Patents for C23F 1 - Etching metallic material by chemical means (16,062)
04/2001
04/05/2001WO2001024228A2 Temporary bridge for micro machined structures
04/05/2001DE10045830A1 Removal of metal ions from aqueous solution, e.g. waste liquor, process bath or lixiviation solution, involves adjusting to suitable pH, adding solid organic chelant, stirring and removing metal complex formed
04/04/2001CN1290308A Plasma reactor with a deposition shield
04/03/2001US6210558 Steel pickling process in which the oxidation of the ferrous ion formed is carried out electrolytically
03/2001
03/29/2001WO2001021855A1 Removal of metal oxide scale from metal products
03/27/2001US6207350 Corrosion inhibitor for NiCu for high performance writers
03/22/2001WO2001020059A2 Method for producing a conductor pattern on a dielectric substrate
03/22/2001DE19931663C1 Verfahren und Vorrichtung zum Behandeln von Kleinteilen mit einem flüssigen Behandlungsmedium Method and apparatus for treating small parts with a liquid treatment medium
03/22/2001CA2382916A1 Method of forming a conductive pattern on dielectric substrates
03/21/2001CN1288075A Circulation and regeneration technology for non-fluoride type etching agent
03/20/2001US6203716 Method of chemical milling
03/14/2001EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
03/14/2001CN1287469A Electro-deposition copper foil through surface processing and its producing method and use
03/14/2001CN1287186A Treatment of waste alkali solution and settled sludge after chemical milling
03/13/2001US6200414 Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof
03/07/2001EP1080249A1 Method for inserting at least one groove into a borehole
03/06/2001US6197210 Removing the copper oxide surface layer and exposing the lead for oxidation using mineral acid, hydrogen peroxide/mineral acid or ammonium chloride/ferric chloride; rinsing; removing lead oxide with ammonium chloride/alkali metal hydroxide
02/2001
02/27/2001US6194365 Composition for cleaning and etching electronic display and substrate
02/27/2001US6193901 Method for etching
02/27/2001US6193814 Activated metal and a method for producing the same
02/27/2001US6193762 Surface for use on an implantable device
02/21/2001EP1076730A1 A method of etching an opening
02/14/2001CN1284137A Method of reducing elution of lead in lead-containing copper alloy, and ware made of lead-contg copper alloy
02/13/2001US6187686 High degree of etching selectivity between the platinum layer and the mask layer can thus be achieved thereby reducing sidewall erosion and residue generation.
02/13/2001US6187215 Photochemically etched plates for synthetic fiber-forming spin packs and method of making same
02/13/2001US6187214 Method and device for production of components for microfabrication
02/07/2001EP1074042A1 Synchronous multiplexed near zero overhead architecture for vacuum processes
02/06/2001US6184148 Forming on semiconductor substrate having insulation layer, layer of aluminum copper alloy; forming resist pattern on aluminum alloy layer; etching exposed layer; downstream ashing resist pattern; removing residual chlorine component
02/06/2001US6183940 Method of retaining the integrity of a photoresist pattern
02/06/2001US6183570 Surface treatment process of metallic material and metallic material obtained thereby
01/2001
01/30/2001US6180021 Method for etching
01/30/2001US6179954 Apparatus and method for etching printed circuit board
01/24/2001CN1281062A Corrosive solution of passivated laminated point
01/24/2001CN1281061A Method for protecting sacrificial layer of movable structure in deep-reaction ion etching process
01/23/2001US6176937 Process for treating a metal surface with an acidic solution containing hydrogen peroxide and a stabilizer
01/18/2001WO2001004638A1 Merged-mask micro-machining process
01/18/2001CA2714788A1 Merged-mask micro-machining process
01/17/2001EP1068842A2 Expandable stents and method for making same
01/17/2001EP1068373A1 Automated chemical process control system
01/17/2001CN1060821C Mask-nonmask etching for multi-layer silicon micro-mechanism structure
01/16/2001US6174740 Applying mechanical damage onto surface of silicon wafer to form distortions; oxidizing to form thermal oxide film on wafer surface; dissolving thermal oxide film with chemical solution or vapor; determining bulk impurities
01/16/2001US6174452 Masked tin oxide films are etched with an etchant composed of zinc metal, hydrochloric acid, and a penetration control agent; the exposed metal oxide film is reduced to metallic tin by the action of active hydrogen produced in the reaction
01/16/2001US6174448 Method for stripping aluminum from a diffusion coating
01/16/2001US6174383 Pickling of steel in an acidic aqueous pickling solution containing fe3+ and fe2+; hydrogen peroxide is supplied to oxidize fe2+ to fe3+.
01/16/2001US6174380 Method of removing hot corrosion products from a diffusion aluminide coating
01/16/2001US6173674 Plasma reactor with a deposition shield
01/10/2001EP1067830A1 A chemical solution treatment equipment
01/10/2001CN1279302A Technology for generating vein on Al alloy surface by direct chemical etching
01/09/2001US6170431 Plasma reactor with a deposition shield
01/09/2001US6170110 Apparatus for HF-HF cleaning
01/03/2001CN1278564A Method and system for recovering and removing copper from fluid
01/02/2001US6168725 Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates
12/2000
12/27/2000EP1063685A1 Photoresist film removing method and device therefor
12/27/2000EP1062379A1 Surface-treated article of magnesium or magnesium alloys, method of surface preparation and method of coating
12/26/2000US6163939 Molding of fastening hooks and other devices
12/21/2000WO2000077815A1 Method utilizing a magnetic assembly during etching thin shadow masks
12/21/2000WO2000077792A1 An effective dry etching process of actinide oxides and their mixed oxides in cf4/o2/n2 plasma
12/21/2000WO2000076783A1 Substrate treatment method
12/21/2000CA2375996A1 Method utilizing a magnetic assembly during etching thin shadow masks
12/20/2000CN1277538A Chemical-corrosive process for substrate
12/19/2000US6162503 Process for improving the adhesion of polymeric materials to metal surfaces
12/19/2000US6162366 Preparing an etchant containing ferric chloride and an anticorrosive agent for cu, and etching with said etchant a multilayer metal structure including a cu layer and an ni layer
12/07/2000WO2000073856A2 Pattern forming process comprising chemical machining and electrical discharge machining
12/07/2000WO2000073056A1 Method for producing microcomponents
12/07/2000CA2372938A1 Method of manufacturing micro-components
12/07/2000CA2338346A1 Hybrid surface modification process and article
12/06/2000CN1275419A Technology for preparation of stainless steel board filter screen
12/05/2000US6156221 Copper etching compositions, processes and products derived therefrom
11/2000
11/30/2000WO2000071782A1 Methods for wet processing electronic components having copper containing surfaces
11/30/2000DE19926025A1 Verfahren zum Herstellen von Mikrobauteilen A method of manufacturing micro-components
11/29/2000EP1055355A1 Process for the preliminary treatment of copper surfaces
11/29/2000EP1055016A1 Method for etching
11/29/2000EP1055015A1 Method for designing and producing a micromechanical device
11/28/2000CA2041062C Demetallizing procedure
11/21/2000US6150275 Micromechanical system fabrication method using (111) single crystalline silicon
11/21/2000US6149828 Supercritical etching compositions and method of using same
11/15/2000EP1051888A1 Process and solution for the preliminary treatment of copper surfaces
11/15/2000CN1273282A Method for making decorative pattern of aluminium alloy plate
11/14/2000US6147006 Cleaning gas
11/14/2000US6146692 Caustic process for replacing a thermal barrier coating
11/08/2000EP1050604A1 Method for removing an aluminide coating from a substrate
11/07/2000US6143192 Contacting at least a region of a surface of the ruthenium metal structure or a layer of ruthenium oxide layer with a solution comprising ceric ammonium nitrate
11/07/2000US6143191 Contacting iridium-based material with xenon fluoride etching reagent for sufficient time to etch the deposited iridium-based material from the substrate
10/2000
10/31/2000US6139762 Contacting the substrate with a first solution, and thereafter contacting with a second aqueous solution comprising paramagnate salt, the ph of first and second etchant is around 13, and free of added hydroxide
10/25/2000EP1046723A1 Stainless steel product for producing polymer electrode fuel cell
10/25/2000EP0820351B1 Fluid delivery apparatus and method
10/25/2000CN1271027A Stainless steel material for solid polymer fuel battery
10/25/2000CN1057800C Copper etchant solution additives
10/24/2000US6136213 Gas polishing method
10/19/2000WO2000061384A1 Remote plasma generator
10/19/2000WO2000061365A1 Titanium composite material
10/18/2000EP1044465A1 Wet processing methods for the manufacture of electronic components
10/17/2000US6131251 Molded hook member for a touch fastener
10/11/2000EP1043422A1 Method of controlling NOx gas emission by hydrogen peroxide
10/11/2000EP1043408A2 Processes and apparatus for recovery and removal of copper from fluids
10/10/2000US6130170 Process improvements for titanium-tungsten etching in the presence of electroplated C4's
10/10/2000US6129858 Electrolytically reclaimable; circuit boards and mold parts of copper and copper alloys; comprising copper tetrammine sulfate, ammonia, ammonium sulfate, ammonium chloride or ammonium nitrate, and a catalyst of vanadium (v2o5); kinetics
10/04/2000EP1039972A1 Method and device for production of components for microfabrication
10/04/2000CN1268585A Upper sacrificial layer processing method
10/04/2000CN1268584A quintuple photomask with several patterns