| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/01/2008 | CN101275260A Preparation for copper microstructure on N type silicon surface by region-selective electrochemical deposition |
| 10/01/2008 | CN101275259A Electrolysis treatment apparatus, support for planographic printing plate, planographic printing plate, and electrolysis treatment process |
| 10/01/2008 | CN101275257A Method for electroplating gold on surface of circuit board |
| 10/01/2008 | CN101275256A Method for preparing metal, alloy, metallic oxide and alloy oxide composite power by epitaxial cathode electrochemical codeposition technology |
| 10/01/2008 | CN101275254A High efficiency chromium electroplating method for low and middle continuous processing line |
| 10/01/2008 | CN100422389C Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment |
| 09/30/2008 | US7429401 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 09/25/2008 | WO2007130838A3 Coating compositions exhibiting corrosion resistance properties, related coated articles and methods |
| 09/25/2008 | WO2005076977A3 Plating apparatus and method |
| 09/25/2008 | US20080231305 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 09/25/2008 | US20080230390 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating |
| 09/25/2008 | US20080230377 Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers |
| 09/25/2008 | US20080230097 Methods for Processing Wafer Surfaces Using Thin, High Velocity Fluid Layer |
| 09/24/2008 | CN100420774C Zinc alloy slide fastener electroplating device |
| 09/23/2008 | US7427338 Flow diffuser to be used in electro-chemical plating system |
| 09/23/2008 | US7427337 System for electropolishing and electrochemical mechanical polishing |
| 09/23/2008 | CA2403217C Plated metal wire and production method and production device therefor |
| 09/23/2008 | CA2380475C An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 09/18/2008 | WO2008112086A2 Electroplating process |
| 09/17/2008 | CN201116312Y Pre-plated copper electrode protecting device |
| 09/17/2008 | CN201116311Y Wafer bump manufacturing hanger |
| 09/17/2008 | CN101265606A Apparatuses for electrochemical deposition, and method for forming conductive layer |
| 09/17/2008 | CN101265549A Foam iron-nickel composite metal material and preparation method thereof |
| 09/16/2008 | US7425256 Selective shield/material flow mechanism |
| 09/16/2008 | US7425250 Electrochemical mechanical processing apparatus |
| 09/12/2008 | WO2008109113A1 Tubular members with hard coating and method for making same |
| 09/12/2008 | WO2008108263A1 Screw joint for steel pipe |
| 09/12/2008 | WO2008107962A1 Method of evaluating semiconductor device |
| 09/12/2008 | WO2008107194A2 Method for the precision processing of substrates and use of said method |
| 09/11/2008 | US20080217180 Surface with an Anti-Adhesion Microstructure and Method for Producing Same |
| 09/11/2008 | US20080217167 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/11/2008 | US20080217166 Apparatus and methods for electrochemical processsing of microelectronic workpieces |
| 09/11/2008 | US20080217165 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 09/11/2008 | DE102007022016B3 Galvanizing assembly holds flat wafers or other substrate by Bernoulli chuck during treatment |
| 09/10/2008 | EP1967645A1 Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same |
| 09/10/2008 | CN101263247A Electroplating composition for coating a substrate surface with a metal |
| 09/10/2008 | CN101260554A Metal foil band electroplating system and application thereof |
| 09/10/2008 | CN101260553A Electroplating device for printed breadboard |
| 09/04/2008 | WO2008104611A1 Method for producing a metal panel and resulting metal panel |
| 09/04/2008 | US20080213420 Stamper and method of manufacturing the same |
| 09/04/2008 | US20080210568 Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode |
| 09/04/2008 | DE202008005887U1 Behälter zum Aufnehmen und Erwärmen von Fluiden Container for containing and heating of fluids |
| 09/03/2008 | EP1963549A1 A device and a method for metal plating |
| 09/03/2008 | EP1521868B1 Device and method for monitoring an electrolytic process |
| 09/03/2008 | CN101255587A Bulb holder annularly plating method |
| 09/03/2008 | CN101255586A Bulb holder plating method |
| 09/03/2008 | CN100416792C Method for producing silicon insulator lining structure |
| 09/03/2008 | CN100416777C Reducing defect in electrodeposited copper used in semiconductor |
| 09/03/2008 | CN100415943C Workpiece wet processing |
| 09/02/2008 | CA2490464C Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 08/28/2008 | WO2008103027A1 Device for treating a band-shaped substrate with a liquid |
| 08/28/2008 | WO2008101635A1 Method for the electrochemical deposition of catalyst particles onto carbon fibre- containing substrates and apparatus therefor |
| 08/28/2008 | WO2008101413A1 A method for manufacturing an antenna and an antenna structure |
| 08/28/2008 | WO2008071699A3 Method for producing an optical waveguide for an optical rotary transformer |
| 08/28/2008 | US20080206899 Measurement reflection of semiconductor substrate with concave segments; calibration; vapor deposition; forming metal film |
| 08/28/2008 | US20080202641 Composition and method for alloy having improved stress relaxation resistance |
| 08/28/2008 | CA2677837A1 Method for the electrochemical deposition of catalyst particles onto carbon fibre- containing substrates and apparatus therefor |
| 08/27/2008 | EP1961841A1 Method for electroplating of catalyst particles on substrates containing carbon fibres and device therefor |
| 08/27/2008 | CN101250743A Anode box |
| 08/27/2008 | CN101250736A Continuous electroplating apparatus |
| 08/27/2008 | CN101250735A Apparatus and method for continuously composite plating metallic and nano particle on carbon fiber surface |
| 08/27/2008 | CN101250734A Deep blind hole internal surface uniform electrochemical treatment method |
| 08/27/2008 | CN100414003C Method for preparing neodymium-iron-boron magnetic powder coated with metal layer by electrochemical deposition |
| 08/26/2008 | US7416763 Process for forming metal layers |
| 08/26/2008 | US7416647 Plating processing device |
| 08/21/2008 | WO2007147818A3 An apparatus and method for electroplating a substrate in a continuous way |
| 08/21/2008 | DE4447897B4 Verfahren zur Herstellung von Leiterplatten Process for the preparation of printed circuit boards |
| 08/20/2008 | CN201102993Y Acid plated sink roller flange capable of convenient replacing |
| 08/20/2008 | CN201102992Y Automatic stopping and controlling device for wire plating floss and breaking |
| 08/20/2008 | CN101248499A Multilayer electronic component and its manufacturing method |
| 08/20/2008 | CN100413032C Conductive polishing article for electrochemical mechanical polishing |
| 08/20/2008 | CN100413023C Single workpiece processing chamber |
| 08/14/2008 | WO2008035961A3 Device for electrochemically depositing a material on a plateshaped substrate |
| 08/14/2008 | DE102007008183A1 Galvanische Abscheidung von Gold und Goldlegierungen Electrodeposition of gold and gold alloys |
| 08/13/2008 | EP1956118A2 Method of forming bond coating for a thermal barrier coating |
| 08/13/2008 | EP1409772B2 Method for selectively electroplating a strip-shaped, metal support material |
| 08/13/2008 | CN201099706Y Piston ring three-sided chrome plating jigs |
| 08/13/2008 | CN201099705Y Steel belt molding bushing ring chrome plating special fixture |
| 08/07/2008 | WO2007118875A3 Electroplating device and method |
| 08/07/2008 | DE102007005161A1 Process to manufacture semiconductors or solar cells by roughening treatment zones prior to electrolytic coating |
| 08/06/2008 | EP1497476B1 Process of masking cooling holes of a gas turbine component |
| 08/06/2008 | CN101235524A Non-cyanide electrolysis gold plating bath for gold bump and gold wiring |
| 08/06/2008 | CN100409002C X-ray coating thickness device |
| 08/05/2008 | US7406972 Substrate proximity processing structures |
| 07/31/2008 | US20080180121 Probe card assembly and kit |
| 07/31/2008 | US20080179279 Method for Electrochemical Fabrication |
| 07/31/2008 | US20080179076 Method for preventing siphoning effect in terminal and terminal manufactured using the same |
| 07/30/2008 | EP1949771A1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 07/30/2008 | EP1948851A1 Process for producing tinplate, tinplate produced using said process and packaging produced thereof |
| 07/30/2008 | CN101233264A Composite metal layer formed using metal nanocrystalline particles in an electroplating bath |
| 07/30/2008 | CN101230473A Bimetal leaf treatment process and film-plating bimetal leaf |
| 07/29/2008 | US7405007 Semiconductor having a substantially uniform layer of electroplated metal |
| 07/29/2008 | US7404886 Removing additives adsorbed on the top and cavity portions to allow plating to take place before the additive fully re-adsorbs onto the top portion so it is plated more than the cavity |
| 07/29/2008 | US7404885 Plating method and electronic device |
| 07/23/2008 | EP1185152B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/23/2008 | EP1185150B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/23/2008 | CN100405564C Lead frame and method of manufacturing the same |
| 07/22/2008 | US7402231 Enclosing in tubal shield; connecting to cathode; immersion into bath |
| 07/22/2008 | US7402227 Plating apparatus and method |
| 07/17/2008 | WO2008084524A1 Process for producing semiconductor device and apparatus for semiconductor device production |