Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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05/25/1993 | US5214104 Compositions suitable as binders and their use in coating and sealing compositions |
05/25/1993 | US5213947 Optical recording medium |
05/19/1993 | EP0542160A1 Dispersion-based heat-seal coating |
05/19/1993 | EP0542114A1 Aqueous polyurethane dispersions |
05/19/1993 | CN1072196A Heat-conducting daub |
05/19/1993 | CN1020741C Moving loading structure adhesive and compounding method |
05/16/1993 | CA2082570A1 Aqueous polyurethane dispersions |
05/12/1993 | EP0541107A1 Ultraviolet light curable adhesive active finish for reinforcing members and related methods |
05/12/1993 | CN1020618C Method for preparation of toughened epoxy resin |
05/07/1993 | CA2082127A1 Ultraviolet light curable adhesive active finish for reinforcing members and related methods |
05/04/1993 | US5208110 Gelatin layer with transparent polymer sheet and bonding with adhesive |
04/20/1993 | US5204386 Acrylic-modified epoxy resin adhesive compositions with improved rheological control |
04/20/1993 | US5204378 Fluorine-containing epoxy(meth)acrylate resin adhesive cured in presence of photoinitiator |
04/14/1993 | EP0536239A1 Compatibilized epoxy/polyamide compositions containing polyolefins |
04/13/1993 | CA1316284C Epoxide and rubber based curable compositions having good adhesion direct to metal |
03/31/1993 | CN1070417A Electrically conductive cements and method for making and using same |
03/30/1993 | US5198065 Method for bonding steel to wood using an epoxy primer and adhesive |
03/24/1993 | CN1070211A Metal adhesive |
03/16/1993 | US5194930 Polyepoxide with anhydride hardener for semiconductors |
03/16/1993 | US5194502 Epoxy resin, urethane-modified epoxy resin and carboxylated polyester |
03/09/1993 | CA1314346C Latex adhesive for bonding polyether urethane foam |
03/03/1993 | EP0528874A1 Dispersion-based heat-seal coating. |
03/02/1993 | US5191039 Fluorine-containing epoxy(meth)acrylate resin |
03/02/1993 | US5190795 Method for improving adhesion to metal |
02/17/1993 | EP0527706A1 High performance epoxy adhesive composition with high flexibility and toughness |
02/17/1993 | EP0527548A1 Curable resin compositions and process for the preparation thereof |
02/13/1993 | CA2075656A1 High performance epoxy adhesive composition with high flexibility and toughness |
02/10/1993 | EP0526463A1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions. |
02/10/1993 | CA2065185A1 Curable resin compositions useful as hot-melt adhesives |
02/03/1993 | EP0263129B1 Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof |
02/02/1993 | US5183969 Epoxy resin which changes color on curing; opeining to visualize change |
02/02/1993 | US5183593 Electrically conductive cement |
02/02/1993 | US5183592 Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin |
01/28/1993 | DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin |
01/28/1993 | DE4224070A1 Adhesive for circuit board - comprises cured resin powder in uncured resin matrix, with both resin being heat resistant and insol. in acid or oxidant |
01/21/1993 | WO1993001248A1 Anisotropic conductive adhesive film |
01/21/1993 | CA2113090A1 Anisotropic conductive adhesive film |
01/20/1993 | CN1068135A Method for preparation of chip glue in use for surface installation technique |
01/19/1993 | US5180627 Heat resistant adhesive composition |
01/19/1993 | US5180625 Ceramic aluminum laminate and thermally conductive adhesive therefor |
01/19/1993 | US5180523 Polymer carriers, fillers, mixing and agglomeration to form powder particles |
01/13/1993 | EP0522736A2 Photopolymerisable liquid compositions |
01/11/1993 | WO1993001421A1 Adhesive composition |
01/07/1993 | WO1993000381A1 Reactive hot-melt adhesive |
01/07/1993 | EP0521044A1 Polyurethane sealing materials containing epoxide compounds. |
01/05/1993 | US5177159 Cured with epoxy resin, adhesive, coatings |
01/05/1993 | US5176780 Method of bonding polyimide films and printed circuit boards incorporating the same |
12/23/1992 | EP0519177A2 A thermosetting adhesive film and a process for applying the same |
12/23/1992 | EP0518908A1 Method for polymerization of epoxide compounds. |
12/16/1992 | EP0518067A2 Reactive hot-melt adhesive |
12/09/1992 | EP0517167A2 Flexible polyetheramines useful in epoxy compositions |
12/09/1992 | EP0516779A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control |
12/02/1992 | EP0516365A1 Adhesive resin composition |
12/02/1992 | EP0516203A2 Cross-linked epoxy functionalized polydiene block polymers, process to prepare them, adhesive compositions and starting block copolymer |
12/02/1992 | CN1066670A Fire retardant optic-solidified adhesive and its processing method |
11/24/1992 | US5166229 Polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative for adhesion strength, heat resistance and waterproofing |
11/18/1992 | CN1066275A Cross-linked epoxy functionalized polydiene block polymers, process to prepare them, adhesive composition and starting block copolymer |
11/17/1992 | WO1992020754A1 Epoxide-based adhesive |
11/17/1992 | CA2108260A1 Epoxide-based adhesive |
11/10/1992 | US5162439 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents |
11/10/1992 | US5162438 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents |
11/03/1992 | US5160783 Epoxy resin-impregnated glass cloth sheet having adhesive layer |
10/28/1992 | EP0511162A1 Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application |
10/25/1992 | CA2066867A1 Heat-conductive adhesive films, laminated with heat-conductive adhesive layers and the use thereof |
10/20/1992 | US5157079 One step crosslinking |
10/13/1992 | US5154791 Method for bonding or potting substrates |
10/07/1992 | EP0507735A2 Adducts from epoxy resins and amines |
09/29/1992 | US5151327 Adhesive sheet for reinforcing thin rigid plates |
09/23/1992 | EP0504569A2 Method of coating or sealing of electronic components or component groups |
09/16/1992 | EP0502992A1 Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
09/08/1992 | US5145920 Oxidation resistance, castings, moldings |
09/02/1992 | EP0501916A2 Creosote resistant epoxy adhesive system |
09/02/1992 | EP0501270A1 Electronic device using a uniaxial conductive adhesive composition |
09/02/1992 | CN1064094A Resin binder for refractory materials and preparing process thereof |
09/02/1992 | CN1064093A Anticorrostion insulating binder made of boracic mud and hexanediamine dregs and preparing process thereos |
08/26/1992 | CA2061631A1 Creosote resistant epoxy adhesive system |
08/19/1992 | EP0499188A1 Polyoxazolidines with carbonate groups, process for their preparation and use thereof |
08/18/1992 | US5139857 Cured product of hydrogenated epoxide, acrylated or blocked polyurethane and amine curling agent; optical lenses |
08/16/1992 | CA2061230A1 Adhesive system |
08/12/1992 | WO1992013510A1 Method for improving adhesion to metal |
08/12/1992 | CA2101938A1 Method for improving adhesion to metal |
08/11/1992 | US5137944 Workability, stability |
08/11/1992 | US5137936 Method for packaging electronic parts and adhesive for use in said method |
08/11/1992 | US5137762 Thermally set polyester coating; optional adhesive primer layer; non-cracking; corrosion resistance |
08/05/1992 | CN1017763B Self-adhesiveness electric stress control tape |
08/04/1992 | US5136365 Anisotropic conductive adhesive and encapsulant material |
08/01/1992 | WO1992013545A1 Endothelin converting enzyme inhibitors |
08/01/1992 | CA2100171A1 Endothelin converting enzyme inhibitors |
07/29/1992 | CN1063054A Fabrication of epoxy sealing head for fibrous membrane separator |
07/08/1992 | EP0493916A2 Production of compounds |
07/07/1992 | US5128424 Structural engineering adhesive |
07/07/1992 | US5128384 Process for preparing organic glasses |
07/07/1992 | CA1304865C Heat activatable adhesive for wire scribed circuits |
06/17/1992 | EP0490026A2 Improved aqueous emulsion dispersion adhesives based on a polyol and a hindered isocyanate compound |
06/11/1992 | DE4038989A1 Tension-free bonding of flat workpiece to substrate - with different coefft. of thermal expansion using cationically hardening resin compsn. which is irradiated then heated to moderate temp. |
06/09/1992 | US5120665 Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits |
06/03/1992 | EP0488949A2 High performance epoxy adhesive |
06/02/1992 | CA1302604C Rubber-modified epoxy adhesive compositions |
05/30/1992 | CA2056346A1 High performance epoxy adhesive |
05/26/1992 | US5117279 Semiconductor device having a low temperature uv-cured epoxy seal |