| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
|---|
| 07/17/2008 | US20080171141 Led array |
| 07/17/2008 | US20080169334 Copper welding solid wire with good arc stability |
| 07/16/2008 | EP1185151B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/16/2008 | CN101223839A Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
| 07/16/2008 | CN101223301A Retainer for rolling bearing and rolling bearing |
| 07/16/2008 | CN101220500A Wafer convex point producing hanging fixture |
| 07/16/2008 | CN101220499A Copper pre-plating conductive pole protecting equipment |
| 07/16/2008 | CN101220498A Multiple-grooved type coil stock continuously plating product line frame |
| 07/16/2008 | CN101220492A Proximity processing using controlled batch volume with an integrated proximity head |
| 07/10/2008 | WO2008082004A1 Plating member and process for producing the plating member |
| 07/10/2008 | WO2008081689A1 Roll unit dipped in surface treatment liquid |
| 07/10/2008 | WO2008081688A1 Roll unit for use in surface treatment of copper foil |
| 07/10/2008 | US20080163928 Comprising zinc, tellurium, manganese; photovoltaically active semiconductor material consists of a metal halide comprising a metal selected from germanium, tin, antimony, bismuth and copper and a halogen selected from fluorine, chlorine, bromine and iodine |
| 07/09/2008 | EP1941081A1 Electrode surface coating and method for manufacturing the same |
| 07/09/2008 | EP1527216B1 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied |
| 07/09/2008 | CN201082906Y Wire surface processor |
| 07/09/2008 | CN201082905Y Wire electric plating machine |
| 07/09/2008 | CN100401475C Material deposition from liquefied gas solution |
| 07/09/2008 | CN100400715C Multi-porous Ni foil for cathode of alkaline battery method for manufacturing Ni foil and manufacturing device thereof |
| 07/09/2008 | CN100400710C Process of depositing mat metallic layers free of nickel and chromium(VI) |
| 07/08/2008 | US7395611 System processing a substrate using dynamic liquid meniscus |
| 07/08/2008 | CA2343340C Process for producing a piece with very high-level mechanical characteristics, formed by drawing, from a strip of laminated steel plate, hot rolled and coated |
| 07/03/2008 | US20080160846 The propeller body of cast aluminum alloy has an anodic oxide protective coating of the aluminum alloy covering a surface of the propeller body and having a thickness of >20 mu m in a thinnest portion and a hardness of > 330 HV at a near-surface level in a thickest portion; wear/corrosion resistances |
| 07/03/2008 | DE102005010095B4 Metallband mit niedrigem Ummagnetisierungsverlust und biaxialer Textur sowie Herstellungsverfahren dafür Metal band with low core loss and biaxial texture and manufacturing method thereof |
| 07/02/2008 | EP1875279B1 A method of forming mirrors on a conducting substrate |
| 07/02/2008 | CN201080506Y Fitting interior surface cadmium-plating positioning apparatus |
| 07/02/2008 | CN100398700C Surface cladding treatment method of ferro-manganese aluminium alloy |
| 07/01/2008 | US7393594 Laminated metal thin plate formed by electrodeposition and method of producing the same |
| 06/26/2008 | WO2008075723A1 Metal strip, connector and metal strip manufacturing method |
| 06/26/2008 | WO2008074439A1 Sliding bearing |
| 06/26/2008 | WO2008074345A1 Sliding bearing |
| 06/25/2008 | CN100397718C 压配合端子 Press-fit terminal |
| 06/25/2008 | CN100396822C Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/25/2008 | CN100396817C Surface-treated copper foil |
| 06/24/2008 | US7390383 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
| 06/24/2008 | US7390382 Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
| 06/19/2008 | WO2008072418A1 Male terminal, and its manufacturing method |
| 06/19/2008 | WO2008072403A1 Apparatus and method for non-contact liquid sealing |
| 06/19/2008 | WO2008071699A2 Method for producing an optical waveguide for an optical rotary transformer |
| 06/19/2008 | WO2008071239A1 Apparatus and process for single-side wet chemical and electrolytic treatment of goods |
| 06/19/2008 | DE19911962B4 Kolbenring und eine Kombination von Verdichtungsringen Piston ring and a combination of compression rings |
| 06/19/2008 | DE112006002251T5 Elektrophoretische Abscheidung von Leuchtstoffen auf Halbleitern auf Halbleitersubstraten mit geschlossenem Kreislauf Electrophoretic deposition of phosphors on semiconductors on semiconductor substrates with a closed circuit |
| 06/18/2008 | EP1932952A1 Method of surface treatment for the inhibition of wiskers |
| 06/18/2008 | CN101203632A Device for treatment of surfaces and planar objects |
| 06/18/2008 | CN101203631A Sn-plated copper alloy bar having excellent fatigue characteristics |
| 06/18/2008 | CN101203627A Capsule element with tin as main constituent, capsule forming method and solder processing method |
| 06/18/2008 | CN101201545A Pholithography and wafer forming by the same |
| 06/17/2008 | US7387717 Method of performing electrolytic treatment on a conductive layer of a substrate |
| 06/11/2008 | CN101195208A Plating diamond tool with glass hard high-wearing feature and production method thereof |
| 06/11/2008 | CN100393917C Chemical plating process and device |
| 06/10/2008 | US7383844 Meniscus, vacuum, IPA vapor, drying manifold |
| 06/10/2008 | US7383843 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 06/05/2008 | WO2008065069A1 Device and method for electroplating |
| 06/05/2008 | US20080132005 Electroplating method for a semiconductor device |
| 06/05/2008 | US20080131708 Method for Imparting Hydrogen Resistance to Articles |
| 06/05/2008 | DE112006001905T5 Käfig für Wälzlager und Wälzlager Cage for rolling bearings |
| 06/05/2008 | DE102006057178A1 Netz Network |
| 06/04/2008 | EP1927682A1 Anode for a device for electronically depositing any kind of anticorrosive and or cosmetic metal plating on a metal part |
| 06/04/2008 | EP1458908B1 A tubular member having an anti-galling coating |
| 06/04/2008 | CN201068472Y Metal composite material galvanizing wire electrode bus continuous electroplating apparatus |
| 06/04/2008 | CN101193501A Method for controlling plating layer thickness distribution in FPC making process |
| 06/04/2008 | CN101193489A Plating part and its making method |
| 06/04/2008 | CN100392155C Bath for galvanic deposition of gold and gold alloys, and use thereof |
| 06/03/2008 | US7381318 Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom |
| 06/03/2008 | US7380698 Method of connecting module layers suitable for the production of microstructure modules and a microstructure module |
| 05/29/2008 | US20080121618 Method of Electrochemical Fabrication |
| 05/29/2008 | US20080121527 Immersing substrate into an electroplating bath including copper compound and defect reducing agent comprising reaction product of benzyl chloride and (hydroxyethyl) polyethylenimine; filling submicron-sized reliefs whereby occurrence of protrusion defects are reduced; crystal growth inhibition |
| 05/28/2008 | EP1851366B1 Anode for an apparatus for the galvanic coating of the running surfaces of cylinders |
| 05/28/2008 | CN101187053A Scrape ring internal and external chrome-plating clamp |
| 05/28/2008 | CN101187046A Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire |
| 05/27/2008 | US7378227 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces |
| 05/27/2008 | US7378004 Pad designs and structures for a versatile materials processing apparatus |
| 05/22/2008 | WO2007118810A3 Electroplating device and method |
| 05/22/2008 | US20080116062 Electroplating system and method |
| 05/21/2008 | EP1756336B1 Device and method for electrolytically treating flat work-pieces |
| 05/21/2008 | EP1697561A4 Copper electrodeposition in microelectronics |
| 05/21/2008 | CN101184870A Gravure cylinder-use copper plating method and device |
| 05/21/2008 | CN100389232C Apparatus for electroplating zipper chain teeth |
| 05/20/2008 | US7375014 Methods of electrochemically treating semiconductor substrates |
| 05/20/2008 | US7374651 Using electrode having controlled crystal grain size |
| 05/20/2008 | US7374646 Electrolytic processing apparatus and substrate processing method |
| 05/15/2008 | US20080110857 Method of Electrochemical Fabrication |
| 05/15/2008 | US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device |
| 05/15/2008 | US20080110751 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
| 05/14/2008 | EP1920180A1 Threaded joint for steel pipes |
| 05/14/2008 | EP1919703A2 Compositionally modulated composite materials and methods for making the same |
| 05/14/2008 | CN201058892Y Drag chain electric-plating equipment |
| 05/13/2008 | US7372616 Complex microdevices and apparatus and methods for fabricating such devices |
| 05/13/2008 | US7371426 lower growth environmental bond coating of an aluminum alloy applied to the remaining base metal substrate so that upon subsequent repair of the component, less of the remaining base metal substrate is removed because of less environmental coating growth into the substrate than prior bond coat |
| 05/08/2008 | WO2008053878A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer |
| 05/08/2008 | US20080107865 Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof |
| 05/08/2008 | US20080105557 Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry |
| 05/08/2008 | US20080105553 Produces deposit including tungsten, chromium, molybdenum, tantalum, titanium, zirconium, vanadium, hafnium, and niobium refractory metals as a main component with high purity, and high density and having a smooth surface |
| 05/07/2008 | EP1918411A2 Coated turbine engine components and methods for making the same |
| 05/07/2008 | EP1680535A4 Electroplating compositions and methods for electroplating |
| 05/07/2008 | EP1680534A4 Support layer for thin copper foil |
| 05/07/2008 | EP1441046B1 Surface-treated copper foil |
| 05/07/2008 | CN101173365A Shell electroplating method and shell produced with the electroplating method |
| 05/07/2008 | CN100386825C Method for improving critical current density of Bi-2223 strip material |
| 05/07/2008 | CN100386474C Fountain bed with fluid contacting with substance |