Patents for C23F 1 - Etching metallic material by chemical means (16,062)
04/2000
04/20/2000DE19848025A1 Verfahren zur Oberflächenbehandlung von Werkzeugen und Werkzeuge mit behandelter Oberfläche A method of surface treatment of tools and tools with a treated surface
04/19/2000EP0994201A2 Method for surface treatment of tools
04/19/2000CN1051504C Stainless steel plate having colored and topographical surface and fabricating method thereof
04/18/2000US6051148 Photoreceptor fabrication method
04/12/2000EP0993241A1 Copper coating
04/12/2000CN1250488A Method for manufacturing a stent
04/11/2000CA2183926C Method of manufacturing reflector
04/06/2000WO2000019491A1 Method for cleaning a process chamber
04/05/2000EP0777764B1 Chemical milling apparatus and method
04/05/2000EP0722512B1 Copper etchant solution additives
04/05/2000CN1249360A Micro etching agent of copper and copper alloy
04/04/2000US6045979 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
04/04/2000US6045874 Fluid delivery method
04/04/2000US6045763 Especially etching solutions which contain ammonia, at least one ammonium salt and metal ions in dissolved form and which accumulate in treatment of substrates containing valuable metals, especially copper-containing electronic sub-assemblies
04/04/2000US6045715 Method of post-etching a mechanically treated substrate
04/04/2000CA2021318C Method of forming fine patterns
03/2000
03/30/2000WO2000018199A1 Method for producing etched circuits
03/30/2000WO2000017417A1 Method for processing the interior of a hollow part
03/29/2000EP0989790A1 Apparatus and method for the treatment of substrates with an etching liquid
03/29/2000CN1248994A Composition for oxide CMP
03/29/2000CN1248787A Method for making semiconductor device
03/28/2000US6043100 Chip on tape die reframe process
03/16/2000DE19943175A1 Etching process, especially for forming a tungsten wiring structure or barrier metal for a thin film resistor, comprises oxidizing and then removing a tungsten thin film region with an alkaline solution
03/15/2000CN1247486A Method for passivation of metallization layer
03/14/2000US6036995 Aluminum or aluminum alloys with binders, melting and diffusing aluminum into a coating
03/14/2000US6036758 Surface treatment of copper
03/14/2000US6035681 Etched/lubricated swage balls for use in DASD suspension-arm
03/08/2000EP0984672A2 Process for treating metal surfaces
03/01/2000CN1245976A 半导体器件 Semiconductor devices
02/2000
02/29/2000US6030902 Apparatus and method for improving uniformity in batch processing of semiconductor wafers
02/29/2000US6030556 Optical disc stampers and methods/systems for manufacturing the same
02/24/2000WO2000009779A1 Process for treating brass components to substantially eliminate leachable lead
02/24/2000CA2340645A1 Process for treating brass components to substantially eliminate leachable lead
02/22/2000US6028009 Process for fabricating a device with a cavity formed at one end thereof
02/22/2000US6027997 An electroconductive layer, e.g. tungsten, deposited in a plug opening is chemomechanical polished using slurry comprising abrasive and copper sulfate or copper perchlorate to form plug
02/22/2000US6027863 Method for manufacturing a tubular medical device
02/22/2000US6027630 Method for electrochemical fabrication
02/22/2000US6027571 Specific weight percents of hydrogen fluoride and ammonium fluoride, prepared by dissolving ammonium gas into a solution of hydrogen fluoride; smaller difference in etching speeds of oxide films obtained by different methods
02/16/2000EP0980092A1 Vacuum processing method and apparatus
02/15/2000US6024884 Cobalt-zirconium-tantalum is ion milled (etched) to form top poles for tape write heads
02/15/2000US6024858 Method of producing an aluminum support for a planographic plate
02/10/2000WO2000005938A2 Laser imaging of printed circuit patterns without using phototools
02/09/2000EP0775304B1 Method of producing cavity structures
02/09/2000CN1243856A Chemicomechanical grinding composition for manufacturing semiconductor
02/03/2000WO2000005812A1 Piezo-oscillator and production method thereof
02/01/2000US6020639 Semiconductor wafer with removed CVD copper
02/01/2000US6020111 Method of manufacturing semiconductor device with patterned lamination of Si film and metal film
02/01/2000US6020110 Production of electrodes for electrochemical sensing
02/01/2000US6020029 Process for treating metal surfaces
02/01/2000US6019910 Etching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitrates
01/2000
01/27/2000DE19831796A1 Verfahren zum selektiven, bereichsweisen Beschichten einer transparenten Trägerplatte mit einer metallischen Wirkschicht unter Verwendung eines Ätzverfahrens sowie entsprechend herstellbare Schichtabfolge und dazu verwendbare Konterprägefolie A method for selective area-wise coating of a transparent support plate with a metallic active coating using an etching method, and accordingly can be produced and this layer sequence suitable embossed sheet
01/26/2000EP0973961A1 Method for manufacturing a stent
01/26/2000CN1242438A Multiple elements chemical etching agent for nickel-titanium alloy film
01/25/2000US6018065 Method of fabricating iridium-based materials and structures on substrates, iridium source reagents therefor
01/19/2000EP0972656A2 Process for local selective coating of a transparent support plate with a metallic film by etching, layered composite obtainable by this process and embossed sheet used in the process
01/19/2000CN1241457A Method for cleaning PZT thin film
01/18/2000US6015505 Chemical wet etching of metal films in semiconductor applications using solution comprising hydrogen peroxide, potassium sulfate, potassium edta; (c4) controlled collapse chip connector
01/12/2000EP0970751A2 Spray nozzle and method of manufacturing same
01/12/2000EP0813500B1 Purification of metal containing solutions
01/12/2000EP0700524B1 Process for producing surface micromechanical structures
01/06/2000WO2000000667A1 Method of stripping a coating from a rotary seal of an aircraft engine
01/05/2000EP0968322A1 Method and device for operating milling baths
01/05/2000CN1240239A Metal surface treatment method and metal structure unit with surface formed by using said method
12/1999
12/29/1999EP0746638B1 Surface treatment of an object
12/28/1999US6007695 Selective removal of material using self-initiated galvanic activity in electrolytic bath
12/28/1999US6006694 Plasma reactor with a deposition shield
12/23/1999WO1999066086A1 Method for dissolving plutonium or a plutonium alloy and converting it into nuclear fuel
12/22/1999CN1239409A Molding of fastening hooks and other devices
12/16/1999DE19926117A1 Liquid etchant useful for roughening copper, especially in laminated circuit board production
12/15/1999EP0963459A2 Wafer support system
12/15/1999EP0963419A1 Composition for oxide cmp
12/08/1999CN1237778A Expanded form mask for color Braun tube and its material
12/07/1999US5998739 Stepped configured circuit board
12/02/1999WO1999061261A1 Method and apparatus for manufacturing cylindrical articles
12/02/1999CA2330668A1 Method and apparatus for manufacturing cylindrical articles
11/1999
11/30/1999US5994750 Microstructure and method of forming the same
11/30/1999US5993599 Easy access chemical chamber window and frame
11/30/1999US5993559 Forcing a tin removal fluid to flow in contact with a component part maintaining the component part in contact with the tin removal fluid at a temperature above 95.degree. c. and at a positive pressure between 3 bar and 6 bar in a closed
11/24/1999EP0958405A1 Metal surface treatment solutions and process
11/24/1999EP0579610B1 Demetallizing apparatus
11/24/1999CN1236123A Pointer sheet for clock
11/24/1999CN1236023A Method for producing nickel and iron compound by using waste corrosive liquid containing nickel and iron chloride series
11/23/1999US5990543 Reframed chip-on-tape die
11/23/1999US5989449 Composition and method for stripping tin and tin-lead from copper surfaces
11/23/1999US5989443 Etching nickel/iron alloy of printed circuit structure without etching underlying copper layer using aqueous solution of ferric ammonium sulfate and sulfuric or phosphoric acid
11/18/1999WO1999059193A1 Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components
11/18/1999WO1999058256A1 Low etch alkaline zincate composition and process for zincating aluminum
11/17/1999CN1235208A Method for printing on metal surface
11/16/1999US5985165 Process for the purification of aluminum hydroxide and process for the surface treatment of aluminum plate utilizing the purification process
11/11/1999WO1999057332A1 A method of etching an opening
11/11/1999DE19820001A1 Removing metal layers on metal, glass, ceramic or plastic parts
11/11/1999CA2330998A1 A method of etching an opening
11/10/1999EP0954620A1 Vapor deposition components and corresponding methods
11/10/1999EP0954385A1 Fluid delivery apparatus and method
11/10/1999EP0954226A1 Molding of fastening hooks and other devices
11/09/1999US5980850 Recoverying hydrofluoric acid, hydrochloric acid, nitric acid, or a mixture of these acids from waste pickling liquor by pre-concentrating, heat exchanging, pyrohydrolysis, separating from the metals and absorption, condensation
11/09/1999US5980771 Method and apparatus for regenerating an etch solution
11/09/1999US5980766 Process optimization in gas phase dry etching
11/09/1999US5979031 Method of manufacturing metal rotor for trimmer capacitor
11/02/1999US5976983 Method of cleaning semiconductor wafers after lapping