| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 05/20/1992 | EP0485508A1 Liquid thermosetting composition |
| 05/20/1992 | CN1016698B Single component, dripless and tenacious epoxy adhesive |
| 05/19/1992 | CA1301396C High green strength induction curable adhesives |
| 05/14/1992 | WO1992008760A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control |
| 05/14/1992 | WO1992008073A1 Enclosing a substrate with a heat-recoverable article |
| 05/14/1992 | CA2072090A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control |
| 05/12/1992 | US5112911 Reaction Product of Maleinized Butylene-Ethylene-Styrene Block Polymer with an Epoxysilane |
| 05/07/1992 | CA2094492A1 Enclosing a substrate with a heat-recoverable article |
| 04/29/1992 | EP0482483A2 Heat sealing of textiles |
| 04/21/1992 | US5106945 Polyglycidamide-poly(meth)-acryloyl-polyamine compositions |
| 04/15/1992 | EP0479943A1 Adhesives and method for making same |
| 04/01/1992 | EP0477440A1 Self-locking agent |
| 03/25/1992 | EP0476323A2 Binder combinations and their use as a coating and a sealant |
| 03/25/1992 | CN1059733A Method for preparation of toughened epoxy resin |
| 03/24/1992 | US5098766 Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins |
| 03/24/1992 | CA1298012C Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof |
| 03/24/1992 | CA1298008C Epoxy adhesive film for electronic applications |
| 03/11/1992 | EP0474619A2 Polyglycidamide-poly(meth)-acryloyl-polyamide compositions |
| 03/05/1992 | CA2050563A1 Polyglycidamide-poly(meth)-acryloyl-polyamide compositions |
| 03/03/1992 | US5093399 Process for preparing a free-flowing, modified polypropylene powder |
| 02/25/1992 | US5091469 Compatibilized epoxy/polyamide compositions containing polyolefins |
| 02/20/1992 | WO1992002577A1 Adhesive compounds |
| 02/11/1992 | US5087643 A stable mixture of multiacrylate monomer, free radical catalyst, an impact-improving polyurethane, a heat resistance improving epoxide and a latent epoxy hardener; joints; nuts and bolts |
| 01/29/1992 | CN1058226A Multifunctional colour adhesive |
| 01/28/1992 | US5084532 Hot-melt adhesive of epoxy resins and amino groups-containing polyoxypropylene |
| 01/28/1992 | US5084525 A diglycidyl ether of a bisphenol, a glycol- or urethane-modified diglycidyl ether of a bisphenol, a latent curing agent and a stress-relieving polyamide powder; heat curable adhesives |
| 01/22/1992 | EP0448663A4 Tackified dual cure pressure-sensitive adhesive |
| 01/21/1992 | US5082881 Alkylene imine modified carboxy polymer and polyvalent epoxy compound |
| 01/14/1992 | US5081269 Oligomer epoxy resins based on cyclohexyldiphenol derivatives and reaction products thereof with (meth)acrylic acid and diisocyanates |
| 01/14/1992 | US5080746 System for thermoplastic cross-linking adhesives, their preparation and a corresponding method of gluing |
| 12/31/1991 | US5077325 Adhesive for bonding ferrite magnet to motor |
| 12/29/1991 | WO1992000364A1 Compatibilized epoxy/polyamide compositions containing polyolefins |
| 12/29/1991 | CA2078880A1 Compatibilized epoxy/polyamide compositions containing polyolefins |
| 12/24/1991 | US5075411 Curable epoxy resin composition for structural parts containing polyamine derived mannich base and novolac or bisphenol F epoxy resin |
| 12/18/1991 | EP0462053A2 New epoxy resin compositions |
| 12/17/1991 | CA1293340C Curable compositions |
| 12/09/1991 | WO1991018957A1 Reworkable adhesive for electronic applications |
| 12/09/1991 | CA2083514A1 Reworkable adhesive for electronic applications |
| 12/04/1991 | EP0459614A2 Epoxy resin composition |
| 12/04/1991 | EP0459608A2 Photo-curable composition |
| 12/04/1991 | CN1056699A Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| 12/01/1991 | CA2040628A1 Epoxy resin composition |
| 12/01/1991 | CA2037077A1 Photo-curable composition |
| 11/28/1991 | WO1991018071A1 Dispersion-based heat-seal coating |
| 11/27/1991 | EP0458740A1 Adhesion of foils of polyimides, adhesives and printed circuits |
| 11/27/1991 | EP0458739A2 Curable resins leading to flame resistant and highly heat resistant polymers and process for their preparation |
| 11/27/1991 | EP0458521A2 Heat curable adhesive |
| 11/27/1991 | EP0458502A2 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| 11/26/1991 | US5068261 Fluorine-containing epoxy (meth) acrylate resin with photoinitiator |
| 11/24/1991 | CA2042153A1 Bonding of polymide films, and printed circuit boards |
| 11/22/1991 | CA2042858A1 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| 11/21/1991 | DE4015858A1 Heisssiegelbeschichtung auf dispersionsbasis Heat-seal coating on dispersion-based |
| 11/19/1991 | US5066691 Adhesive composition for metal-clad laminates |
| 11/18/1991 | CA2042659A1 Heat curable adhesive |
| 10/30/1991 | EP0454471A2 Adhesive composition |
| 10/30/1991 | EP0454027A2 Adhesive for inner lining hose of water tube |
| 10/24/1991 | WO1991016387A1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions |
| 10/24/1991 | CA2082258A1 Energy curable cationically and free-radically polymerizable pressure sensitive compositions |
| 10/17/1991 | WO1991015550A1 Heat-curing melt adhesives |
| 10/17/1991 | DE4012061A1 Solvent-free, isotropic adhesive and conductive paste - comprises cycloaliphatic epoxide¨ resin and mixt. of two types of electrically conductive particles differing in size and shape |
| 10/17/1991 | DE4011754A1 Thermisch nachhaertende schmelzklebstoffe Thermal post-curing hot melt adhesives |
| 10/15/1991 | US5057551 Adhesives that continue to harden in darkness after photoinitiation |
| 10/08/1991 | CA1290485C Crosslinking hot melt adhesive systems, their preparation and their use |
| 10/02/1991 | EP0448663A1 Tackified dual cure pressure-sensitive adhesive |
| 10/01/1991 | US5053280 Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent |
| 10/01/1991 | US5053077 Fire resistant paint or coating using frits |
| 09/26/1991 | DE4009095A1 Polyurethandichtungsmassen mit epoxidverbindungen Polyurethane sealants with epoxy |
| 09/25/1991 | EP0447884A2 Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same |
| 09/22/1991 | WO1991014739A1 Polyurethane sealing materials containing epoxide compounds |
| 09/22/1991 | CA2078787A1 Polyurethane sealing materials containing epoxide compounds |
| 09/11/1991 | EP0445192A1 Aqueous polyurethane and polyurethane carbamide dispersions, and a process for flock-coating moulded elastomeric products and for heat-sealing non-woven textile articles using these dispersions. |
| 09/10/1991 | WO1991013925A1 Method for polymerization of epoxide compounds |
| 09/05/1991 | DE4016296C1 Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives |
| 08/28/1991 | EP0442979A1 Reworkable epoxy die-attach adhesive |
| 08/28/1991 | CN1054092A Electrically conductive cements and method for making and using same |
| 08/27/1991 | US5043102 Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| 08/21/1991 | EP0442700A2 Two-component curable hot-melt resin compositions |
| 08/20/1991 | US5041470 Flame retardant photocurable adhesive for wires and circuit boards |
| 08/14/1991 | EP0441545A1 Two-component curable hot-melt resin compositions |
| 08/06/1991 | US5037700 Flexible laminates |
| 08/06/1991 | CA1287427C Epoxy type spherical particulate adhesive and process for preparation thereof |
| 07/31/1991 | EP0438725A2 A tough and resilient two-component epoxy resin adhesive |
| 07/23/1991 | US5034473 Polyepoxides modified with polyesters or polyamides as adhesives |
| 07/23/1991 | CA1286821C Heat activatable adhesive for wire scribed circuits |
| 07/23/1991 | CA1286818C Rapid curing, thermally stable adhesive |
| 07/17/1991 | EP0437297A2 Curing compositions |
| 07/17/1991 | EP0436745A1 A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism |
| 07/09/1991 | US5030816 Joining two metals |
| 07/09/1991 | US5030698 Adhesives |
| 07/03/1991 | EP0435536A2 Adhering an ink jet recording head using photopolymerisable adhesive |
| 07/03/1991 | CN1052686A Double-component insulated tackiness agent |
| 06/26/1991 | EP0434013A2 Epoxy resin-impregnated glass cloth sheet having adhesive layer |
| 06/18/1991 | US5025068 Reacting novolac and bisphenol F epoxy resins with carboxy-terminated butadiene-acrylonitrile |
| 06/13/1991 | WO1991008575A1 Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| 06/04/1991 | US5021513 Phenolic resin and aliphatic polyamine |
| 05/29/1991 | EP0429250A2 Tacky photopolymerizable adhesive compositions |
| 05/29/1991 | CA2004130A1 High performance epoxy based laminating adhesive |
| 05/28/1991 | US5019608 Amine-functional Acrylonitrile-Butadiene Rubber |
| 05/23/1991 | DE3938376A1 Heat-cured powder adhesive for high-strength composites - has homogeneous mixt. of solid and liq. epoxy] resins, PVAC plastomer, hardener and/or fillers |
| 05/22/1991 | EP0428165A1 Moisture resistant electrically conductive cements and method for making and using same |