Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2008
12/04/2008WO2008146368A1 Process for producing highly anticorrosive rare earth permanent magnet and method of using the same
12/04/2008WO2008146113A2 Process for coating a surface of a metal element to increase osteointegration thereof and prosthetic device including said element
12/04/2008WO2008101413A8 A method for manufacturing an antenna and an antenna structure
12/04/2008WO2007115318B1 Composition control for roll-to- roll processed photovoltaic films
12/04/2008US20080297983 Electrode Sheet For Capacitors, Method For Manufacturing The Same, And Electrolytic Capacitor
12/04/2008US20080296562 Methods and apparatus for fabricating carbon nanotubes and carbon nanotube devices
12/04/2008US20080296165 Plating apparatus
12/03/2008EP1997939A1 Hydraulic cylinders and manufacturing method
12/03/2008EP1997933A1 Plating method of electrode can of flat alkaline cell and plating apparatus thereof
12/03/2008CN101316960A Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same
12/03/2008CN101316952A Device for picking up and holding a plurality of substrates and an electroplating device
12/03/2008CN100439571C 电镀装置 Plating apparatus
12/03/2008CN100439570C Conveyorized plating line and method for electrolytically metal plating a workpiece
12/03/2008CN100439568C Web processing method and apparatus
12/03/2008CN100439567C Method for producing abrasive tips for gas turbine blades `
11/2008
11/27/2008US20080292957 Surface-Treated Steel Sheet for Battery Cases, a Battery Case and a Battery Using It
11/27/2008US20080289967 Substrate gripper with integrated electrical contacts
11/26/2008EP1995356A1 Plating material and electrical and electronic component using the plating material
11/26/2008EP1995354A1 Surface treated elctrolytic copper foil and process for producing the same
11/26/2008EP1525609B1 Device for etching semiconductors with a large surface area
11/26/2008CN100436643C Plating apparatus
11/25/2008US7456501 Semiconductor structure having recess with conductive metal
11/25/2008US7455458 Bearings
11/19/2008CN201151751Y Tank type plating vat for copper plate of continuous casting crystallizer
11/19/2008CN101310046A Device for the treatment, particularly galvanization, of substrates
11/19/2008CN101307482A Electrolytic ni plating apparatus and method of manufacturing semiconductor device
11/18/2008CA2504369C Process for electrolytic coating of a strand casting mould
11/13/2008WO2008137951A2 Plating apparatus and method
11/13/2008WO2008134958A1 A copper plating method for steel tubular
11/13/2008WO2006065580A3 Wafer support apparatus for electroplating process and method for using the same
11/13/2008US20080280159 Copper Foil and Method of Manufacturing the Same
11/13/2008US20080277157 Electromagnetic Wave Shielding Sheet and Process For Producing the Same
11/12/2008EP1990446A1 Method of repairing a mobile vane of a turbomachine, turbomachine vane and turbomachine comprising this vane
11/12/2008EP1919703A4 Compositionally modulated composite materials and methods for making the same
11/12/2008EP1224341B1 Process for electrolytic coating of a substrate
11/12/2008CN100433300C 封装组件和半导体封装 Package assembly and semiconductor packaging
11/11/2008US7449406 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
11/11/2008US7449098 Method for planar electroplating
11/11/2008US7449091 Wafer electroplating apparatus
11/11/2008US7449089 Conveyorized plating line and method for electrolytically metal plating a workpiece
11/06/2008WO2008133316A2 Plated member and method for manufacturing the same
11/06/2008WO2008132933A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
11/06/2008WO2008131790A1 Process and apparatus for electrolytic metallization of treatment good
11/06/2008US20080274373 Engine Part
11/05/2008EP1988191A1 Plating apparatus and method of plating
11/05/2008CN201144295Y Research experiment system for silicon chip electroplating
11/05/2008CN201144294Y Electroplating system for metal foil strip
11/05/2008CN101300443A Threaded joint for steel pipes
11/05/2008CN100430528C High-speed continuous electroplating non-soluble anode conducting surface ablation on-line identifying method
11/05/2008CN100430526C Electropolishing and/or electroplating apparatus and methods
11/04/2008US7445697 Method and apparatus for fluid processing a workpiece
10/2008
10/30/2008WO2008129423A2 Conductive via formation
10/30/2008DE102004032659B4 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung Apparatus and method for chemical or electrolytic treatment of material to be treated and to the use of the device
10/29/2008EP1087039B1 Plating jig of wafer
10/29/2008CN101294295A Combined continuous electroplating apparatus for strip steel
10/29/2008CN101294294A Processing method for printed circuit board before plating
10/29/2008CN101293852A Metal plating compositions and methods
10/28/2008US7442285 Common rack for electroplating and PVD coating operations
10/28/2008US7442282 Electrolytic processing apparatus and method
10/28/2008US7442257 Substrate processing apparatus and substrate processing method
10/23/2008WO2008126719A1 Connector and metallic material for connector
10/23/2008WO2008126522A1 Copper electrolyte solution and two-layer flexible substrate obtained by using the same
10/23/2008WO2007115318A3 Composition control for roll-to- roll processed photovoltaic films
10/23/2008US20080257808 Ultrasonic Treatment Plant
10/23/2008US20080257752 Device and Method for Electrolytically Treating Flat Work Pieces
10/23/2008US20080257743 Method of making an integrated circuit including electrodeposition of metallic chromium
10/22/2008CN201136908Y Anode chamber and anode assembly for electroplating on wafer
10/22/2008CN100428429C Production of manganese-doped zinc oxide thin-film and nano-column by electrochemical deposition
10/21/2008US7438794 Method of copper electroplating to improve gapfill
10/21/2008US7438788 Apparatus and methods for electrochemical processing of microelectronic workpieces
10/16/2008WO2008123460A1 Electric contact material, method for manufacturing the electric contact material, and electric contact
10/16/2008WO2008123260A1 Silver-coated material for movable contact component and method for manufacturing such silver-coated material
10/16/2008WO2008123259A1 Silver-coated material for movable contact component and method for manufacturing such silver-coated material
10/16/2008WO2008123211A1 Web pressure welding, pressure welding method, power supply method, power supply device, continuous electrolyte plating device, and method for manufacturing plate film-equipped web
10/16/2008WO2008071699B1 Method for producing an optical waveguide for an optical rotary transformer
10/16/2008US20080254280 Silicate-Coated Particles in a Metal Layer
10/16/2008US20080251387 Forming metal seed layer on insulating substrate, seed layer having roughened area on which copper wiring or a bump is to be formed, and forming electroplated film of copper or alloy of copper by electroplating on roughened area of seed layer; without masking by resist film
10/16/2008US20080251385 Electrolytic treatment such as plating or etching; providing high resistance structure having electrical conductivity lower than that of electrolytic solution in solution filled between substrate in contact with an electrode; filling metal such as copper in fine interconnect patterns in semiconductor
10/15/2008EP1666136B1 Microreactor including magnetic barrier
10/15/2008CN100426590C Electronic part and surface treatment method of the same
10/14/2008US7435323 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte
10/09/2008WO2008121085A1 Zip coating method and machine
10/09/2008US20080245669 Plating apparatus and method
10/08/2008EP1978135A2 Electrolysis treatment apparatus, support for planographic printing plate, planographic printing plate, and electrolysis treatment process
10/08/2008EP1978134A1 Metal plating compositions
10/08/2008EP1978129A2 Method for forming corrosion-resistant film and high-temperature apparatus member
10/08/2008CN101283119A Method of surface treatment for the inhibition of whiskers
10/08/2008CN101281858A Substrate holder and plating apparatus
10/08/2008CN101280446A Research experiment system for silicon chip electroplating
10/08/2008CN101280445A Electroplating process for surface of magnesium alloy motorcycle hub
10/08/2008CN100424232C Nickel electric plating liquid
10/07/2008US7433153 Soft magnetic film and thin film magnetic head using soft magnetic film, process for manufacturing soft magnetic film and process for manufacturing thin film magnetic head
10/07/2008US7431816 Method of manufacturing heat resistant resin film with metal thin film
10/07/2008US7431507 Sliding member
10/02/2008US20080237437 Support For Part To Be Coated By Electrolytic Deposition
10/02/2008US20080237053 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel
10/02/2008US20080237049 Ion-implanted electroformed structural material and method of producing the structural material
10/02/2008DE202008007183U1 Erwärmungseinrichtung Heater
10/01/2008EP1975698A1 Method and apparatus for producing conductive material
10/01/2008EP1975309A1 Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same
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