Patents for C23F 1 - Etching metallic material by chemical means (16,062)
05/1999
05/18/1999US5904773 Fluid delivery apparatus
05/12/1999EP0843747B1 Treatment of cemented carbide substrate to receive a diamond film by CVD
05/12/1999CN1216518A Method of post-etching a mechanically treated substrate
05/11/1999US5902475 Method for manufacturing a stent
05/11/1999US5901436 Method of manufacturing lead frame
05/05/1999CN1216059A Composition for cleaning and etching electronic display and substrate
05/05/1999CN1215765A Tin-nickel alloy deplating liquid
05/04/1999US5900350 Molding methods, molds and products
05/04/1999CA2023943C Process for removing copper and copper oxide deposits from surfaces
04/1999
04/28/1999EP0911427A1 Process for surface-treating an aluminium-containing metal
04/28/1999CN1215100A Method for making spot-shaped aluminium decorative material
04/28/1999CN1215099A Apparatus and process for regenrating CuClz etchant solution
04/28/1999CN1215098A Two kinds of anti-sulfur corrosion special steel pipe
04/27/1999US5897379 Low temperature system and method for CVD copper removal
04/27/1999US5896877 Support for wafer-like objects
04/27/1999US5896664 Process for producing aluminum alloy bearing
04/22/1999WO1999019539A2 Gas treating solution corrosion inhibitor
04/21/1999EP0909992A1 Water-soluble photoresist composition
04/21/1999EP0909344A1 Steel pickling process in which the oxidation of the ferrous ion formed is carried out electrolytically
04/21/1999CN1214610A Composition and method for stripping solder and tin from printed circuit boards
04/21/1999CN1214376A Method for preventing contamination by lead from metallic piping devices
04/20/1999US5895937 Tapered dielectric etch in semiconductor devices
04/20/1999US5895581 Laser imaging of printed circuit patterns without using phototools
04/20/1999US5895563 Immersion mixture of iron, fluoride, and acid compounds; cyanide-free; uniformity; electroplating
04/13/1999US5893983 Technique for removing defects from a layer of metal
04/08/1999WO1999016938A1 Selective removal of material using self-initiated galvanic activity in electrolytic bath
04/08/1999WO1999016933A1 Method and device for etching a metal strip
04/07/1999EP0906968A1 Composition and method for stripping solder and tin from printed circuit boards
04/06/1999USRE36185 Citrate buffer, hydrogen peroxide
04/01/1999WO1999015832A1 Method for reducing lead leaching in fixtures
04/01/1999DE19743022A1 Verfahren und Einrichtung zum Beizen eines Metallbandes Method and device for pickling a metal strip
03/1999
03/31/1999EP0905754A2 Planarization process
03/31/1999EP0905476A2 Method of end point detection for a wet etch process
03/24/1999EP0903778A1 Etchants
03/23/1999US5885888 Selectively etching anodized surface layer of aluminum gate electrode using solution containing phosphoric acid, acetic acid and/or nitric acid with a protective barrier forming material
03/23/1999US5885756 Methods of patterning a semiconductor wafer having an active region and a peripheral region, and patterned wafers formed thereby
03/23/1999US5885476 Composition for microetching copper or copper alloy
03/18/1999WO1999013130A1 Method for preparing alkaline metal-containing etching solutions
03/17/1999EP0806128B1 Method of selectively removing a metallic layer from a non-metallic substrate
03/17/1999CN1211159A Method for etching and thining copper foil with sulfuric acid and hydrogen peroxide solution
03/16/1999US5882425 Semiconductor wafers with post etching residues removed by applying ammonium fluoride with carbon dioxide
03/09/1999US5879578 Etched/lubricated swage balls for use in DASD suspension-arm attachment
03/03/1999EP0899538A1 A probe tip configuration, a method of fabricating probe tips and use thereof
03/03/1999EP0702806B1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
03/03/1999CN1209468A Micro-etching agent for copper and copper alloy
03/02/1999US5876885 Profile simulation method, dependent on curvature of processed surface, and mask design method utilizing simulation
02/1999
02/24/1999EP0706678B1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
02/16/1999US5872053 Forming electrical connections between levels of a semiconductor device.
02/09/1999US5869400 Method for dry-etching using gaseous bismuth halide compound
02/09/1999US5869133 Method of producing articles by chemical vapor deposition and the support mandrels used therein
02/09/1999US5869130 Process for improving the adhesion of polymeric materials to metal surfaces
02/09/1999US5868855 Surface processing method and surface processing device for silicon substrates
02/04/1999DE19733064A1 Reclaiming chromic-containing systems
02/03/1999EP0789831B1 Decontamination process
02/03/1999CN1206751A Shower head
01/1999
01/27/1999EP0892840A1 A composition for cleaning and etching electronic display and substrate
01/27/1999EP0820359A4 Method and apparatus for circuit board treatment
01/26/1999US5863411 Photolithographic formation of accurate micropattern, then electrochemical etching non-masked areas completely through thickness of metal to form apertures
01/20/1999EP0892084A1 Method for preventing contamination by lead from metallic piping devices
01/19/1999US5861102 Method for the flattening treatment of silicon single crystal surface
01/14/1999DE19830293A1 Optical disk manufacturing stamp production
01/13/1999EP0890660A1 Microetching agent for copper or copper alloys
01/12/1999US5858878 Semiconductor wafer etching method and post-etching process
01/12/1999US5858257 Method for wet etching and device used therein
01/12/1999US5858255 Printed circuit plates
01/12/1999CA2034037C Redox-potential control
01/07/1999EP0889366A1 Method of providing microscopic features
01/05/1999US5855805 Microetching and cleaning of printed wiring boards
01/05/1999US5855802 Method and apparatus for forming a tubular article having a perforated annular wall
01/05/1999US5855725 Vacuum processing system and method of removing film deposited on inner face of vacuum vessel in the vacuum processing system
01/05/1999CA2058483C Process for the chemical vapor deposition of copper
12/1998
12/30/1998EP0887439A1 Process for improving the adhesion of polymeric materials to metal surfaces
12/30/1998EP0748396B1 Electrolysis process for regenerating a ferric chloride or sulphate solution, in particular for spray etching steel
12/29/1998US5853495 Process and device for surface treatment of strips with liquids
12/29/1998US5852975 Method for making lithographic plates using an ink-jet printer
12/22/1998US5851409 Method for removing an environmental coating
12/22/1998US5851303 Method for removing metal surface contaminants from silicon
12/16/1998EP0883582A1 Method of post-etching a mechanically treated substrate
12/15/1998CA2133134C Chemical etchant for palladium
12/09/1998EP0882944A1 Method of manufacturing a micromechanical sensing probe, in particular for an atomic force microscope
12/09/1998EP0882570A1 Thermoplastic resin-coated aluminum alloy plate and method and apparatus for manufacturing the same
12/09/1998EP0868543A4 Improved polishing slurries and methods for their use
12/08/1998US5846442 Controlled diffusion partial etching
12/02/1998CN1200412A Tech. for mfg. metallic photograph by photochemical etching
11/1998
11/26/1998WO1998053512A1 Method for manufacturing perforated steel sheets, cores for electrode plates of secondary cells, and secondary cell comprising the core
11/25/1998EP0880168A2 System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
11/25/1998EP0779941A4 Etchant for aluminium alloys
11/18/1998EP0878824A2 Method and apparatus for etching a workpiece
11/18/1998CN1199429A Improved polishing slurries and method for their use
11/17/1998US5837067 Fluid treatment of printed circuit including etching, washing, cleaning by an apparatus having a plurality of drive rod receiving passage, inserted drive rods, fluid injection passage; controlling, maintaining the fluid velocity
11/12/1998WO1998032893A3 Wafer support system
11/12/1998DE19719659A1 Process for controlling pickling baths for copper(alloys)
11/11/1998CN1198368A Surface treatment method, decorative article and electronics device
11/10/1998US5835315 Wafer including scribe line grooves for separating thin film heads and process for making the same
11/10/1998US5834129 Grained and anodized aluminum substrate for lithographic printing plates
11/10/1998US5832834 Aluminum support for lithographic printing plate
11/05/1998WO1998049720A1 Vacuum processing method and apparatus
11/05/1998DE19718769A1 Treatment of plate-like components
10/1998
10/29/1998WO1998048080A1 Method of taking off iron oxides and hydroxides from steel product surfaces
10/29/1998DE19717511A1 Method for specific wet chemical treatment of flat products in continuous installations