| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/09/2011 | CN101215407B High temperature self-restoring fibre enhancement epoxy composite material and preparation method thereof |
| 02/09/2011 | CN101173087B Crash resistant composite material and method for producing the same |
| 02/09/2011 | CN101151294B 环氧树脂组合物 The epoxy resin composition |
| 02/09/2011 | CN101045852B Sealing material tablet, method of manufacturing the tablet and electronic component device |
| 02/08/2011 | US7884172 epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane; forms cured object having high heat resistance, which is improved in impact resistance and moisture resistance |
| 02/08/2011 | US7883766 carbon fiber reinforced epoxy resin formulation: an epoxy resin component (A) formed by mixing and heating a bifunctional, trifunctional epoxy resin, a phenol compound and a polyamide; a trifunctional epoxy resin(B), a tetrafunctional epoxy resin (C) an aromatic amine compound(D); heat resistant |
| 02/08/2011 | CA2496480C Polyether polyamine agents and mixtures therefor |
| 02/03/2011 | WO2011013326A1 Liquid resin composition and semiconductor device formed using same |
| 02/03/2011 | WO2011012647A1 Epoxy resin-based compositions modified for impact resistance |
| 02/03/2011 | WO2011012627A2 Powder coating compositions capable of having a substantially non-zinc containing primer |
| 02/03/2011 | WO2011011920A1 Amine-phenolic dual cure hardener blend for resin compositions |
| 02/03/2011 | US20110028605 Filled resins and method for making filled resins |
| 02/03/2011 | US20110028604 Flame-retardant, curable moulding materials |
| 02/03/2011 | US20110028603 Hyperbranched polymers and oligomers comprising terminal amino groups as curing agents for epoxy resins |
| 02/03/2011 | US20110028602 Epoxy-imidazole catalysts useful for powder coating applications |
| 02/03/2011 | US20110027592 Aqueous binder or sizing composition |
| 02/03/2011 | US20110027574 Coating for elastomeric substrates |
| 02/03/2011 | US20110024168 Biomass-derived epoxy resin composition |
| 02/03/2011 | US20110024039 One-part epoxy-based structural adhesive |
| 02/03/2011 | US20110023611 Self-healing composite material |
| 02/03/2011 | DE102009028100A1 Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis Toughened epoxy resin composition |
| 02/03/2011 | CA2769176A1 Liquid resin composition and semiconductor device using the same |
| 02/03/2011 | CA2767375A1 Powder coating compositions capable of having a substantially non-zinc containing primer |
| 02/02/2011 | EP2280044A1 Epoxy resin composition for encapsulating electronic part |
| 02/02/2011 | EP2279347A2 Windmill propeller blade and method of making same |
| 02/02/2011 | CN101962466A Intrinsic flame-retardant epoxy resin composition for semiconductor package |
| 02/02/2011 | CN101962465A Heat conductive electrical-insulation polymer material and heat-dissipating substrate including same |
| 02/02/2011 | CN101962448A Compound fire retardant containing hydroxymethylated melamine silicide, preparation method and application thereof |
| 02/02/2011 | CN101962436A High-temperature-resistant modified polyfunctional epoxy matrix resin for advanced composite material and preparation thereof |
| 02/02/2011 | CN101481492B UV curing photosensitive resin for rapid moulding injection mold |
| 02/02/2011 | CN101381513B Nylon nano compound material for sugar machine, preparation method and application thereof |
| 02/02/2011 | CN101098905B Latent curing agent |
| 02/01/2011 | US7879956 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 02/01/2011 | US7879405 Resin composition for sealing light emitting device |
| 01/27/2011 | WO2011011167A2 Curable composition, method of coating a phototool, and coated phototool |
| 01/27/2011 | WO2011010948A1 Nanocomposite material containing polymer binders |
| 01/27/2011 | WO2011010672A1 Resin compositions, resin sheet, prepreg, metal-clad laminate, printed wiring board, and semiconductor device |
| 01/27/2011 | WO2011010549A1 Aluminum chelate-based latent curing agents and process for preparation thereof |
| 01/27/2011 | WO2011010457A1 Photocurable resin composition |
| 01/27/2011 | US20110021722 Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator |
| 01/27/2011 | US20110021666 Amorphous silica powder, process for its production, and sealing material for semiconductors |
| 01/27/2011 | US20110021665 Resin composition for semiconductor encapsulation and semiconductor device |
| 01/27/2011 | US20110020557 Polymerization of a Reactive Diluent in the Presence of an Epoxy-Amine Material, and Coating Compositions Prepared thereby |
| 01/27/2011 | US20110020555 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same |
| 01/27/2011 | US20110017340 Syntactic Foam Compositions, Pipelines Insulated with Same, and Method |
| 01/27/2011 | DE102009027825A1 Katalyse von Epoxidharzformulierungen mit schwerlöslichen Katalysatoren Catalysis of epoxy resin formulations with sparingly soluble catalysts |
| 01/27/2011 | DE102009026252A1 Applying non-slip, direction-indicating floor or wall coverings, e.g. in domestic, industrial or public areas, involves applying perforated sheet, applying epoxy resin, lifting off the sheet and curing the resin |
| 01/26/2011 | EP2276808A1 Improved moulding processes |
| 01/26/2011 | EP2276787A1 Coating composition |
| 01/26/2011 | EP1948735B1 Flame retardant prepregs and laminates for printed circuit boards |
| 01/26/2011 | EP1867672B1 Epoxy resin composition |
| 01/26/2011 | CN1882656B Weather-resistant compositions based on polyalkylene terephthalate/polycarbonate blends with modified impact resistance and moulded-in colour |
| 01/26/2011 | CN1661475B Photocuring resinoid compositio and printed circuit board using same |
| 01/26/2011 | CN101959957A Resin composition for manufacturing marble chips, method for manufacturing marble chips using the same, and artificial marble made from marble chips |
| 01/26/2011 | CN101959923A Curable composition and color filter |
| 01/26/2011 | CN101959922A Curable epoxy composition, anisotropic conductive material and connection structure |
| 01/26/2011 | CN101955678A 阻燃型热固性树脂组合物及覆铜板 Flame retardant thermosetting resin composition and CCL |
| 01/26/2011 | CN101955675A Modified epoxy resin thermosetting epoxy asphalt bulking agent and preparation method thereof |
| 01/26/2011 | CN101955674A Thermosetting epoxy bitumen material and preparation method thereof |
| 01/26/2011 | CN101955673A Thermosetting epoxy asphalt material and preparation method thereof |
| 01/26/2011 | CN101955666A Preparation method of glass fiber enhanced thermosetting resin matrix composite material |
| 01/26/2011 | CN101955631A Preparation method of polyaniline modified multi-wall carbon canotube/epoxy resin composite material |
| 01/26/2011 | CN101955630A Delay cured resin composition |
| 01/26/2011 | CN101955629A Epoxy resin composition capable of being used as semiconductor encapsulating material |
| 01/26/2011 | CN101604727B 电致伸缩复合材料及其制备方法 Electrostrictive composite material and its preparation method |
| 01/26/2011 | CN101323698B Flame retardant composition copper clad laminate and preparation thereof |
| 01/25/2011 | US7875344 improved adhesiveness and handleability in a wide temperature range around room temperature; acrylonitrile-butadiene rubber |
| 01/20/2011 | WO2011008480A1 Polymer compositions and methods of making and using same |
| 01/20/2011 | WO2011007575A1 Resin composition, and optical fiber and electric wire each comprising same |
| 01/20/2011 | WO2010138662A3 Engineered cross-linked thermoplastic particles interlaminar toughening |
| 01/20/2011 | US20110015347 Alicyclic epoxy resin composition, cured product thereof, production method thereof, and rubbery polymer-containing resin composition |
| 01/20/2011 | CA2766307A1 Polymer compositions and methods of making and using same |
| 01/19/2011 | EP2275489A1 Alicyclic epoxy resin composition, cured product thereof, production method thereof, and rubbery polymer-containing resin composition |
| 01/19/2011 | EP2275488A1 Mass for injection moulding based on thermosetting resins for moulded parts possessing a highly stable coefficient of static friction |
| 01/19/2011 | CN101953026A Opic electroconductive film |
| 01/19/2011 | CN101952365A Curable resin composition and cured resin |
| 01/19/2011 | CN101952364A Microencapsulated silane coupling agent |
| 01/19/2011 | CN101948672A High-defoaming epoxy resin packaging material and preparation method thereof |
| 01/19/2011 | CN101948611A Winding epoxy resin composition, preparation method thereof and use thereof |
| 01/19/2011 | CN101948610A Low-viscosity bi-component epoxy resin potting adhesive and preparation method thereof |
| 01/19/2011 | CN101948609A Black rubber and preparation method thereof |
| 01/19/2011 | CN101555341B High-strength fiber glass reinforced ABS composite material and preparation method thereof |
| 01/19/2011 | CN101323703B Poly(amino bimaleimide) resin composition, preparation and use thereof in copper clad laminate |
| 01/19/2011 | CN101173085B Crash resistant composite material and method for producing the same |
| 01/18/2011 | US7872079 Naphthoxazine composition |
| 01/18/2011 | US7871694 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board |
| 01/18/2011 | CA2531794C Epoxy-capped polythioethers |
| 01/13/2011 | WO2011005925A1 Core/shell rubbers for use in electrical laminate compositions |
| 01/13/2011 | WO2011005420A1 Hardener composition for epoxy resins |
| 01/13/2011 | WO2011004706A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 01/13/2011 | WO2010114279A3 Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
| 01/13/2011 | US20110009528 Epoxy resin composition, prepreg, and fiber reinforced composite material |
| 01/13/2011 | US20110009527 Thermosetting compositions comprising silicone polyethers, their manufacture, and uses |
| 01/13/2011 | US20110009524 Flame Retardant Thermoplastic Resin Composition with Improved Compatibility |
| 01/13/2011 | US20110009521 Liquid crystalline epoxy nanicomposite material and application thereof |
| 01/13/2011 | US20110007490 Resin composition and cured film thereof |
| 01/13/2011 | US20110007489 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device |
| 01/12/2011 | EP2271706A1 Epoxy resin based composition and method for the curing thereof |
| 01/12/2011 | CN101945952A Resin composition and cured film thereof |
| 01/12/2011 | CN101945946A Flame-retardant resin composition and coated electrical wire |