Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
04/2006
04/26/2006EP1649502A1 Multiple-step electrodeposition process for direct copper plating on barrier metals
04/26/2006EP1649083A2 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
04/26/2006EP1516077B1 Ultrasonically-enhanced electroplating apparatus and methods
04/26/2006CN1764745A Composite chromium plating film and sliding member having the same and method for manufacture thereof
04/26/2006CN1764349A Electroformed metallization
04/26/2006CN1763260A High-speed electrospraying device
04/26/2006CN1763259A Method for preparing diameter different monocrystal bismuth nanowire microarray by using uniform hole diameter alumina template
04/26/2006CN1763258A Method and apparatus for preparing coating or film by microwave hydrothermal electrodeposition
04/26/2006CN1253608C Method and apparatus for disposing substrate with miniml edge isolation
04/26/2006CN1253607C Surface treatment method for making metal container surface indicating two kinds of color and/or surface effect
04/26/2006CN1253606C Copper-plating solution, plating method and plating apparatus
04/25/2006US7033464 Apparatus for electrochemically depositing a material onto a workpiece surface
04/25/2006US7033447 Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus
04/25/2006CA2264908C Method for anisotropic etching of structures in conducting materials
04/20/2006WO2005014889A3 Deposition method for nanostructure materials
04/20/2006US20060084264 Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment
04/20/2006US20060083981 Battery can and manufacturing method thereof and battery using the same
04/20/2006US20060081478 Plating apparatus and plating method
04/20/2006US20060081476 Printed circuit board and method of manufacturing the same
04/20/2006US20060081475 Reverse pulse plating composition and method
04/20/2006DE10348734B4 Verfahren zum selektiven Galvanisieren von Metalloberflächen und Selektiv-Galvanisierungssystem für Metalloberflächen A method for selective electroplating of metal surfaces and selective electroplating system for metal surfaces
04/19/2006CN1252322C Device and method for electrolytic metallization of workpiece
04/19/2006CN1252320C Composition for removing aluminium surface stain
04/19/2006CN1252319C Improvements relating to metal finishes
04/18/2006US7030183 Surface treating method and surface treating agent
04/18/2006US7029760 Plated material and method of manufacturing the same, terminal member for connector, and connector
04/18/2006US7029568 electrolytically processing an aluminum or aluminum alloy in an electrolyte of sulfuric acid, oxalic acid, and/or phosphoric acid doped with a negative ion generating metal salt to develop an anodized layer and to deposit on it a negative ion generating metal from the metal salt
04/18/2006US7029567 Electrochemical edge and bevel cleaning process and system
04/18/2006US7029566 electrodeposition in zirconyl nitrate bath; colloiding; sintering; improved biocompability
04/13/2006US20060079085 Method for applying metal features onto metallized layers using electrochemical deposition
04/13/2006US20060079084 Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
04/13/2006US20060079083 Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment
04/13/2006US20060076245 Contacting the substrate with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution; allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating
04/13/2006US20060076244 Barrier enhancement process for copper interconnects
04/13/2006US20060076242 Producing method of wired circuit board
04/13/2006US20060076241 Device and method for electrolytically treating an at least superficially electrically conducting work piece
04/13/2006US20060076240 Conversion circuit, system and method of executing an electrochemical process
04/12/2006EP1644558A1 High purity electrolytic sulfonic acid solutions
04/12/2006EP1570115B1 Method for the electrolytic deposition of magnesium on galvanised sheet metal
04/12/2006EP1499758A4 Metallization of polymer parts for painting
04/12/2006CN1757784A Nanometer crystal-micro crystal layered composite material and its preparation method
04/12/2006CN1251319C Microelectronic component insert making method
04/12/2006CN1250777C Method for selectively electroplating strip-shaped metal support material
04/12/2006CN1250776C Local electroplating system
04/12/2006CN1250772C Electroplating pretreatment solution and electroplating pretreatment method
04/11/2006US7026258 rapid annealing of a thin film of a precursor with a slightly excess of VI element with an electromagnetic power greater than or equal to a few W/cm2 to activate the element and make all alloy grains react to improve the crystallization for durations less than or equal to tens of seconds
04/11/2006US7026059 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits
04/11/2006US7026012 Method and apparatus for forming a metallic feature on a substrate
04/11/2006US7025867 Direct electrolytic metallization on non-conducting substrates
04/11/2006US7025866 Depositing conductive material on a workpiece to form an electroconductive contact layer that conforms to submicron recesses in the workpiece, depositing a second conductive layer and forming a contact region
04/11/2006US7025861 Contact plating apparatus
04/06/2006WO2006036252A2 Controlling the hardness of electrodeposited copper coatings by variation of current profile
04/06/2006WO2006035695A1 Hexavalent chromium-free surface treating method and hexavalent chromium-free lead-containing copper-base metal material
04/06/2006WO2005123988B1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal
04/06/2006WO2005065436A3 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
04/06/2006US20060073356 Laser Engineered Net Shaping; wear resistance; biocompatability; artificial joints
04/06/2006US20060070885 Chip interconnect and packaging deposition methods and structures
04/06/2006US20060070884 Electrochemical processing apparatus and method
04/06/2006US20060070883 Fixtureless vertical paddle electroplating cell
04/06/2006US20060070882 Inventive method overcomes disadvantages of using high processing temperatures and dissimilar additives, taking place at low temperatures and allowing the material separation to be completely filled without using dissimilar substances
04/06/2006DE19925373B4 Verfahren und Vorrichtung zum Galvanisieren Method and apparatus for electroplating
04/05/2006EP1643009A1 Precoated metal plate excellent in press workability and method for production thereof
04/05/2006EP1105245A4 Bonding of dissimilar metals
04/05/2006CN1757125A Battery can and manufacturing method thereof and battery using the same
04/05/2006CN1756854A High strength and high magnetic permeability steel sheet for cathode ray tube band and method for production thereof
04/05/2006CN1249255C Method for relieving stress before plating whole chain
04/05/2006CN1248821C Brazing product
04/04/2006US7022419 Formed from nickel and copper alloys, and self-lubricating particles and hard particles for improved corrosion resistance and lubricating property, such as for cylinder block made by die casting for an automobile internal combustion engine
04/04/2006US7022210 Locally-distributed electrode and method of fabrication
03/2006
03/30/2006WO2006033315A1 Plating method and plating apparatus
03/30/2006WO2005108648A3 Production of a structured hard chromium layer and production of a coating
03/30/2006WO2005065433A3 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
03/30/2006US20060068262 Separator for fuel cell and method for producing the same
03/30/2006US20060068214 Erosion and wear resistant protective structures for turbine components
03/30/2006US20060065537 Electrolytic copper plating solutions
03/30/2006US20060065535 Method of fabricating oxide film
03/30/2006US20060065534 Plating apparatus, plating method and multilayer printed circuit board
03/30/2006DE4426803B4 Galvanisierter, thermoplastischer Fahrzeugkühlergrill mit verbesserter Flexibilität Galvanized thermoplastic vehicle grille with improved flexibility
03/30/2006DE102004045451A1 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
03/29/2006EP1639156A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
03/29/2006EP1438446A4 System and method for electrolytic plating
03/29/2006EP1214739B1 Copper deposit process
03/29/2006CN2767461Y Nano electro-brush plating test apparatus
03/29/2006CN2767459Y Electro-brush plating anode module
03/29/2006CN1754011A Rare earth metal magnet and plating bath
03/29/2006CN1754010A Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability
03/29/2006CN1248327C Surface-treated steel plate for battery case and battery case
03/29/2006CN1247824C Back-end metallisation process
03/28/2006US7020537 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
03/28/2006US7019394 Circuit package and method of plating the same
03/28/2006US7018548 Conductive thin film pattern and method of forming the same, method of manufacturing thin film magnetic head, method of manufacturing thin film inductor, and method of manufacturing micro device
03/28/2006US7018521 Anodizing said surface in an aqueous sulfuric acid bath at a temperature and a current density that produces a desired thickness of a clear anodized layer suitable for color finishing
03/28/2006US7018411 bone replacement; alloy support; electroplating
03/23/2006WO2006030999A1 Electroless plating method and plating film obtained by the electroless plating method
03/23/2006WO2006030998A1 Electro polishing combined electric plating apparatus and electroless plating apparatus using the same
03/23/2006US20060060473 Method for the manufacture of sanitary fittings with a stainless steel finish
03/23/2006DE102004043841A1 Electroplating light metal wheel rims with copper, nickel, chromium, silver and gold comprises structuring surface, passivating or chromating and applying lacquer containing acrylonitrile-butadiene-st yrene copolymer
03/22/2006EP1637629A2 Apparatus and method for electroplating a workpiece
03/22/2006EP1636845A2 Wet chemical processing chambers for processing microfeature workpieces
03/22/2006EP1636402A2 Contact surfaces for electrical contacts and method for producing the same