Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
02/2007
02/21/2007CN2871560Y Automatic wire hung-electroplated skip-blanking system
02/21/2007CN1918328A Improved metal strip electroplating
02/20/2007US7179359 Cup-shaped plating apparatus
02/20/2007CA2160221C Electrode for electrochemical process and use thereof
02/15/2007WO2007017279A1 Device for picking up and holding a plurality of substrates and an electroplating device
02/15/2007US20070034516 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
02/15/2007US20070034502 Electrolytic processing apparatus
02/15/2007DE10229001B4 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface
02/15/2007DE102005039100A1 Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung Means for receiving and holding a plurality of substrates and electroplating
02/15/2007CA2617502A1 Device for receiving or holding several substrates and galvanizing device
02/14/2007CN1300384C Method and apparatus for electroplating
02/08/2007WO2007014779A2 Apparatus and method for the treatment, especially galvanization, of printed circuit boards
02/08/2007WO2007014778A2 Device for the treatment, particularly galvanization, of substrates
02/08/2007US20070031594 Method for making a metal decorative effect on the surface of an object
02/08/2007US20070029191 Sacrificial anode holder and related anodes
02/08/2007DE102005038450A1 Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten Device for treating substrates, in particular for the electroplating of substrates
02/08/2007DE102005038449A1 Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren Device for treating substrates, in particular for the electroplating of circuit boards, and method
02/08/2007CA2617575A1 Device for the treatment and in particular galvanizing of substrates
02/07/2007CN2866524Y Micro-electric plating device
02/07/2007CN1908247A Electroplating jig
02/06/2007US7172184 Substrate carrier for electroplating solar cells
02/01/2007US20070023294 Microreactors and methods for generating hydrogen peroxide
02/01/2007US20070023278 Apparatus for automatically feeding the silver wire into the solution
02/01/2007US20070023277 Plating apparatus, plating cup and cathode ring
02/01/2007DE102005034926A1 Track-rack bar system for anodizing long workpieces with workpiece located on at least one pair of track-rack bars useful for anodizing long workpieces, e.g. long Al workpieces in anodizing bath has track-rack bar with central section
01/2007
01/31/2007CN2863822Y Electrochemical treatment work-piece hanger
01/31/2007CN1906331A Stabilizers for titanium diboride-containing cathode structures
01/31/2007CN1904146A Coating device and coating method
01/30/2007US7169283 Anodization device and anodization method
01/30/2007US7169270 To a conductor rod with a smaller diameter than a hole in the anode; the resulting gap is filled with partially sintered electroconductive particles of Cu, Ni or Ag; electrolysis to produce aluminum from aluminum oxide
01/30/2007US7169269 Plating apparatus, plating cup and cathode ring
01/25/2007WO2007009448A1 System for electrodepositing a conductive layer on a nonconductive carrier material
01/25/2007WO2007009441A1 Use of a coating for making electrical contact
01/25/2007WO2006060067B1 Continuous coating process
01/25/2007DE102005034419A1 Verwendung einer Beschichtung zur elektrischen Kontaktierung Use of a coating to make electrical contact
01/25/2007DE102005033784A1 System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial System for the galvanic deposition of a conductive layer on a non-conductive carrier material
01/24/2007CN2861187Y Electroplating roller conducting structure
01/24/2007CN1902340A Method for controlling electrodeposition of an entity and devices incorporating the immobilized entity
01/24/2007CN1900380A Apparatus and process for electroplating treatment of foils from roller to roller
01/24/2007CN1296524C Container, reactor and method for electrochemically processing workpiece
01/23/2007US7166204 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
01/18/2007WO2007006752A1 Electrode arrangement and method for the electrochemical coating of a workpiece surface
01/18/2007WO2007006690A1 Method and device for processing at least two workpieces by means of electrochemical treatment
01/18/2007WO2005072098A3 Electrode tool for electrochemical machining and method for manufacturing same
01/18/2007US20070012560 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
01/18/2007DE102005033857A1 Elektrodenanordnung und Verfahren zum elektrochemischen Beschichten einer Werkstückoberfläche Electrode arrangement and method for electroplating a workpiece surface
01/17/2007EP1743959A1 Device for the electrodeposition of metals and/or metal alloys by use of an electroplating drum
01/17/2007EP1743053A2 Method for production of a coating and anode used in such a method
01/17/2007CN1898416A Spiral electrodeionization device and its component
01/17/2007CN1295174C Non-conductor cell assembly with conductive region for plating
01/11/2007WO2006033758A3 Electrochemical machining tool and method for machining a product using the same
01/11/2007US20070007126 Electrohydrogen generator and molecular separator using moving electrodes and auxiliary electrodes
01/11/2007DE202006012842U1 Apparatus for wet-chemical or electrolytic treatment workpiece, e.g. large, thin workpiece of aluminum, has titanium clamping jaw(s) with surface projections, not requiring regular cleaning
01/10/2007EP1741806A1 Apparatus and process for electroplating treatment of foils from roller to roller
01/10/2007EP1740741A1 Method for producing a green body
01/10/2007CN1894811A Carbon-coated silicon particle powder as the anode material for lithium ion batteries and the method of making the same
01/10/2007CN1894444A Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
01/10/2007CN1894442A Method and apparatus for fluid processing a workpiece
01/09/2007US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion
01/09/2007US7160421 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
01/04/2007WO2007002656A2 Electroprocessing workpiece contact assembly and apparatus
01/04/2007WO2007001263A2 Electro-decontamination of contaminated surfaces
01/04/2007US20070000775 Electrochemical device
01/04/2007DE202006015901U1 Container e.g. for galvanic baths has flexible covering at which extracting opening is arranged and dosing valve is arranged at extracting opening
01/04/2007DE102005030546A1 Einrichtung zur Behandlung von flachen und flächigen Gegenständen Apparatus for the treatment of flat and sheet-like articles
01/03/2007EP1664390B1 Device and method for electrolytically treating electrically insulated structures
01/03/2007CN1888145A Electroplating apparatus
01/03/2007CN1292966C Belt apparatus, holding apparatus, belt device and application device and method for the same
12/2006
12/28/2006WO2006137555A1 Apparatus and method for manufacturing plated film
12/28/2006WO2006136362A2 Device for treatment of surfaces and planar objects
12/28/2006US20060289302 Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces
12/28/2006US20060289298 Electrolytic processing apparatus and method
12/27/2006EP1736569A1 Electroplating jig
12/27/2006EP1735817A1 Single workpiece processing chamber
12/27/2006CN2851291Y Electroplating holder for circuit board
12/27/2006CN1292099C Apparatus for plating treatment
12/26/2006US7153410 Alternating current, direct current power sources; switches
12/26/2006US7153400 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
12/21/2006US20060286369 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
12/21/2006US20060283704 Electroplating jig
12/20/2006CN1880517A Electrochemical processing cell
12/13/2006EP1730329A1 Process and apparatus for the electrogalvanic coating of metal items
12/13/2006CN1289719C Segmented counter electrode for an electrolytic treatment system
12/13/2006CN1289712C Anode assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte
12/12/2006US7147760 Electroplating apparatus with segmented anode array
12/12/2006US7146918 Wind-powered linear motion hydrogen production systems
12/07/2006US20060272939 Electrolyzing electrode and production method of persulfuric acid-dissolving liquid by use of the electrode
12/06/2006CN2844145Y Clamp of electroplating device
12/06/2006CN2844144Y Electric brush coated auxiliary tool
12/05/2006US7144482 Method and apparatus for forming grooves within journals and on flat plates
11/2006
11/30/2006WO2006126518A1 Gravure cylinder-use copper plating method and device
11/30/2006WO2006125629A1 Method, clip and device for transporting an article to be treated in an electrolytic system
11/30/2006WO2006042082A3 Apparatus and method for producing electrolyzed water
11/30/2006WO2004094702A3 Multi-chemistry plating system
11/30/2006DE102005024102A1 Verfahren, Klammer und Vorrichtung zum Transport eines Behandlungsgutes in einer Elektrolyseanlage Method and apparatus for transporting a clip to be treated in an electrolysis system
11/28/2006US7140929 Electronic connector terminal, a method for plating, and a terminal stack
11/23/2006WO2006086407A3 In situ plating and etching of materials covered with a surface film
11/23/2006WO2006060067A3 Continuous coating process
11/23/2006US20060260932 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
11/22/2006EP1724377A1 Device for electroplating of workpieces and trays for said apparatus
1 ... 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 ... 95