Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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06/01/1994 | CN1087367A Structural adhesive composition having high temperature resistance |
06/01/1994 | CN1087366A Low viscosity and solvent-free one-component type epoxy resin adhesive composition |
05/25/1994 | CN1024672C Anticorrosion insulating binder made of boracic mud and hexanediamine dreg and preparing process thereof |
05/11/1994 | EP0596622A2 Epoxy resin structural adhesive composition having high temperature resistance |
05/11/1994 | EP0596503A1 Polyurethane resins, process for producing the same, and uses thereof |
05/10/1994 | US5310840 Energy-polymerizable adhesive, coating and film |
05/10/1994 | US5310789 Vinyl halide resin with epoxy resin and polyamine |
05/10/1994 | US5310439 Process for bonding a molded article of a thermoplastic saturated norbornene resin |
05/04/1994 | EP0594644A1 Anisotropic conductive adhesive film. |
04/26/1994 | CA1328804C Articles utilizing acetal copolymer bonding resins |
04/19/1994 | US5304418 Dicing-die bonding film |
04/14/1994 | WO1994007968A1 One-coat rubber-to-metal bonding adhesive |
04/13/1994 | EP0591307A1 Reactive hot-melt adhesive. |
04/13/1994 | EP0591174A1 Reworkable adhesive for electronic applications. |
04/12/1994 | CA1328525C Coating material for tendon for prestressed concrete |
04/06/1994 | EP0590975A1 Low viscosity and solvent-free one-component type epoxy resin adhesive composition |
03/31/1994 | WO1994006876A1 Aqueous voc-free epoxy primer compositions |
03/22/1994 | US5296557 Consisting of specified thermoplastic polyamide, epoxy resin |
03/22/1994 | US5296556 Three-component curable resin compositions |
03/10/1994 | DE4230116A1 Adhesive contg. aliphatic poly:ol and aromatic di:anhydride - is soluble in aq. alkali and used to assist machining e.g. of small lanthanide alloy permanent magnets from stacked plates |
03/09/1994 | EP0585360A1 Epoxide-based adhesive |
03/08/1994 | US5292812 Adhesive of epoxy resin, CTBN and maleimide |
03/08/1994 | CA1327658C Sealant and adhesive |
03/03/1994 | DE4228608A1 Electrically conductive adhesive - has plastic base and carrier contg. filing material comprising electrically conductive metal powder particles |
03/02/1994 | CN1083082A Curable suspensions of epoxy resins |
03/01/1994 | US5290857 Epoxy resin adhesive composition |
03/01/1994 | US5290624 Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof |
02/22/1994 | US5288360 Adhesive resin composition |
02/09/1994 | EP0582250A2 Crosslinked polymer microparticles based on epoxy resin, their preparation and their use |
02/07/1994 | CA2100708A1 Crosslinked polymer microparticles based on epoxy resin, their preparation and their use |
02/02/1994 | EP0581542A2 UV-curable epoxysilicones |
02/01/1994 | US5283266 Microcapsule type adhesive |
02/01/1994 | CA1326673C Imide compound and composition containing the same |
01/31/1994 | CA2101709A1 Uv-curable epoxysilicones bearing pendant silicone resin |
01/25/1994 | US5281481 Composite comprises metal or paper substrate, friction material, adhesive comprising bisphenol a epoxy resin, flow modifier comprising acrylic acid butyl ester |
01/19/1994 | CN1080941A Wear-resistant daub |
01/18/1994 | US5280067 Heat curable adhesive |
01/12/1994 | EP0578613A2 Curable epoxy resin suspensions |
01/10/1994 | CA2100026A1 Curable suspensions of epoxy resins |
01/06/1994 | WO1994000527A1 Epoxy adhesive composition |
01/06/1994 | WO1994000499A1 Randomly epoxidized small star polymers |
01/06/1994 | CA2138290A1 Randomly epoxidized small star polymers |
01/06/1994 | CA2134355A1 Epoxy adhesive composition |
01/05/1994 | CN1080294A Randomly epoxidized small star polymers |
01/04/1994 | US5276258 And tackifier resins, phenolic compounds containing thioether groups and epoxidized fatty acids or esters |
12/28/1993 | US5274054 Reacting a cycloaliphatic or heterocycloaliphatic polyamine and a polyepoxide |
12/14/1993 | CA2009747C Radio-opaque adhesive/sealant for void detection |
12/07/1993 | US5268432 Heat resistant modified bismaleimide adhesive composition |
12/07/1993 | US5268404 One-coat rubber-to-metal bonding adhesive |
12/01/1993 | EP0572176A1 Epoxy adhesives |
12/01/1993 | EP0571823A1 Corrosion resistant primer |
12/01/1993 | EP0571441A1 Method for improving adhesion to metal |
11/30/1993 | CA2079622A1 Epoxy adhesives |
11/29/1993 | CA2095563A1 Corrosion resistant primer |
11/18/1993 | EP0569487A1 Endothelin converting enzyme inhibitors |
11/18/1993 | EP0556290A4 Enclosing a substrate with a heat-recoverable article |
11/09/1993 | US5260130 Adhesive layer containing epoxy resin, nitrile rubber containing carboxy groups, curing agent and curing accelerator |
11/02/1993 | US5258427 Heat curable adhesive |
10/14/1993 | WO1993020163A1 Silicone release compositions |
10/14/1993 | WO1993020123A1 A high performance epoxy based laminating adhesive |
10/14/1993 | CA2133839A1 A high performance epoxy based laminating adhesive |
10/14/1993 | CA2128713A1 Silicone release compositions |
10/13/1993 | EP0565394A1 Two-phase heat-sealable interlining and method for its manufacture |
10/13/1993 | CN1077210A Organic adhesion agent |
10/12/1993 | US5252694 Curable epoxy-acrylate mixture, catalyst system, peroxide, and alcohol |
10/12/1993 | CA1323120C Epoxy adhesive |
10/06/1993 | EP0564050A2 Epoxidized diene elastomers for exterior block crosslinking |
10/06/1993 | CN1076932A Epoxidized diene elastomers for exterior block cosslinking |
10/04/1993 | CA2093181A1 Epoxidized diene elastomers for exterior block crosslinking |
09/30/1993 | DE4209555A1 Unsatd. ester(s) of epoxidised polysulphide oligomers or polymers - useful as adhesion promoters, esp. for adhesives and sealants based on liq. polysulphide(s) |
09/28/1993 | US5248559 Laminates with lubricants |
09/22/1993 | EP0561052A1 Heat resistant electrolaminates, preparation and use thereof |
09/22/1993 | EP0561048A2 Superior thermal transfer adhesive |
09/21/1993 | US5247026 Randomly epoxidized small star polymers |
09/07/1993 | US5242715 Cationically hardening solvent-free epoxy resins by heat or uv rad |
09/01/1993 | EP0557906A1 Heat-resistant adhesive composition |
09/01/1993 | EP0557657A1 Powder coating of thermosetting adhesives onto metal substrates to enable a friction material to be bonded to the metal substrate |
08/31/1993 | US5241016 As adhesion enhancer |
08/31/1993 | US5240645 Weldable sealant containing electrically conductive fibers |
08/29/1993 | CA2086147A1 Powder coating of thermosetting adhesives onto metal substrates to enable a friction material to be bonded to the metal substrate |
08/25/1993 | EP0556290A1 Enclosing a substrate with a heat-recoverable article. |
08/25/1993 | CN1075492A Two-component insulating adhesive |
08/05/1993 | WO1993015125A1 An energy-polymerizable adhesive, coating, film and process for making the same |
08/05/1993 | WO1993015124A1 Photoactivatable, thermally curable epoxy compositions |
08/05/1993 | CA2126751A1 An energy-polymerizable adhesive, coating, film and process for making the same |
08/05/1993 | CA2122467A1 Photoactivatable, thermally curable epoxy compositions |
08/03/1993 | US5232996 High bonding strength |
07/27/1993 | US5231130 Aqueous polyurethane dispersions |
07/13/1993 | CA1320298C Thermal adhesive type coating composition |
07/07/1993 | EP0550014A2 Dicing-die bonding film |
06/30/1993 | EP0548493A1 Aqueous epoxy resin composition |
06/30/1993 | EP0548369A1 Adhesive composition. |
06/23/1993 | CN1073460A Stbilizer mixture |
06/15/1993 | US5219979 Crosslinkers for paints, adhesives based on polyisocyanates, polyepoxides |
06/10/1993 | WO1993011200A1 Systems for cross-linkable hot-melt adhesives, their preparation method and an assembly method using same |
06/09/1993 | EP0545865A2 Stabilizing mixture |
06/08/1993 | US5218029 Free flowing modified polypropylene powder for prime compositions with film-forming resin solvent |
05/27/1993 | WO1993010202A1 Heat-seal coating using dispersions |
05/26/1993 | EP0543675A1 Adhesive containing microcapsules |
05/26/1993 | EP0502992A4 Conductive adhesive useful for bonding a semiconductor die to a conductive support base |