Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
05/1993
05/25/1993US5214104 Compositions suitable as binders and their use in coating and sealing compositions
05/25/1993US5213947 Optical recording medium
05/19/1993EP0542160A1 Dispersion-based heat-seal coating
05/19/1993EP0542114A1 Aqueous polyurethane dispersions
05/19/1993CN1072196A Heat-conducting daub
05/19/1993CN1020741C Moving loading structure adhesive and compounding method
05/16/1993CA2082570A1 Aqueous polyurethane dispersions
05/12/1993EP0541107A1 Ultraviolet light curable adhesive active finish for reinforcing members and related methods
05/12/1993CN1020618C Method for preparation of toughened epoxy resin
05/07/1993CA2082127A1 Ultraviolet light curable adhesive active finish for reinforcing members and related methods
05/04/1993US5208110 Gelatin layer with transparent polymer sheet and bonding with adhesive
04/1993
04/20/1993US5204386 Acrylic-modified epoxy resin adhesive compositions with improved rheological control
04/20/1993US5204378 Fluorine-containing epoxy(meth)acrylate resin adhesive cured in presence of photoinitiator
04/14/1993EP0536239A1 Compatibilized epoxy/polyamide compositions containing polyolefins
04/13/1993CA1316284C Epoxide and rubber based curable compositions having good adhesion direct to metal
03/1993
03/31/1993CN1070417A Electrically conductive cements and method for making and using same
03/30/1993US5198065 Method for bonding steel to wood using an epoxy primer and adhesive
03/24/1993CN1070211A Metal adhesive
03/16/1993US5194930 Polyepoxide with anhydride hardener for semiconductors
03/16/1993US5194502 Epoxy resin, urethane-modified epoxy resin and carboxylated polyester
03/09/1993CA1314346C Latex adhesive for bonding polyether urethane foam
03/03/1993EP0528874A1 Dispersion-based heat-seal coating.
03/02/1993US5191039 Fluorine-containing epoxy(meth)acrylate resin
03/02/1993US5190795 Method for improving adhesion to metal
02/1993
02/17/1993EP0527706A1 High performance epoxy adhesive composition with high flexibility and toughness
02/17/1993EP0527548A1 Curable resin compositions and process for the preparation thereof
02/13/1993CA2075656A1 High performance epoxy adhesive composition with high flexibility and toughness
02/10/1993EP0526463A1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions.
02/10/1993CA2065185A1 Curable resin compositions useful as hot-melt adhesives
02/03/1993EP0263129B1 Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
02/02/1993US5183969 Epoxy resin which changes color on curing; opeining to visualize change
02/02/1993US5183593 Electrically conductive cement
02/02/1993US5183592 Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
01/1993
01/28/1993DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin
01/28/1993DE4224070A1 Adhesive for circuit board - comprises cured resin powder in uncured resin matrix, with both resin being heat resistant and insol. in acid or oxidant
01/21/1993WO1993001248A1 Anisotropic conductive adhesive film
01/21/1993CA2113090A1 Anisotropic conductive adhesive film
01/20/1993CN1068135A Method for preparation of chip glue in use for surface installation technique
01/19/1993US5180627 Heat resistant adhesive composition
01/19/1993US5180625 Ceramic aluminum laminate and thermally conductive adhesive therefor
01/19/1993US5180523 Polymer carriers, fillers, mixing and agglomeration to form powder particles
01/13/1993EP0522736A2 Photopolymerisable liquid compositions
01/11/1993WO1993001421A1 Adhesive composition
01/07/1993WO1993000381A1 Reactive hot-melt adhesive
01/07/1993EP0521044A1 Polyurethane sealing materials containing epoxide compounds.
01/05/1993US5177159 Cured with epoxy resin, adhesive, coatings
01/05/1993US5176780 Method of bonding polyimide films and printed circuit boards incorporating the same
12/1992
12/23/1992EP0519177A2 A thermosetting adhesive film and a process for applying the same
12/23/1992EP0518908A1 Method for polymerization of epoxide compounds.
12/16/1992EP0518067A2 Reactive hot-melt adhesive
12/09/1992EP0517167A2 Flexible polyetheramines useful in epoxy compositions
12/09/1992EP0516779A1 Acrylic-modified epoxy resin adhesive compositions with improved rheological control
12/02/1992EP0516365A1 Adhesive resin composition
12/02/1992EP0516203A2 Cross-linked epoxy functionalized polydiene block polymers, process to prepare them, adhesive compositions and starting block copolymer
12/02/1992CN1066670A Fire retardant optic-solidified adhesive and its processing method
11/1992
11/24/1992US5166229 Polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative for adhesion strength, heat resistance and waterproofing
11/18/1992CN1066275A Cross-linked epoxy functionalized polydiene block polymers, process to prepare them, adhesive composition and starting block copolymer
11/17/1992WO1992020754A1 Epoxide-based adhesive
11/17/1992CA2108260A1 Epoxide-based adhesive
11/10/1992US5162439 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents
11/10/1992US5162438 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents
11/03/1992US5160783 Epoxy resin-impregnated glass cloth sheet having adhesive layer
10/1992
10/28/1992EP0511162A1 Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application
10/25/1992CA2066867A1 Heat-conductive adhesive films, laminated with heat-conductive adhesive layers and the use thereof
10/20/1992US5157079 One step crosslinking
10/13/1992US5154791 Method for bonding or potting substrates
10/07/1992EP0507735A2 Adducts from epoxy resins and amines
09/1992
09/29/1992US5151327 Adhesive sheet for reinforcing thin rigid plates
09/23/1992EP0504569A2 Method of coating or sealing of electronic components or component groups
09/16/1992EP0502992A1 Conductive adhesive useful for bonding a semiconductor die to a conductive support base
09/08/1992US5145920 Oxidation resistance, castings, moldings
09/02/1992EP0501916A2 Creosote resistant epoxy adhesive system
09/02/1992EP0501270A1 Electronic device using a uniaxial conductive adhesive composition
09/02/1992CN1064094A Resin binder for refractory materials and preparing process thereof
09/02/1992CN1064093A Anticorrostion insulating binder made of boracic mud and hexanediamine dregs and preparing process thereos
08/1992
08/26/1992CA2061631A1 Creosote resistant epoxy adhesive system
08/19/1992EP0499188A1 Polyoxazolidines with carbonate groups, process for their preparation and use thereof
08/18/1992US5139857 Cured product of hydrogenated epoxide, acrylated or blocked polyurethane and amine curling agent; optical lenses
08/16/1992CA2061230A1 Adhesive system
08/12/1992WO1992013510A1 Method for improving adhesion to metal
08/12/1992CA2101938A1 Method for improving adhesion to metal
08/11/1992US5137944 Workability, stability
08/11/1992US5137936 Method for packaging electronic parts and adhesive for use in said method
08/11/1992US5137762 Thermally set polyester coating; optional adhesive primer layer; non-cracking; corrosion resistance
08/05/1992CN1017763B Self-adhesiveness electric stress control tape
08/04/1992US5136365 Anisotropic conductive adhesive and encapsulant material
08/01/1992WO1992013545A1 Endothelin converting enzyme inhibitors
08/01/1992CA2100171A1 Endothelin converting enzyme inhibitors
07/1992
07/29/1992CN1063054A Fabrication of epoxy sealing head for fibrous membrane separator
07/08/1992EP0493916A2 Production of compounds
07/07/1992US5128424 Structural engineering adhesive
07/07/1992US5128384 Process for preparing organic glasses
07/07/1992CA1304865C Heat activatable adhesive for wire scribed circuits
06/1992
06/17/1992EP0490026A2 Improved aqueous emulsion dispersion adhesives based on a polyol and a hindered isocyanate compound
06/11/1992DE4038989A1 Tension-free bonding of flat workpiece to substrate - with different coefft. of thermal expansion using cationically hardening resin compsn. which is irradiated then heated to moderate temp.
06/09/1992US5120665 Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
06/03/1992EP0488949A2 High performance epoxy adhesive
06/02/1992CA1302604C Rubber-modified epoxy adhesive compositions
05/1992
05/30/1992CA2056346A1 High performance epoxy adhesive
05/26/1992US5117279 Semiconductor device having a low temperature uv-cured epoxy seal
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