| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 01/31/2008 | DE102006035233A1 Galvanische Oberflächenbeschichtung eines Bauteils Galvanic surface coating of a component |
| 01/30/2008 | EP1882759A2 Galvanic surface plating of a component |
| 01/30/2008 | CN101115869A Method for treating surfaces of hollow parts, tank for carrying out a method of this type, installation for continuously treating surfaces comprising such a tank |
| 01/29/2008 | US7323097 Electroplating method for a semiconductor device |
| 01/29/2008 | US7323095 Integrated multi-step gap fill and all feature planarization for conductive materials |
| 01/29/2008 | US7323094 For electroplating metal-containing layers on semiconductor substrates |
| 01/24/2008 | WO2008009439A1 Clamping device for printing cylinder |
| 01/24/2008 | WO2008009325A1 Device for the surface treatment of a workpiece |
| 01/24/2008 | US20080017400 Element, Thin Film Transistor and Sensor Using the Same, and Method of Manufacturing Element |
| 01/24/2008 | DE10344724B4 Verfahren zum Herstellen eines wenigstens ein Lagerauge bildenden Werkstückes A method for producing at least one bearing eye of a forming workpiece |
| 01/24/2008 | DE102007033333A1 Manufacturing surface of packing plate/ -foil for lithographic printing, by producing negative mold of structured exit surface, producing set of positive molds of the exit surface, and selecting the surface from the series of positive molds |
| 01/24/2008 | DE102006033353A1 Treatment process for flat brittle substrate involves blowing or sucking treatment fluid away from contact region between contact device and contact surface of substrate |
| 01/23/2008 | CN101109095A Process and device for treating flat brittle substrate |
| 01/17/2008 | US20080011609 Method and Apparatus for Controlling Vessel Characteristics, Including Shape and Thieving Current For Processing Microfeature Workpieces |
| 01/17/2008 | US20080011352 Photovoltaic solar cell |
| 01/17/2008 | DE10234705B4 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen Electroplating and plating system for coating already formed conductive structures |
| 01/16/2008 | EP1075606B1 Multi-layer engine bearings and method of manufacture |
| 01/15/2008 | US7318963 Composite chromium plating film and sliding member having the same and method for manufacture thereof |
| 01/10/2008 | WO2008004558A1 Process for producing ornamental plated article with use of conversion of resin to conductive one by sputtering, and hanging jig for fixing of resin molding |
| 01/10/2008 | US20080008938 Preparation and application of LiFePO4/Li3V2 (PO4)3 composite cathode materials for lithium ion batteries |
| 01/10/2008 | US20080006911 Silver layer formed by electrosilvering substrate material |
| 01/10/2008 | US20080006307 Substrate proximity processing structures |
| 01/09/2008 | EP1876267A2 Silver layer formed by electrosilvering substrate material |
| 01/09/2008 | EP1875279A1 A method of forming mirrors on a conducting substrate |
| 01/09/2008 | EP1492907A4 Electropolishing and/or electroplating apparatus and methods |
| 01/09/2008 | EP1408380B1 Method of producing a protective security hologram |
| 01/09/2008 | CN101101950A Silver layer formed by electrosilvering substrate material |
| 01/09/2008 | CN100361234C Method for increasing the copper to superconductor ratio in a superconductor wire |
| 01/09/2008 | CN100360269C Method of connecting module layers suitable for the production of microstructure components and a microstructure component |
| 01/08/2008 | US7316772 Immersing substrate into an electroplating bath including ionic copper and defect reducing agent; electroplating copper deposit from bath onto substrate to fill submicron-sized reliefs whereby occurrence of protrusion defects are reduced |
| 01/08/2008 | US7316602 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing |
| 01/03/2008 | WO2008001807A1 Metal wire rod plating insoluble anode and production method of wire rod |
| 01/03/2008 | WO2008001536A1 Negative electrode for non-aqueous electrolyte secondary battery |
| 01/03/2008 | WO2008001533A1 Negative electrode for non-aqueous electrolyte secondary battery |
| 01/03/2008 | US20080000777 Electroplating using an apparatus having a preferential barrier between electrodes, comprising adjustable apertures used for controlling the amount of electric flux and the distribution of coatings on substrates such as electronics and semiconductor chips |
| 01/02/2008 | EP1499451A4 Minimizing whisker growth in tin electrodeposits |
| 01/02/2008 | CN101099285A Process for producing permanent magnet for use in automotive ipm motor |
| 01/02/2008 | CN101096770A Electroplating method |
| 01/02/2008 | CN100359994C Chip-on-film use copper foil |
| 01/02/2008 | CN100359680C Lead frame and method for manufacturing the same |
| 01/02/2008 | CN100359657C Bonding wire and an integrated circuit device using the same |
| 01/02/2008 | CN100358644C Metal wire on-line purger |
| 01/01/2008 | US7314543 Tin deposition |
| 12/27/2007 | WO2007147818A2 An apparatus and method for electroplating a substrate in a continuous way |
| 12/27/2007 | US20070297937 Method of Forming Sn-Ag-Cu Ternary Alloy Thin-Film on Base Material |
| 12/27/2007 | US20070295530 Coatings and methods for inhibiting tin whisker growth |
| 12/26/2007 | EP1870496A1 An apparatus and method for electroplating a substrate in a continuous way. |
| 12/26/2007 | EP1868813A2 Surface-treated doctor blade |
| 12/26/2007 | CN100357496C Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and |
| 12/26/2007 | CN100357495C Method for producing electroplating coat |
| 12/25/2007 | US7312151 System for ultraviolet atmospheric seed layer remediation |
| 12/25/2007 | US7312149 Copper plating of semiconductor devices using single intermediate low power immersion step |
| 12/25/2007 | US7311811 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
| 12/25/2007 | US7311809 Plating apparatus for substrate |
| 12/25/2007 | US7310859 Water-permeable drum for the hydrodynamic needling textile webs and method of making the drum |
| 12/21/2007 | WO2007145164A1 Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil |
| 12/20/2007 | US20070292710 Method for repairing components using environmental bond coatings and resultant repaired components |
| 12/20/2007 | US20070289873 Method of wafer plating |
| 12/20/2007 | US20070289872 Process for forming organic films on electrically conductive or semi-conductive surfaces using aqueous solutions |
| 12/20/2007 | US20070289867 Apparatus for enhanced electrochemical deposition |
| 12/19/2007 | EP1694885A4 Multi-chemistry plating system |
| 12/19/2007 | EP1419523A4 Dummy structures to reduce metal recess in electropolishing process |
| 12/18/2007 | US7309413 Providing electrical contact to the surface of a semiconductor workpiece during processing |
| 12/18/2007 | US7309411 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 12/18/2007 | US7309407 Method and apparatus for forming an electrical contact with a semiconductor substrate |
| 12/18/2007 | US7309406 Method and apparatus for plating and polishing semiconductor substrate |
| 12/13/2007 | WO2007142747A2 Selective plating system |
| 12/13/2007 | WO2007140949A1 Apparatus for electrolytic deposition on surfaces and electroplating system |
| 12/13/2007 | US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component |
| 12/13/2007 | US20070284256 Selective plating system |
| 12/12/2007 | EP1865094A1 Apparatus for electrochemical deposition on surfaces and electrochemical system |
| 12/12/2007 | EP1865093A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
| 12/12/2007 | CN101086082A Laser printer metal base image-fixing film electrodeposition device |
| 12/12/2007 | CN100355021C 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method |
| 12/11/2007 | US7306710 Rotating support; partial immersion of combustion chamber within plating solution |
| 12/06/2007 | WO2007139133A1 Plated steel plate for battery can, battery, and alkaline dry battery |
| 12/06/2007 | WO2007139072A1 Cu-Zn ALLOY STRIP EXCELLENT IN THERMAL SEPARATION RESISTANCE FOR Sn PLATING AND Sn-PLATED STRIP THEREOF |
| 12/06/2007 | WO2007137445A1 Component made of two non-positively joined work pieces |
| 12/06/2007 | WO2007034116A3 Electroplating composition for coating a substrate surface with a metal |
| 12/05/2007 | CN200985366Y Device for filtering forming liquid |
| 12/05/2007 | CN101081554A Heat resistant film, its manufacturing method, and electrical and electronic parts |
| 12/05/2007 | CN100353819C Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board |
| 12/05/2007 | CN100353519C Method for forming copper teading wires in semiconductor device |
| 12/04/2007 | US7303939 Electro- and electroless plating of metal in the manufacture of PCRAM devices |
| 12/04/2007 | CA2283850C Method for manufacturing a stent |
| 11/29/2007 | WO2007136024A1 Method of pretreatment for plating and water service instrument made of lead-containing copper alloy |
| 11/29/2007 | WO2007135972A1 Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier sheet |
| 11/29/2007 | US20070272441 Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device |
| 11/29/2007 | US20070271978 applying coating to sheet made of hardenable steel alloy, where coating comprises zinc and one or several elements with affinity to oxygen in a total amount of 0.1-15 weight-% in relation to total coating; after applying coating the sheet steel is roller-profiled; cathodic corrosion protection |
| 11/29/2007 | DE112005000216T5 Folie zur Abschirmung elektromagnetischer Wellen und Verfahren zu deren Herstellung Film for shielding electromagnetic waves, and methods for their preparation |
| 11/29/2007 | DE10344722B4 Verfahren zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes A method of manufacturing a bearing eye having at least one workpiece |
| 11/29/2007 | DE10344720B4 Verfahren zum Herstellen eines wenigstens ein Lagerauge aufweisenden Werkstückes A method of manufacturing a bearing eye having at least one workpiece |
| 11/29/2007 | DE10340615B4 Verfahren zum Herstellen einer biaxial strukturierten metallischen Schicht und nach dem Verfahren hergestellte Schicht A method for preparing a biaxially textured metallic layer and prepared by the process layer |
| 11/28/2007 | EP1446514A4 Electropolishing assembly and methods for electropolishing conductive layers |
| 11/28/2007 | CN100351434C Electroplating device and method thereof |
| 11/27/2007 | US7300562 Electrodeposition of noble metal and one other metal for alloying with noble metal on the surface of a microelectronic workpiece, using an acid bath; electrolysis |
| 11/22/2007 | WO2007132529A1 Metal composite film and process for producing the same |
| 11/22/2007 | WO2002063069A3 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 11/22/2007 | DE10358147C5 Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen Method and apparatus for treating a level well in continuous flow systems |
| 11/22/2007 | DE102006018052B3 Device for galvanic coating of non-magnetic silicon substrate wafer for microelectronics, has permanent- and/or electromagnets with magnetic stray field strengths arranged on a back side of the silicon surface/on the substrate holder |