Patents for C23F 1 - Etching metallic material by chemical means (16,062)
11/1999
11/02/1999US5976396 Method for etching
11/02/1999US5976265 Method for removing an aluminide-containing material from a metal substrate
10/1999
10/27/1999EP0951522A1 Method of removing reactive metal from a metal-coated reactor system
10/27/1999EP0711454B1 Method for forming solder bumps
10/27/1999CN1232886A Multiple low-temperature aluminizing technology for steel blade of aircraft engine
10/27/1999CN1046000C Metallographic etching reagent
10/21/1999WO1999053121A1 Automated chemical process control system
10/19/1999US5968229 Purification of metal containing solutions
10/14/1999WO1999051795A1 Method for preparing alkaline etching solutions containing metal
10/14/1999WO1999051315A1 Multistage extraction tower with a static mixture and integrated phase coalescer
10/12/1999US5965230 Blank for magnetic hard disk and method for producing same
10/12/1999US5965036 Microetching composition for copper or copper alloy
10/07/1999DE19815288A1 Verfahren zur energiesparenden und abwasserfreien Aufbereitung ammoniakalischer Metallösung aus dem Ätzvorgang zur Herstellung der Leiterplatten Method for energy saving and zero discharge treatment ammoniacal solution of the metal etching process for the production of printed circuit boards
10/07/1999DE19815287A1 Mehrstufen Gegenstrom Extraktionsturm mit statischem Mischer und integriertem Koaleszenzer Multistage countercurrent extraction tower with static mixer and integrated coalescing
10/05/1999US5961771 Chemical milling apparatus
10/05/1999CA2104401C Novel demetallizing procedure
09/1999
09/29/1999EP0945527A1 Aqueous liquid deoxidizing compositions methods of preparing them and processes for deoxidizing-etching aluminum therewith
09/28/1999US5958257 Treating brass component with aqueous sodium hydroxide or potassium hydroxide to remove some of leachable lead; rinsing and treating with water soluble carboxylic acid to remove substantially all of remaining leachable lead
09/23/1999WO1999047729A1 Surface-treated article of magnesium or magnesium alloys, method of surface preparation and method of coating
09/23/1999DE19811878A1 Verfahren zum naßchemischen pyramidalen Texturätzen von Siliziumoberflächen A method for wet chemical pyramidal texture etching of silicon surfaces
09/22/1999EP0944114A2 Process for the wet etching of a pyramidal texture on silicium surfaces
09/21/1999US5956142 Method of end point detection using a sinusoidal interference signal for a wet etch process
09/21/1999US5954854 Method for recovering etchant from etching waste liquid containing iron chloride
09/16/1999WO1999046135A1 Method for creating microstructures
09/15/1999EP0942450A1 Color selection electrode, method of producing color selection electrode and cathode ray tube
09/15/1999EP0833961B1 Ammoniacal metal solution recycling process
09/14/1999US5951882 Spray nozzle and method of manufacturing same
09/10/1999WO1999045577A1 Prevention of ground fault interrupts in a semiconductor processing system
09/09/1999DE19904792A1 Stretched mask for a color picture tube, e.g. a shadow mask tube or an aperture grille tube, in color television and computer color displays
09/07/1999US5948592 Mixture of casein and calcium compound
09/01/1999EP0938597A1 Method for anisotropic etching of structures in conducting materials
09/01/1999CN1227280A Chemical removing technology for composite coating of aircraft engine steel blade before low temperature aluminizing
09/01/1999CN1227279A Etching composition and use thereof
08/1999
08/31/1999US5944909 Heating an aqueous solution of nitric or hydrochloric acid and wetting agent
08/26/1999DE19822418C1 Apparatus for bath treatment of a work-piece whose vertical dimensions exceed the available bath depth
08/25/1999EP0938079A2 Studless thin film magnetic head and process for making the same
08/25/1999EP0937691A1 Process for etching a conductive layer
08/18/1999EP0936286A1 Selectively demetallizing aluminum
08/17/1999US5939774 Semiconductor lead frame
08/17/1999US5939334 System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
08/17/1999CA2090349C Composition and method for stripping tin or tin-lead alloy from copper surfaces
08/12/1999WO1999040765A1 Process for the preliminary treatment of copper surfaces
08/12/1999WO1999040764A1 Process and solution for the preliminary treatment of copper surfaces
08/12/1999WO1999040235A1 Method for etching
08/12/1999CA2318862A1 Process to pretreat copper surfaces
08/12/1999CA2318784A1 Solution and process to pretreat copper surfaces
08/05/1999DE19830038A1 Lösung und Verfahren zum Vorbehandeln von Kupferoberflächen Solution and method for pretreating copper surfaces
08/05/1999DE19830037A1 Verfahren zum Vorbehandeln von Kupferoberflächen A method of pretreating copper surfaces
08/04/1999CN1224774A Hollowing technology of stereo metal etching protecting formwork
08/03/1999US5933757 Spraying substrate bearing a silicide structure with ammonium hydroxide/hydrogen peroxide to selectively remove titanium or titanium nitride residues, then with aqueous phosphoric acid/acetic/nitric acid to remove non-silicided cobalt
08/03/1999US5932492 Methods for forming alumina masking
08/03/1999US5932113 Low temperature encapsulation system
08/03/1999US5932024 Decoating titanium and other metallized glass surfaces
07/1999
07/28/1999CN1224077A Process for etching diamond film pattern with reactive ion beam
07/27/1999US5928963 Plasma etching method
07/27/1999US5928529 Composition and method for stripping tin and tin-lead from copper surfaces
07/27/1999US5927303 Substrate processing apparatus
07/20/1999US5925259 Applying material to stamp comprising deformable material, contacting stamp with substrate, filling depressions, bringing surface of stamp into contact with substrate such that surface of stamp forms seal around openings
07/15/1999WO1999035305A1 Method for designing and producing a micromechanical device
07/15/1999DE19800745A1 Design- und Herstellungsverfahren für eine mikromechanische Vorrichtung Design and manufacturing method for a micromechanical device
07/15/1999DE19800605A1 Ammoniacal sulfate solution for etching copper clad circuit boards and other copper or copper alloy articles
07/14/1999EP0928431A1 Tapered capillary optics
07/14/1999CN1222757A Porous region removing method and semiconductor substrate manufacturing method
07/13/1999US5922477 Photochemically etched plates for synthetic fiber-forming spin packs and method of making same
07/13/1999US5922029 Surface for use on an implantable device and method of production therefor
07/13/1999CA2149305C Method of making machine-engraved seamless tube
07/13/1999CA2063508C Manufacture of a micromechanical element with two degrees of freedom
07/07/1999CN1221809A Method of etching aluminum-based layer
07/07/1999CN1221808A Process improvements for titanium-tungsten etching in presence of electroplated C4'S
07/06/1999US5919715 Method for cleaning a semiconductor surface
07/06/1999US5919311 Control of SiO2 etch rate using dilute chemical etchants in the presence of a megasonic field
07/01/1999WO1999019539A3 Gas treating solution corrosion inhibitor
06/1999
06/30/1999EP0926267A1 Method and composition for etching tri-metal layers to form electronic circuits
06/30/1999EP0926266A1 Method and composition for etching of Al-Cu layers to form electronic circuits
06/30/1999EP0926265A1 Method and compositions for producing copper surfaces for improved bonding and articles made therefrom
06/29/1999US5916824 Acid gas in airtight chamber
06/24/1999WO1999030835A1 Method and device for production of components for microfabrication
06/24/1999CA2315108A1 Method and device for production of components for microfabrication
06/23/1999EP0924754A2 Low temperature system and method for CVD copper removal
06/23/1999CN1220335A Ornamental steel plate and manufacturing method therefor
06/22/1999US5914281 Apparatus for etching wafer
06/17/1999WO1999030355A1 Wet processing methods for the manufacture of electronic components
06/17/1999WO1999029923A1 Plasma reactor with a deposition shield
06/17/1999CA2312777A1 Plasma reactor with a deposition shield
06/16/1999EP0820351A4 Fluid delivery apparatus and method
06/15/1999US5911907 Nitric acid, ferric nitrate, stabilizer consisting of a 4-amino-1,2,4-triazole, a 3-amino-5-methylisoxazole, a sulfanilamide, and a sulfamide, such which inhibits exothermic conditions, emission of toxic nox gas, and copper attack.
06/10/1999WO1999028536A1 Method of reducing elution of lead in lead-containing copper alloy, and city water service fittings made of lead-containing copper alloy
06/10/1999WO1999028535A1 Etching methods
06/10/1999WO1999028113A1 Rapid texture prototyping
06/09/1999EP0920655A1 Baths for producing microstructures
06/08/1999USRE36224 Microwave plasma processing process and apparatus
06/01/1999US5909048 Micro-machining minute hollow using native oxide membrane
05/1999
05/26/1999EP0918081A1 Etching composition and use
05/26/1999CN1217469A End detection method in wet etching course
05/26/1999CN1217391A Etching device, etching method and circuit board made using said method
05/25/1999US5906912 Crosslinking a soluble electroconductive polymer to obtain film having a sheet resistance of 10.sup.10 .omega./.quadrature. or less; forming a pattern by coating with a silicon-containing resist, and effecting exposure and
05/20/1999WO1999024642A1 Method for separating layers from articles
05/20/1999WO1999024635A1 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor
05/20/1999DE19852299A1 Metal substrate, to be etched through a resist pattern, has a smooth surface with specified roughness values
05/18/1999US5904783 Method for reducing lead leaching in fixtures