| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 05/06/2008 | US7368326 Methods and apparatus to reduce growth formations on plated conductive leads |
| 05/06/2008 | US7368046 Electrodeposition of an overlay of Cu, Ag and Bi on a bearing metal layer of a Cu or Al alloy covered by Ni intermediate layer from a solution containing methanesulfonates of Ag, Cu and Bi; methanesulfonic acid; nonionic wetting agent; grain refining agent; resorcinol; and thiourea; wear resistance |
| 05/01/2008 | US20080102251 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing |
| 05/01/2008 | US20080099344 Immersing a contact electrode in a solution;contacting the surface of the conductive layer with the contact solution to define a contact region;immersing a process electrode in a process solution;contacting the surface of the conductive layer with the process solution, applying an electrical potential |
| 05/01/2008 | US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing |
| 04/30/2008 | EP1542505B1 Metal based resistance heating element and method for preparation thereof |
| 04/29/2008 | US7364664 Blocks off a portion of flow of liquid used in a flow process (e.g., plating solution for formimg a bump electrode), by using a partition plate whose lower end is in close contact with a bottom of a plating tank and whose upper end is at a position lower than a liquid surface |
| 04/24/2008 | WO2008047509A1 Plating apparatus |
| 04/24/2008 | WO2007014778A3 Device for the treatment, particularly galvanization, of substrates |
| 04/24/2008 | US20080095999 Protective Film For Polarizing Plate, Method For Preparation Thereof, Polarizing Plate With Antireflection Function, And Optical Article |
| 04/24/2008 | US20080093047 Casting molds coated for surface enhancement and methods of making |
| 04/23/2008 | EP1913179A1 Device for picking up and holding a plurality of substrates and an electroplating device |
| 04/23/2008 | EP1912785A1 Electrodeposition of biaxially textured layers on a substrate |
| 04/17/2008 | WO2008044763A1 Tab lead material and process for producing the same |
| 04/17/2008 | US20080090739 Masked Solid Porous Supports Allowing Fast And Easy Reagent Exchange To Accelerate Electrode-Based Microarrays |
| 04/17/2008 | DE112006001385T5 Separator für Brennstoffzelle und Verfahren zu dessen Herstellung A separator for fuel cell and process for its preparation |
| 04/16/2008 | EP1910590A2 Device for the treatment, particularly galvanization, of substrates |
| 04/16/2008 | CN100382235C Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers |
| 04/15/2008 | US7357850 Electroplating apparatus with segmented anode array |
| 04/10/2008 | WO2008041720A1 Process for producing metal clad laminate |
| 04/10/2008 | WO2008041516A1 Electroplating method |
| 04/10/2008 | WO2008041484A1 Elastic contact and method for bonding between metal terminals using the same |
| 04/10/2008 | US20080086195 Precoating biodegradable iron, magnesium, or magnesium oxide; placing the device in an electrolyte solution possibly including a therapeutic agent; nitriding, carbiding, or boriding by plasma electrolytic saturation; catheters, guide wires, stents with controlled release coatings; side effect reduction |
| 04/10/2008 | US20080085419 Electro- and Electroless Plating of Metal in the Manufacture of PCRAM Devices |
| 04/10/2008 | US20080083625 forming a pattern for a copper line on a substrate, then forming a barrier metal layer on the pattern, removing oxide layers formed on the barrier layer and depositing copper ions on the barrier metal layer by plating in electrolytic cells |
| 04/10/2008 | DE19717489B4 Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes Arrangement for electro-galvanic metal coating of a band |
| 04/09/2008 | CN101160212A 经表面处理的刮刀片 The surface-treated doctor blade |
| 04/08/2008 | USRE40218 Configuration and dimensions of the deposition cell and its components are designed to provide uniform current distribution across the semiconductor substrate; flow-through anode and a diaphragm unit that provide a combination of relatively uniform flow of particle-free electrolyte |
| 04/03/2008 | DE10102145B4 Galvanisiervorbehandlungsvorrichtung und Galvanisierbehandlungsvorrichtung Galvanisiervorbehandlungsvorrichtung and Galvanisierbehandlungsvorrichtung |
| 04/02/2008 | CN101155663A Press fit joining method |
| 04/02/2008 | CN100378253C Electroplating device, electroplating cup and cathode ring |
| 04/02/2008 | CN100378252C Partial plating method |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure |
| 04/01/2008 | US7351315 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 04/01/2008 | US7351314 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 04/01/2008 | US7350316 Meniscus proximity system for cleaning semiconductor substrate surfaces |
| 03/27/2008 | WO2008035961A2 Device for electrochemically depositing a material on a plateshaped substrate |
| 03/27/2008 | DE102006044416A1 Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen A method for electrochemical treatment or stripping of components |
| 03/27/2008 | DE102004006562B4 Verfahren zum Beschichten von Bleigitterbändern, daraus hergestellte Bleigitter und deren Verwendung A process for coating lead grid straps, made therefrom lead grids and their use |
| 03/25/2008 | US7348234 Methods of forming capacitor constructions |
| 03/25/2008 | US7347924 Anodizing of optically transmissive substrate |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/25/2008 | US7347572 Telescope mirror for high bandwidth free space optical data transmission |
| 03/20/2008 | WO2008032784A1 Copper-based deposited alloy board for contact material and process for producing the same |
| 03/19/2008 | EP1899507A2 Device for treatment of surfaces and planar objects |
| 03/19/2008 | CN201037158Y Electric plating frock device for wide and thick plate blank continuous casting crystallizer copper plate with back board integral structure |
| 03/19/2008 | CN201037157Y Sealing device for wide and thick plate blank continuous casting crystallizer copper plate with back board integral electric plating frock |
| 03/19/2008 | CN101144177A Electrochemical processing apparatus and method of processing a semiconductor device |
| 03/18/2008 | US7344977 Method of electroplating a substance over a semiconductor substrate |
| 03/12/2008 | EP1897973A1 Deposition of conductive polymer and metallization of non-conductive substrates |
| 03/12/2008 | EP1896634A2 Enhanced transparent conductive coatings and methods for making them |
| 03/11/2008 | US7341946 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
| 03/11/2008 | US7341945 Method of fabricating semiconductor device |
| 03/11/2008 | US7341649 Apparatus for electroprocessing a workpiece surface |
| 03/11/2008 | US7341648 Method for coating piston rings for internal combustion engine |
| 03/11/2008 | US7341634 Apparatus for and method of processing substrate |
| 03/11/2008 | US7341633 Apparatus for electroless deposition |
| 03/11/2008 | US7340934 Press molding die and manufacturing method of same |
| 03/06/2008 | US20080053833 Energy storage arrangement |
| 03/06/2008 | US20080053832 Process for electrocoating metal blanks and coiled metal substrates |
| 03/06/2008 | DE112006001199T5 Kompositmetallschicht, die unter Verwendung von metallischen nanokristallinen Partikeln in einem Elektroplattierungsbad geformt ist Composite metal layer that is formed using metallic nanocrystalline particles in an electroplating |
| 03/05/2008 | EP1895024A1 Copper foil for printed wiring board |
| 03/05/2008 | EP1894816A2 Pivot bearing for automobile front wheel suspension |
| 03/05/2008 | CN101137680A Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 03/04/2008 | US7338585 Electroplating chemistries and methods of forming interconnections |
| 03/01/2008 | WO2008001892A1 Metal wire rod plating insoluble anode and metal wire rod plating method using it |
| 02/28/2008 | WO2008023974A1 Device for treating a plate-shaped substrate in a bath. |
| 02/28/2008 | WO2008023561A1 Nickel-plated stainless-steel wire |
| 02/28/2008 | WO2006136362A3 Device for treatment of surfaces and planar objects |
| 02/28/2008 | US20080047837 Method for anodizing aluminum-copper alloy |
| 02/28/2008 | US20080047829 Plating Apparatus |
| 02/27/2008 | EP1892754A2 Method of electroplating solder bumps of uniform height on integrated circuit substrates |
| 02/27/2008 | EP1892322A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material |
| 02/27/2008 | EP1516076B1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 02/27/2008 | CN101130880A Method and apparatus for vehicle two-chamber tail pipe plating by using auxiliary anode |
| 02/26/2008 | US7335288 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density |
| 02/20/2008 | CN101128623A Method for making ceramic electronic part, and plating bath |
| 02/20/2008 | CN101126169A Thin belt continuous casting crystal roller surface electroplating method and electroplate liquid thereof |
| 02/20/2008 | CN100370578C Substrate holder and plating apparatus |
| 02/20/2008 | CN100370063C Apparatus for removing fir-tree crystal of metal strip edge |
| 02/19/2008 | US7332068 Selective removal of dielectric materials and plating process using same |
| 02/19/2008 | US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/19/2008 | US7332062 Electroplating tool for semiconductor manufacture having electric field control |
| 02/14/2008 | US20080035488 Manufacturing process to produce litho sheet |
| 02/13/2008 | EP1887108A1 Gravure cylinder-use copper plating method and device |
| 02/13/2008 | CN101124354A Color-coded stainless steel fittings and ferrules |
| 02/13/2008 | CN101122039A Method for manufacturing steel lining copper line |
| 02/12/2008 | US7329952 Method of fabricating a semiconductor device |
| 02/12/2008 | US7329335 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
| 02/12/2008 | US7329334 Plating with a pulse-reverse current profile to produce a desired thickness of copper; controlling the ratio of cathodic pulse time or current density to anodic pulse time or current density; sulfur hardener (H2SO4) and polyalkylene glycol; softer than coatings formed using direct current |
| 02/07/2008 | US20080029402 Electrochemical processing apparatus and method of processing a semiconductor device |
| 02/06/2008 | CN101120120A Ultrasonic treatment plant |
| 02/06/2008 | CN100367487C Method for the production of thin metal-containing layers having low electrical resistance |
| 02/06/2008 | CN100366801C Surface treatment method for environment-friendly chromium-free zirconium-containing electro-galvanized fingerprint resistant steel sheet |
| 01/31/2008 | WO2008013535A1 Process and apparatus for plating articles |
| 01/31/2008 | WO2008012862A1 Whisker preventive agent for tin or tin alloy plating, and method of whisker prevention making use of the same |
| 01/31/2008 | US20080026569 Advanced Seed Layers for Interconnects |
| 01/31/2008 | US20080025805 Tool Holder with Vibration Damping Means and a Method for Manufacturing the Same |
| 01/31/2008 | US20080023335 Method of fabricating semiconductor device, and plating apparatus |