Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
05/1992
05/20/1992EP0485508A1 Liquid thermosetting composition
05/20/1992CN1016698B Single component, dripless and tenacious epoxy adhesive
05/19/1992CA1301396C High green strength induction curable adhesives
05/14/1992WO1992008760A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control
05/14/1992WO1992008073A1 Enclosing a substrate with a heat-recoverable article
05/14/1992CA2072090A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control
05/12/1992US5112911 Reaction Product of Maleinized Butylene-Ethylene-Styrene Block Polymer with an Epoxysilane
05/07/1992CA2094492A1 Enclosing a substrate with a heat-recoverable article
04/1992
04/29/1992EP0482483A2 Heat sealing of textiles
04/21/1992US5106945 Polyglycidamide-poly(meth)-acryloyl-polyamine compositions
04/15/1992EP0479943A1 Adhesives and method for making same
04/01/1992EP0477440A1 Self-locking agent
03/1992
03/25/1992EP0476323A2 Binder combinations and their use as a coating and a sealant
03/25/1992CN1059733A Method for preparation of toughened epoxy resin
03/24/1992US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins
03/24/1992CA1298012C Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
03/24/1992CA1298008C Epoxy adhesive film for electronic applications
03/11/1992EP0474619A2 Polyglycidamide-poly(meth)-acryloyl-polyamide compositions
03/05/1992CA2050563A1 Polyglycidamide-poly(meth)-acryloyl-polyamide compositions
03/03/1992US5093399 Process for preparing a free-flowing, modified polypropylene powder
02/1992
02/25/1992US5091469 Compatibilized epoxy/polyamide compositions containing polyolefins
02/20/1992WO1992002577A1 Adhesive compounds
02/11/1992US5087643 A stable mixture of multiacrylate monomer, free radical catalyst, an impact-improving polyurethane, a heat resistance improving epoxide and a latent epoxy hardener; joints; nuts and bolts
01/1992
01/29/1992CN1058226A Multifunctional colour adhesive
01/28/1992US5084532 Hot-melt adhesive of epoxy resins and amino groups-containing polyoxypropylene
01/28/1992US5084525 A diglycidyl ether of a bisphenol, a glycol- or urethane-modified diglycidyl ether of a bisphenol, a latent curing agent and a stress-relieving polyamide powder; heat curable adhesives
01/22/1992EP0448663A4 Tackified dual cure pressure-sensitive adhesive
01/21/1992US5082881 Alkylene imine modified carboxy polymer and polyvalent epoxy compound
01/14/1992US5081269 Oligomer epoxy resins based on cyclohexyldiphenol derivatives and reaction products thereof with (meth)acrylic acid and diisocyanates
01/14/1992US5080746 System for thermoplastic cross-linking adhesives, their preparation and a corresponding method of gluing
12/1991
12/31/1991US5077325 Adhesive for bonding ferrite magnet to motor
12/29/1991WO1992000364A1 Compatibilized epoxy/polyamide compositions containing polyolefins
12/29/1991CA2078880A1 Compatibilized epoxy/polyamide compositions containing polyolefins
12/24/1991US5075411 Curable epoxy resin composition for structural parts containing polyamine derived mannich base and novolac or bisphenol F epoxy resin
12/18/1991EP0462053A2 New epoxy resin compositions
12/17/1991CA1293340C Curable compositions
12/09/1991WO1991018957A1 Reworkable adhesive for electronic applications
12/09/1991CA2083514A1 Reworkable adhesive for electronic applications
12/04/1991EP0459614A2 Epoxy resin composition
12/04/1991EP0459608A2 Photo-curable composition
12/04/1991CN1056699A Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
12/01/1991CA2040628A1 Epoxy resin composition
12/01/1991CA2037077A1 Photo-curable composition
11/1991
11/28/1991WO1991018071A1 Dispersion-based heat-seal coating
11/27/1991EP0458740A1 Adhesion of foils of polyimides, adhesives and printed circuits
11/27/1991EP0458739A2 Curable resins leading to flame resistant and highly heat resistant polymers and process for their preparation
11/27/1991EP0458521A2 Heat curable adhesive
11/27/1991EP0458502A2 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
11/26/1991US5068261 Fluorine-containing epoxy (meth) acrylate resin with photoinitiator
11/24/1991CA2042153A1 Bonding of polymide films, and printed circuit boards
11/22/1991CA2042858A1 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
11/21/1991DE4015858A1 Heisssiegelbeschichtung auf dispersionsbasis Heat-seal coating on dispersion-based
11/19/1991US5066691 Adhesive composition for metal-clad laminates
11/18/1991CA2042659A1 Heat curable adhesive
10/1991
10/30/1991EP0454471A2 Adhesive composition
10/30/1991EP0454027A2 Adhesive for inner lining hose of water tube
10/24/1991WO1991016387A1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions
10/24/1991CA2082258A1 Energy curable cationically and free-radically polymerizable pressure sensitive compositions
10/17/1991WO1991015550A1 Heat-curing melt adhesives
10/17/1991DE4012061A1 Solvent-free, isotropic adhesive and conductive paste - comprises cycloaliphatic epoxide¨ resin and mixt. of two types of electrically conductive particles differing in size and shape
10/17/1991DE4011754A1 Thermisch nachhaertende schmelzklebstoffe Thermal post-curing hot melt adhesives
10/15/1991US5057551 Adhesives that continue to harden in darkness after photoinitiation
10/08/1991CA1290485C Crosslinking hot melt adhesive systems, their preparation and their use
10/02/1991EP0448663A1 Tackified dual cure pressure-sensitive adhesive
10/01/1991US5053280 Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
10/01/1991US5053077 Fire resistant paint or coating using frits
09/1991
09/26/1991DE4009095A1 Polyurethandichtungsmassen mit epoxidverbindungen Polyurethane sealants with epoxy
09/25/1991EP0447884A2 Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same
09/22/1991WO1991014739A1 Polyurethane sealing materials containing epoxide compounds
09/22/1991CA2078787A1 Polyurethane sealing materials containing epoxide compounds
09/11/1991EP0445192A1 Aqueous polyurethane and polyurethane carbamide dispersions, and a process for flock-coating moulded elastomeric products and for heat-sealing non-woven textile articles using these dispersions.
09/10/1991WO1991013925A1 Method for polymerization of epoxide compounds
09/05/1991DE4016296C1 Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives
08/1991
08/28/1991EP0442979A1 Reworkable epoxy die-attach adhesive
08/28/1991CN1054092A Electrically conductive cements and method for making and using same
08/27/1991US5043102 Conductive adhesive useful for bonding a semiconductor die to a conductive support base
08/21/1991EP0442700A2 Two-component curable hot-melt resin compositions
08/20/1991US5041470 Flame retardant photocurable adhesive for wires and circuit boards
08/14/1991EP0441545A1 Two-component curable hot-melt resin compositions
08/06/1991US5037700 Flexible laminates
08/06/1991CA1287427C Epoxy type spherical particulate adhesive and process for preparation thereof
07/1991
07/31/1991EP0438725A2 A tough and resilient two-component epoxy resin adhesive
07/23/1991US5034473 Polyepoxides modified with polyesters or polyamides as adhesives
07/23/1991CA1286821C Heat activatable adhesive for wire scribed circuits
07/23/1991CA1286818C Rapid curing, thermally stable adhesive
07/17/1991EP0437297A2 Curing compositions
07/17/1991EP0436745A1 A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
07/09/1991US5030816 Joining two metals
07/09/1991US5030698 Adhesives
07/03/1991EP0435536A2 Adhering an ink jet recording head using photopolymerisable adhesive
07/03/1991CN1052686A Double-component insulated tackiness agent
06/1991
06/26/1991EP0434013A2 Epoxy resin-impregnated glass cloth sheet having adhesive layer
06/18/1991US5025068 Reacting novolac and bisphenol F epoxy resins with carboxy-terminated butadiene-acrylonitrile
06/13/1991WO1991008575A1 Conductive adhesive useful for bonding a semiconductor die to a conductive support base
06/04/1991US5021513 Phenolic resin and aliphatic polyamine
05/1991
05/29/1991EP0429250A2 Tacky photopolymerizable adhesive compositions
05/29/1991CA2004130A1 High performance epoxy based laminating adhesive
05/28/1991US5019608 Amine-functional Acrylonitrile-Butadiene Rubber
05/23/1991DE3938376A1 Heat-cured powder adhesive for high-strength composites - has homogeneous mixt. of solid and liq. epoxy] resins, PVAC plastomer, hardener and/or fillers
05/22/1991EP0428165A1 Moisture resistant electrically conductive cements and method for making and using same
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