromate plating technology and its device
07/05/1995EP0661471A1 Sliding parts and method of producing same
07/05/1995EP0590046A4 Mildly basic accelerating solutions for direct electroplating.
07/05/1995CN1104688A Process for renovating crank shaft by forcing electroplating of iron
07/04/1995US5429733 Plating device for wafer
06/1995
06/29/1995WO1995017534A1 Metallic screen material having a strand or fibre structure, and method for manufacturing such a material
06/29/1995CA2179527A1 Metallic screen material having a strand or fibre structure, and method for manufacturing such a material
06/20/1995US5425862 Apparatus for the electroplating of thin plastic films
06/20/1995CA1335972C Selective electroplating apparatus and method of using same
06/14/1995EP0657950A1 Lead-provided porous metal sheet and method for manufacturing the sheet
06/11/1995CA2136804A1 Lead-provided porous metal sheet and method for manufacturing the sheet
06/06/1995US5421986 Method of regulating electro-deposition onto a metal strip
06/06/1995US5421985 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
05/1995
05/31/1995EP0614498B1 Device for the electrolytic deposition of metal on metal strips
05/31/1995CN1103233A Method for manufacturing printed circuit board
05/26/1995WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method
05/26/1995WO1995014122A1 Process and apparatus for in situ electroplating a structural layer of metal bonded to an internal wall of a metal tube
05/26/1995WO1995014121A1 Metal tube having a section with an internal electroplated structural layer
05/23/1995US5417841 Copper plating of gravure rolls
05/23/1995US5417830 Injection plating apparatus
05/18/1995WO1995013408A1 Device and process for the electrolytic separation of metals with the aid of a rotating cathode system
05/18/1995CA2153576A1 Device and process for the electrolytic separation of metals with the aid of a rotating cathode system
05/17/1995EP0653503A1 Method for making a gun barrel with wear resistant internal coating
05/17/1995EP0652981A1 Minimization of mounds in iron-zinc electrogalvanized sheet.
05/03/1995CN2196128Y Highly efficient multiple wire electroplating machine
05/02/1995CA1335440C Automatic plant for continuous electroplating treatment of metal bars
04/1995
04/20/1995DE4418278C1 Electrolytic process for treatment of printed circuit boards in horizontal continuous plants
04/19/1995EP0567466B1 Apparatus for improved current transfer in radial cell electroplating
04/13/1995WO1995009939A1 Device for the selective treatment of the surface of workpieces by flooding the workpieces with a treatment liquid
04/12/1995EP0409926B1 Process for treating the surfaces entering into contact of two metallic parts designed to move in a vacuum relative to each other; and support structure for a fragile element
04/04/1995US5403467 Forming through-holes in copper-laminated circuit boards, oxidizing with alkaline potassium permanganate solution, rinsing with water, treating with 3,4-ethylenedioxythiophene emulsion and acid, rinsing, electrodepositing copper
03/1995
03/28/1995US5401910 Electronic component
03/21/1995US5399248 Clamping device for gravure printing cylinders to be processed in an electroplating plant
03/15/1995CN1027938C Method for making aluminium-core copper wire and its products
03/14/1995US5397453 Semiconductor product plating apparatus
03/08/1995EP0641875A1 Surface treatment device
03/08/1995EP0641874A1 Surface treatment device
03/02/1995DE4429522A1 Method for the production of printed circuit boards
03/01/1995EP0641152A1 Process for forming a circuit with a laser and component formed thereby
02/1995
02/28/1995US5393395 Method of surface-treating a half sliding bearing and apparatus for same
02/21/1995US5391285 Adjustable plating cell for uniform bump plating of semiconductor wafers
02/15/1995EP0638669A1 Electroplating process and composition
02/14/1995US5389446 Having coating layer of chromium oxide, nickel and either or both of zinc and zinc oxide
02/14/1995US5389220 Apparatus for a continuous selective electrodeposition on a strip
02/14/1995US5389163 Method for producing a rubber-reinforced steel wire
02/08/1995EP0637640A2 Plating system
01/1995
01/31/1995CA1334184C Process and device for continuous electrolytic treatment of metals
01/25/1995EP0635073A1 Method of producing lamellar material or lamellar parts for plain bearings
01/24/1995US5384204 Tape automated bonding in semiconductor technique
01/10/1995US5380407 Corrosion resistance, plating with copper and zinc for steels
12/1994
12/28/1994EP0631313A1 Semiconductor device containing a through hole
12/27/1994US5376194 Slide surface construction having oriented F.C.C. metal layer
12/21/1994CN2185753Y Ring wire stock electroplating device
12/20/1994US5374346 Dissolving metal surface underlying semiconductor coating; removing coating by high pressure water spray
12/20/1994US5373629 Through-hole plate printed circuit board with resist and process for manufacturing same
12/13/1994US5372699 Method and apparatus for selective electroplating of metals on products
12/07/1994EP0627021A1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process.
11/1994
11/24/1994WO1994026958A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating
11/24/1994WO1994026435A1 Wire plating
11/24/1994CA2162905A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating
11/23/1994CN2183374Y Ring-shape wire electroplating machine
11/22/1994US5366814 Copper foil for printed circuits and process for producing the same
11/15/1994US5364523 Method of electroplating half sliding bearings
11/15/1994US5364202 Holding device for hollow-cylinder printing formes
11/15/1994CA1333060C Conductor roll profile adjustment
11/02/1994EP0489759B1 Process for producing a plated-through printed circuit board
11/02/1994EP0454710B1 Process for electrolytic deposition of metals on one or both sides of strips
10/1994
10/27/1994WO1994024340A1 Device for pre-treating and/or coating the running surfaces of cylinders
10/27/1994WO1994021097A3 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
10/26/1994EP0621353A1 Process for controlling the electroplating of a metal strip
10/23/1994CA2120080A1 Method of regulating electro-deposition onto a metal strip
10/18/1994US5356527 Rinsing in aqueous buffer solution of alkali metal or alkaline earth metal phosphates or borates maintained at specified pH
10/12/1994EP0583426A4 Improved process for preparing a nonconductive substrate for electroplating.