Patents for C23F 1 - Etching metallic material by chemical means (16,062)
10/2000
10/03/2000US6126844 Tapered monocapillary-optics for point source applications
10/03/2000US6126755 Stabilizing hydrogen peroxide decomposition which is used for removal of metal oxide from the metal surface by employing a combination of a hydroxybenzoic acid, a hydrotropic aryl sulfonic acid, and a hydrophobic alkylaryl sulfonic acid
09/2000
09/27/2000EP1038990A1 Method of reducing elution of lead in lead-containing copper alloy, and city water service fittings made of lead-containing copper alloy
09/27/2000EP1038046A1 Plasma reactor with a deposition shield
09/27/2000CN1268244A Wet processing methods for the manufacture of electronic components
09/27/2000CN1267904A Etching and cleaning method and using equipment for etching and cleaning
09/26/2000US6124211 Cleaning method
09/20/2000EP1037513A2 Micro-etch solution for producing metal surface topography
09/20/2000EP1037261A2 Etching and cleaning methods and etching and cleaning apparatuses used therefor
09/20/2000EP0920655B1 Baths for producing microstructures
09/14/2000WO2000053949A1 A friction member and a method for its surface treatment
09/14/2000WO2000053824A1 Method for eliminating copper from microelectronic components
09/13/2000EP1035228A1 Activated nickel screens and foils
09/13/2000EP1034072A1 Rapid texture prototyping
09/13/2000EP0820359B1 Method and apparatus for circuit board treatment
09/13/2000CN1056423C Immersing spray method
09/13/2000CN1056342C Method for making spot-shaped aluminium decorative material
09/12/2000US6117783 The chemical and mechanical polishing solution comprises a hydroxylamine compound and octyphenyl polyethylene
09/12/2000US6117497 Solid surface modification method and apparatus
09/12/2000US6117250 Aqueous solution for increasing surface area of a metal and providing acid resistance to the metal; proton source, oxidizer, source of halogen ions, an azole compound, a thiazole and/or thiocarbamide, and water miscible solvent
09/08/2000WO2000052229A1 Copper recovery process
09/07/2000DE19908960A1 Metal layer etching, especially for circuit board manufacture, is carried out in a spray etching unit using spray interruption durations conforming to the desired etching depth of different thickness layers
09/06/2000EP1032726A1 Selective removal of material using self-initiated galvanic activity in electrolytic bath
09/06/2000EP0698282B1 Method for etching silicon oxide layers using mixtures of HF and carboxylic acid
09/05/2000US6113702 Wafer support system
08/2000
08/31/2000WO2000050666A1 Method for treating magnesium-based metal formed article and treating solution therefor
08/31/2000WO2000050665A1 Method for inserting at least one groove into a borehole
08/30/2000EP1031644A1 Thiazole-and thiocarbamide-based chemicals for use with oxidative etchant solutions
08/30/2000CN1264626A Soup treatment appts.
08/29/2000US6110752 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
08/29/2000US6110322 Prevention of ground fault interrupts in a semiconductor processing system
08/23/2000EP1029953A1 Process for surface treatment and for deposition of polyaniline for absorbing light
08/23/2000EP1029117A1 Method for separating layers from articles
08/23/2000EP1029116A2 Gas treating solution corrosion inhibitor
08/23/2000EP1029106A1 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor
08/23/2000CN1055734C Apparatus for chemically etching substrates
08/22/2000US6107004 Method for making a tubular stent for use in medical applications
08/22/2000US6106736 Planarization process and apparatus for the etch definition of magnetic head air bearing surfaces
08/17/2000WO2000047343A1 Method and apparatus for etching coated substrates
08/15/2000US6103028 Method of fabricating thinned free-standing metallic hydrogen-selective palladium-bearing membranes and novel pin-hole-free membranes formed thereby
08/09/2000EP0909344B1 Steel pickling process in which the oxidation of the ferrous ion formed is carried out electrolytically
08/08/2000US6099686 Wet processing system
08/02/2000EP0973961A4 Method for manufacturing a stent
08/02/2000EP0725727B1 Method of making machine-engraved seamless tube
08/01/2000US6096161 Dry etching apparatus having means for preventing micro-arcing
07/2000
07/27/2000WO2000043574A1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
07/27/2000DE19901002A1 Verfahren zum Strukturieren einer Schicht A method for patterning a layer
07/26/2000EP0797909B1 Copper coating
07/26/2000CN1261460A Vacuum processing method and apparatus
07/25/2000US6093498 Forming a coating of aluminum or mixture with other metal over the surface of tin coated iron or steel substrate, heating to melt the iron or steel and diffusing alumlinum to form an aluminide coated body
07/25/2000US6093335 Method of surface finishes for eliminating surface irregularities and defects
07/25/2000US6093333 Method for etching thin nickel iron film to make a magnetic recording head
07/25/2000US6093254 Method of HF-HF Cleaning
07/20/2000WO2000042646A1 Method for structuring a layer
07/19/2000EP1020236A2 Cleaning gas and cleaning method
07/19/2000EP1019565A1 Method for preparing alkaline metal-containing etching solutions
07/19/2000CN1054655C Process for reducing lead leachate in brass plumbing components
07/13/2000DE19900702A1 Recycling copper in spent ammoniacal circuit board etching solution involves reduction with natural or artificial light on photocatalyst of n- and p-semiconductors, preferably doped with metal
07/12/2000EP1017881A1 Composition and method for priming substrate materials
07/11/2000US6087018 Ornament comprising transparent protective layer formed over surface of titanium member which is free of surface adhesion substances
07/11/2000US6086779 A cleaning surface treatment in the production of printed circuits by forming a complexes
07/11/2000US6086778 Muffle etch injector assembly
07/11/2000US6086773 Method and apparatus for etching-manufacture of cylindrical elements
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
07/04/2000US6083848 Removing solder from integrated circuits for failure analysis
07/04/2000US6083413 Hydrosilation; using halogen compound and organosilicon compound
06/2000
06/28/2000EP1013797A1 Method of removing hot corrosion products from a diffusion aluminide coating
06/28/2000CN1053933C Improved compositions and method for polishing
06/27/2000US6080447 Low etch alkaline zincate composition and process for zincating aluminum
06/21/2000EP1010776A1 Caustic process for replacing thermal barrier coatings
06/20/2000US6077452 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
06/20/2000US6077449 Method of checking the accuracy of the result of a multistep etching process
06/20/2000CA2069933C Etching solution containing a vanadium catalyst
06/14/2000EP1009203A2 Methods for manufacture of electronic devices
06/13/2000US6074960 Method and composition for selectively etching against cobalt silicide
06/08/2000WO2000033368A1 Spin-rinse-dry process with backside wafer etching
06/08/2000DE19951055A1 Ätzmittel, elektronische Vorrichtung mit einem Substrat, sowie Verfahren zur Herstellung des Substrats unter Verwendung des Ätzmittels Etchant electronic device with a substrate and method of manufacturing the substrate using the etching agent
06/07/2000CN1053233C Agent for surface processing of copper and copper alloy
06/06/2000US6071570 Electrodes of improved service life
06/02/2000WO2000031786A1 Etching solution, etched article and method for etched article
06/02/2000WO2000031785A1 Etching solution, etched article and method for etched article
05/2000
05/31/2000EP1003615A1 Method for passivation of a metallization layer
05/30/2000US6068728 Laser texturing with reverse lens focusing system
05/25/2000WO2000030164A1 Photoresist film removing method and device therefor
05/25/2000DE19850530A1 Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen Cycle process for pickling of copper and copper alloys
05/24/2000EP0832407A4 Passive gas substrate thermal conditioning apparatus and method
05/23/2000US6066168 Expandable stents and method for making same
05/23/2000US6066167 Expandable stents
05/16/2000US6063236 Vacuum processing system and method of removing film deposited on inner face of vacuum vessel in the vacuum processing system
05/11/2000WO2000026947A1 Method and system to control the concentration of dissolved gas in a liquid
05/11/2000WO2000026944A1 Method and apparatus for hf-hf cleaning
05/11/2000WO2000026440A2 Circular method for pickling copper and copper alloys
05/10/2000CN1252457A Etching system and method for using different etching time according to accumulative treating number
05/09/2000US6059992 Mixture of quinone and oxime; oxygen scavengers
05/09/2000CA2052933C Process and apparatus for electrowinning of heavy metals from waste baths
05/02/2000US6056887 Process for fabricating a feeler member for a micromechanical probe, in particular for an atomic force microscope
05/02/2000US6056776 Expandable stents and method for making same
04/2000
04/27/2000WO2000009779B1 Process for treating brass components to substantially eliminate leachable lead
04/26/2000EP0784543B1 Lithographic surface or thin layer modification
04/25/2000US6054061 Composition for circuit board manufacture