| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 04/06/2011 | CN102002235A Method for reducing thermal expansion coefficient of polybenzoxazine-based underfill |
| 04/06/2011 | CN102002233A Mixture for preparing nylon nano composite material and preparation method of composite material |
| 04/06/2011 | CN102002226A Flame-resistant PC (Polycarbonate)/PBT (Polybutylene Terephathalate)/PET (Polyethylene Terephathalate) alloy and preparation method thereof |
| 04/06/2011 | CN102002211A Vinyl ester resin insulation power tower and manufacturing method thereof |
| 04/06/2011 | CN102002210A Halogen-free resin composite and glue sheet and substrate which are prepared from same |
| 04/06/2011 | CN102002209A Bottom filling glue for packaging inverted chip type semiconductor |
| 04/06/2011 | CN102002208A Epoxy resin composition and adhesive sheet and substrate made by same |
| 04/06/2011 | CN102002188A Method for preparing dynamic curing epoxy resin, inorganic filler and polyolefin composite |
| 04/06/2011 | CN102002144A Epoxy resin curing agent, its manufacture method and epoxy resin composition |
| 04/06/2011 | CN101270220B Method for preparing polyalcohol-base light overpressure resistant floating force material and equipment thereof |
| 04/06/2011 | CN101186744B Epoxy resin and use thereof |
| 04/06/2011 | CN101104736B Flame-proof enhancement PA66 composition |
| 04/05/2011 | US7919555 improve adhesion of the cured adhesive to oily metal substrates, improve peel strength at low temperatures; epoxy resins, polymers with shell-core, auxiliary impact modifier/toughening agent, methylguanidine curing agent; a block terpolymer of butadiene-methyl methacrylate-styrene |
| 04/05/2011 | US7919547 Nanofiller-containing epoxy resins and stable aqueous dispersions thereof |
| 04/05/2011 | CA2478590C Continuous filament mat binder system |
| 03/31/2011 | WO2011036836A1 Solvent-free and one-pack type cyanic ester/epoxy composite resin composition |
| 03/31/2011 | WO2010132519A3 A film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles |
| 03/31/2011 | WO2010123314A3 Novel epoxy resin and epoxy resin composition comprising the same |
| 03/31/2011 | US20110077328 Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions |
| 03/31/2011 | US20110076608 Carbon black, a process for preparation thereof and use thereof |
| 03/31/2011 | US20110073344 Gasket containing carbon nanotubes |
| 03/30/2011 | EP1954759B1 Curable compositions |
| 03/30/2011 | EP1607441B1 Epoxy resin composition |
| 03/30/2011 | CN101993581A Cleaning-free activated resinous composition and method for surface mounting using the same |
| 03/30/2011 | CN101993575A Composition for anisotropic conductive film |
| 03/30/2011 | CN101992520A Shaping method of object with column and object with column |
| 03/30/2011 | CN101333327B Composite modified polyphenylene oxide/epoxy material for printing circuit coller clad plate and method for preparing same |
| 03/30/2011 | CN101255265B Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same |
| 03/30/2011 | CN101208636B Toner and toner production process |
| 03/29/2011 | US7915344 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 03/29/2011 | CA2476090C Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| 03/24/2011 | US20110068480 Semiconductor device and adhesive sheet |
| 03/24/2011 | US20110067813 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 03/24/2011 | DE102009043988A1 Geopolymeres Material Geopolymeres material |
| 03/23/2011 | EP2297221A2 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 03/23/2011 | EP1923426B1 Resin composition and hybrid integrated circuit board making use of the same |
| 03/23/2011 | EP1590403B2 Thermosetting, themoexpansible composition with a high degree of expansion |
| 03/23/2011 | CN201769590U Structure of high wear resistant 3D transfer paper with optical texture |
| 03/23/2011 | CN101987910A Flame retardant grade engineering plastic taking recycled polyethylene terephthalate as matrix and application thereof |
| 03/23/2011 | CN101987908A Method for preparing graphene-epoxy resin composite material |
| 03/22/2011 | US7910667 Low temperature curable epoxy compositions containing phenolic-blocked urea curatives |
| 03/22/2011 | US7910666 Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 03/22/2011 | US7910665 Composition of epoxy resin and epoxy-reactive polyphosphonate |
| 03/22/2011 | US7910656 Epoxy resin, a second epoxy resin modified with an acrylonitrile-butadiene rubber, a toughener; assembly of parts of a vehicle |
| 03/22/2011 | US7910655 Polyarylene sulfide thermoplastic resin composition |
| 03/22/2011 | US7910638 Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device |
| 03/17/2011 | WO2011031834A1 Hydroxyphenyl phosphine oxide mixtures and their use as flame retardants for epoxy resins |
| 03/17/2011 | WO2011031421A1 Hydroxyphenyl phosphine oxide mixtures and their use as flame retardants for epoxy resins |
| 03/17/2011 | WO2011030580A1 Photosensitive composition and printed wiring board |
| 03/17/2011 | WO2011029733A1 Epoxy resin curing indicator composition |
| 03/17/2011 | WO2010132510A3 Composite of a polymer and surface modified hexagonal boron nitride particles |
| 03/17/2011 | US20110065838 Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins |
| 03/17/2011 | US20110065837 Low temperature curable epoxy compositions containing phenolic-blocked urea curatives |
| 03/17/2011 | US20110065836 Polycosanol-based associative monomers, corresponding associative thickening agents and their uses |
| 03/17/2011 | US20110061915 Novel resin composition and use thereof |
| 03/17/2011 | US20110061891 Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation |
| 03/17/2011 | CA2767940A1 Hydroxyphenyl phosphine oxide mixtures and their use as flame retardants for epoxy resins |
| 03/16/2011 | EP2295487A1 Epoxy resin curing indicator composition |
| 03/16/2011 | EP2294119A1 Toughened curable compositions |
| 03/16/2011 | CN101985515A Refrigerant-resistant sealing glue for high-voltage motor and preparation method thereof |
| 03/16/2011 | CN101985514A Thermosetting resin composition and preparation method and using method thereof |
| 03/16/2011 | CN101985513A POSS/epoxy nanometer hybrid material and preparation method and application thereof |
| 03/16/2011 | CN101985512A Physically expandable microsphere epoxy foaming material and preparation method thereof |
| 03/16/2011 | CN101591471B Resin composition for processing halogen-free copper foil base plate materials |
| 03/15/2011 | US7906568 Coupling agent composition and associated method |
| 03/15/2011 | US7906213 Epoxy resin curable composition for prepreg |
| 03/10/2011 | WO2011027658A1 Composition, cured product, electronic device, tri(2, 2-bis((allyloxy) methyl)-1-butoxy)aluminum, and preparation method therefor |
| 03/10/2011 | US20110060076 Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same |
| 03/10/2011 | US20110058948 Windmill propeller blade and method of making same |
| 03/10/2011 | US20110058776 Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device |
| 03/10/2011 | US20110057228 Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same |
| 03/09/2011 | EP2291426A1 Adducts of epoxy resins derived from alkanolamides and a process for preparing the same |
| 03/09/2011 | CN101983985A Halogen-free and stibium-free flame-retarding insulation epoxy powder encapsulating material and preparation method thereof |
| 03/09/2011 | CN101983981A Method for preparing dynamically cured epoxy resin/plant fiber/polypropylene composite material |
| 03/09/2011 | CN101537331B Preparation method of ammonium polyphosphate flame retardant microcapsule coated with epoxy resin |
| 03/09/2011 | CN101481491B Epoxy resin water dispersion and process for preparing the same |
| 03/08/2011 | US7902305 Composition of cationic initiator and oxetane compound |
| 03/08/2011 | US7901785 Resin composition for sealing light-emitting device and lamp |
| 03/08/2011 | US7901532 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 03/03/2011 | WO2011025649A1 Film-forming compositions, related processes and coated substrates |
| 03/03/2011 | WO2009124998A3 Hyperbranched polymers and oligomers comprising terminal amino groups as curing agents for epoxy resins |
| 03/03/2011 | US20110054125 Curable composition and use thereof |
| 03/03/2011 | US20110054080 Method for producing coated rubber particles and coated rubber particles |
| 03/03/2011 | US20110054079 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 03/03/2011 | US20110054078 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 03/03/2011 | US20110054077 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 03/03/2011 | US20110054076 Silicone containing encapsulant |
| 03/03/2011 | US20110054075 Dispersants From Linear Polyurethanes |
| 03/03/2011 | US20110054073 Curable composition and use thereof |
| 03/03/2011 | US20110053447 Halogen-free resin composition with high frequency dielectric property, and prepreg and laminate made therefrom |
| 03/03/2011 | US20110053036 Polyelectrolyte Membranes Made Of Poly(Perfluorocyclobutanes) With Pendant Perfluorosulfonic Acid Groups and Blends With Poly(Vinylidene Fluoride) |
| 03/03/2011 | US20110051588 Photo-curing type adhesive, optical pickup unit and manufacturing method thereof |
| 03/03/2011 | US20110049426 Moulding processes |
| 03/03/2011 | US20110049416 Method for producing heterogeneous composites |
| 03/03/2011 | US20110048637 High performance adhesive compositions |
| 03/03/2011 | DE102009029030A1 Verwendung von bei niedrigen Temperaturen schäumbaren Epoxidharzen in Hohlraumstrukturen Use of expandable at low temperatures epoxy resins in cavity structures |
| 03/02/2011 | EP2289998A1 White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device |
| 03/02/2011 | EP2289953A1 Multifunctional vinyl ether and resin composition containing same |
| 03/02/2011 | EP2198433B1 Polymer concrete electrical insulation system |
| 03/02/2011 | CN101982480A Solvent-containing high-temperature corrosion-resistant flame-resistant anti-fouling thermoplastic resin |