Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
08/2011
08/17/2011CN102151102A Imitating metal high-density composite-material bathroom pendant and production method thereof
08/17/2011CN101704991B Thermosetting epoxy resin composition
08/17/2011CN101649553B Method for preparing PBO fibre composite material and special surface treating agent thereof
08/17/2011CN101553909B Sealing material and mounting method using the sealing material
08/17/2011CN101407596B Method for recycling epoxy resins and glass fibre from non-metal powder of waste printed circuit board
08/17/2011CN101189275B Hardenable epoxy resin composition
08/16/2011US7999042 Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
08/16/2011US7999015 Curable aqueous composition
08/11/2011WO2011096295A1 Thermosetting composition
08/11/2011US20110196068 Resin composition for optical lens and optical packaging
08/11/2011US20110192639 Novel sulfonium borate complex
08/10/2011EP2354123A1 Novel sulfonium borate complex
08/10/2011EP2352793A1 Siloxane mixtures containing epoxide resins and method for the preparation thereof and use thereof
08/10/2011EP2352742A2 Phosphorus-containing silsesquioxane derivatives as flame retardants
08/10/2011CN102146197A Method for preparing nanomontmorillonite intercalated epoxy resin exfoliated composite material
08/10/2011CN102146196A Preparation method of high damping epoxy resin composite
08/10/2011CN102146195A Modified carbon fiber enhanced epoxy-resin-based composite rod
08/10/2011CN102146194A Conductive resin composition and chip-type electronic component
08/10/2011CN102145560A Photocatalyst composite material and preparation method thereof
08/10/2011CN101747593B Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof
08/10/2011CN101735566B Processable full sea-depth buoyancy material and manufacture method
08/10/2011CN101643570B Halogen-free flame resistance resin composite and prepreg, laminate and laminate for printed circuit prepared from same
08/10/2011CN101307170B Fire retardant phosphorus-containing epoxy powder composition
08/09/2011US7994263 Reaction product of epoxy resins, bisphenol, xylene-formaldehyde and amine in cationic electrodeposition paint
08/09/2011US7994238 Article and associated method
08/09/2011US7994235 Method of making models
08/09/2011US7993751 Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof
08/04/2011WO2011094004A2 Compositions having phosphorus-containing compounds
08/04/2011WO2011093799A1 A nano-composite
08/04/2011WO2011093695A1 A process for the preparation of dichlorohydrin
08/04/2011WO2011093474A1 Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
08/04/2011WO2011092947A1 One-pack epoxy resin composition, and use thereof
08/04/2011WO2011092328A1 Resin composition comprising isosorbide containing saturated polymer
08/04/2011WO2011091585A1 A multilayer structure, and a method for making the same
08/04/2011WO2011091584A1 A multilayer structure, and a method for making the same
08/04/2011US20110190421 Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device
08/04/2011US20110190420 Curable polymer mixtures
08/04/2011US20110190419 Blends comprising epoxy resins and mixtures of amines with guanidine derivatives
08/04/2011US20110190418 Cationic Polymerization Ink
08/04/2011US20110189488 Process for coating metallic surfaces with an aqueous composition, and this composition
08/04/2011US20110189440 Systems, Devices, and/or Methods for Manufacturing Castings
08/04/2011US20110189432 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
08/04/2011US20110189391 Decorative colored particle dispersion for use in surface coating compositions and method for making same
08/04/2011US20110185781 Aqueous Pigment Preparations Having Nonionic Additives on the Basis of Alyl and Vinyl Ether
08/04/2011DE102010014319A1 Dämpfungsmasse für Ultraschallsensor, Verwendung eines Epoxidharzes Damping mass for ultrasonic sensor using an epoxy resin
08/04/2011CA2788099A1 A multilayer structure, and a method for making the same
08/04/2011CA2788002A1 A multilayer structure, and a method for making the same
08/03/2011EP2350189A2 Phase separated curable compositions
08/03/2011EP2350177A1 Epoxide-based structural foam having improved tenacity
08/03/2011EP1142920B1 Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers
08/03/2011CN102142430A Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof
08/03/2011CN102140230A Preparation method of composite material consisting of carbon nanotube and functional carbon fiber-reinforced epoxy resin
08/03/2011CN102140115A Flame-retardant plasticizer of methyl silicate trichloroethyl ester compound and preparation method thereof
08/03/2011CN102140114A Methyl silicic acid tri(2,3-dichloropropyl) ester compound and preparation method thereof
08/03/2011CN102140113A Tri(chloroproply) methyl silicate compound and preparation method thereof
08/03/2011CN102140112A Halogenated organic silicate ester flame-retardant plasticizer compound and preparation method thereof
08/03/2011CN102140111A Methyl tri(2-chloropropyl)silane compound and preparation method thereof
08/03/2011CN101575420B Prepreg for repairing pipelines containing defects
08/03/2011CN101575419B Method for preparing repair prepreg for pipelines with defects
08/03/2011CN101305049B Flame retardant prepregs and laminates for printed circuit boards
08/02/2011US7989561 Composition of liquid, solid and semisolid epoxy resins
08/02/2011US7989557 Surface improver for reinforced composite compositions
08/02/2011US7989556 Modifier for polyester resin and process for producing molded article with the same
08/02/2011US7989523 Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom
07/2011
07/28/2011WO2011090668A2 Epoxy compositions and surfacing films therefrom
07/28/2011WO2011090322A2 Hybrid resin for coating the back surface of a pcm, method for preparing same, and hybrid-type paint composition for the back surface of a pcm
07/28/2011WO2011088950A1 Epoxy resin composition and surface mounting device coated with said composition
07/28/2011WO2011059883A3 One-pack type liquid epoxy resin composition and adhesion method using same
07/28/2011WO2011048022A3 Impact resistant two-component epoxy-based substance curing at room temperature
07/28/2011US20110184092 Epoxy resin composition
07/28/2011US20110184091 Epoxy resin composition, prepreg and fiber-reinforced composite material
07/28/2011CA2785777A1 Epoxy compositions and surfacing films therefrom
07/27/2011EP1447420B1 Curable resin composition
07/27/2011CN1970623B 液状环氧树脂组成物 A liquid epoxy resin composition
07/27/2011CN102137723A Method for gluing components in forming a temperature resistant adhesive layer
07/27/2011CN102134376A Halogen-free flame-retardant resin composition and preparation method of prepreg and laminated plate
07/27/2011CN102134375A Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same
07/27/2011CN102134374A Composition for color filter, cured product and color filter
07/27/2011CN102134373A High-performance carbon central mounting plate for robots and manufacturing method thereof
07/27/2011CN102134303A Resin composition, prepreging, laminating, and wiring board
07/27/2011CN101787110B Photoelastic plastic material and preparation method
07/27/2011CN101550279B Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic
07/27/2011CN101463183B Low fog value polyester composition and preparation thereof
07/27/2011CN101223235B Epoxy resin composition for encapsulation and electronic part device
07/27/2011CN101210111B Organic/inorganic composite material and fire-proof plate containing the same
07/27/2011CN101012330B Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
07/26/2011US7985808 Distortional matrix of epoxy resin and diamine
07/26/2011US7985477 Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming
07/21/2011WO2011087486A1 Oxazolidone ring contaning adducts
07/21/2011WO2011087477A1 Substantially solvent-free epoxy formulations
07/21/2011US20110178252 Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition
07/21/2011US20110178207 Particle-stabilised emulsions
07/21/2011US20110178196 Biodegradable polymer mixture
07/21/2011US20110177242 Fast curing oil-uptaking epoxy-based structural adhesives
07/21/2011US20110176313 Optical unit and light guide plate and ink thereof
07/21/2011US20110174828 Can coatings
07/20/2011EP2344570A1 Chemically gelled curable composition based on epoxy-amine resins and on ionic liquids
07/20/2011EP2344561A2 Crash durable epoxy adhesives with very low sensitivity to temperature variations
07/20/2011CN1957013B Resin composition for encapsulating semiconductor and semiconductor device
07/20/2011CN102131867A Magnetic sheet composition, magnetic sheet, and process for producing magnetic sheet
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