Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2011
09/27/2011US8026307 Two component curable compositions
09/27/2011US8026300 Aqueous resin dispersion, process of making thereof, and product thereof
09/27/2011CA2466611C Heat-curable resin composition
09/22/2011WO2011114687A1 Resin composition for sealing semiconductors, and semiconductor device using same
09/22/2011US20110230597 Glass fibers having improved durability
09/22/2011US20110230596 Glass fibers having improved strength
09/22/2011US20110230595 Process for the production of impact-modified polyalkylene terephthalate/polycarbonate compositions
09/22/2011US20110227678 Magnetic-dielectric assemblies and methods of fabrication
09/21/2011EP2366742A1 Thermosetting resin composition and prepreg utilizing same
09/21/2011EP2366739A1 Conductive resin composition and chip-type electronic component
09/21/2011EP2366738A1 Adhesive compositions
09/21/2011EP2366737A1 Method for producing composition of polymerizable organic compound containing silica particles
09/21/2011CN201978855U 一种玻璃纤维布涂布的可调式预浸装置 A glass fiber cloth coated prepreg adjustable means
09/21/2011CN102197088A Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device
09/21/2011CN102197071A Epoxide-based structural foam comprising thermoplastic polyurethanes
09/21/2011CN102197070A Epoxide-based structural foam having improved tenacity
09/21/2011CN102197066A Chemically gelled curable composition based on epoxy-amine resins and on ionic liquids
09/21/2011CN102191000A Adhesive composition
09/21/2011CN102190977A Dicing die-bonding film
09/21/2011CN102190900A Thermal conductive sheet
09/21/2011CN102190898A Preparation method of paving asphalt modified at normal temperature
09/21/2011CN102190885A Resin composition for electronic component encapsulation and electronic component device
09/21/2011CN102190865A Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof
09/21/2011CN102190864A Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof
09/21/2011CN102190863A Epoxy resin composition
09/21/2011CN102190862A Thermal conductivity sheet, light emitting diode installing substrate and thermal conductivity adhesive sheet
09/21/2011CN102190861A Sealant for liquid crystal dripping process
09/21/2011CN102190860A Impregnation composition for functional stone manufacture and functional stone using that
09/21/2011CN102190859A Preparation method of epoxy resin zirconium tungstate composite material
09/21/2011CN102190858A Epoxy resin material toughened by nanometer silica and preparation method thereof
09/21/2011CN102190857A Solvent-free double-component epoxy moisture-proof film
09/21/2011CN102190825A Preparation methods for antibacterial plastic master batches and product
09/21/2011CN102190778A Epoxy resin latent curing agent with coupling property
09/21/2011CN102190776A Thermosetting resin composition for optical-semiconductor element encapsulation and cured material thereof, and optical-semiconductor device obtained using the same
09/21/2011CN101805490B Organic silicon modified epoxy-composite estolide nanometer composite heavy anticorrosive material and preparation
09/21/2011CN101787145B Method for recovering fiber from epoxy resin/fiber composite material
09/21/2011CN101597419B Preparation method for spatial structure ordered inflaming retarding heat-conducting type resin-matrix composite material
09/21/2011CN101580627B Halogen-free phosphorus-containing fire retardant epoxy base material for printed circuit copper clad laminate and preparation method thereof
09/21/2011CN101466786B Epoxy resin, epoxy resin composition having the same, paint composition and method of forming a coating layer using the same
09/21/2011CN101111565B Bonded composite of silicone resin and epoxy resin and a method for manufacturing thereof
09/20/2011US8022151 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
09/20/2011US8022140 Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent
09/20/2011US8022119 Epoxy and silane group-containing oligomers and polymers and a method for the production and the use thereof
09/20/2011US8021752 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment
09/20/2011CA2407291C Binder mixture and its use
09/15/2011WO2011112452A1 Storage stable water based epoxy-amine curable systems
09/15/2011WO2011111803A1 Resin composition and multilayer structure using same
09/15/2011WO2011111727A1 Insulating polymer material composition
09/15/2011WO2011111667A1 Curable composition, hardened material, and method for using curable composition
09/15/2011WO2011111471A1 Composition for film, and adhesive film and cover lay film formed therefrom
09/15/2011WO2011109956A1 Thermosetting epoxy asphalt material with wide temperature region and high performance and preparation method thereof
09/15/2011WO2011059500A3 Curable compositions
09/15/2011US20110224386 Reactive polyarylene ether and method for the manufacture thereof
09/15/2011US20110224384 Biaxially oriented polyphenylene sulfide film
09/15/2011US20110224378 Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
09/15/2011US20110224345 Novel low dielectric resin varnish composition for laminates and the preparation thereof
09/15/2011US20110224333 Resin composition for electronic component encapsulation and electronic component device
09/15/2011US20110224332 Thermosetting resin composition and use thereof
09/15/2011US20110224331 Halogen-free flame retardants for epoxy resin systems
09/15/2011US20110224330 Fibers coated with nanowires for reinforcing composites
09/15/2011US20110223383 Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body
09/15/2011US20110220401 Latent hardener with improved barrier properties and compatibility
09/15/2011CA2790837A1 Storage stable water based epoxy-amine curable systems
09/14/2011EP2365491A1 Electricity insulating materials with field strength-dependent throughput resistance
09/14/2011EP2365046A1 Toughened two component structural adhesive being curable at room temperature
09/14/2011EP2365015A1 Storage stable water based epoxy-amine curable systems
09/14/2011EP2365011A1 Amino group terminated toughener and its use in epoxy resin based compositions
09/14/2011EP1276799B1 Flame retardant epoxy molding compositions
09/14/2011CN1942521B Light-diffusing resin composition
09/14/2011CN102181168A Polymer matrix composite material and production method of polymer matrix composite material
09/14/2011CN102181143A High-frequency thermosetting resin composition, prepreg and laminated sheet
09/14/2011CN102181130A Commodity raw material prepared from solidago and preparation method thereof
09/14/2011CN102181129A Epoxy resin composition for semiconductor encapsulation
09/14/2011CN102181128A Epoxy resin premix and preparation technology of the epoxy resin premix
09/14/2011CN102181127A Preparation method of glass fiber reinforced epoxy resin composite material modified by reclaimed circuit board powder
09/14/2011CN102181091A Adhesive and modified EVA (ethylene vinyl acetute) foaming composite for automobiles
09/14/2011CN102181071A Method for reclaiming carbon fiber reinforced epoxy resin composite material
09/14/2011CN102179981A Wear-resisting high-molecular composite material
09/14/2011CN101724224B Composite material of NiMnGa magnetic memorial alloy and epoxide resin and preparation method thereof
09/14/2011CN101696303B Novel compatibilized polypropylene/glass fiber composite material and preparation method thereof
09/14/2011CN101407597B Halogen-free flame-retardant photo-curing epoxy resin composition
09/14/2011CN101218286B Prepreg
09/13/2011US8017689 Composition of epoxy resin, core-shell particles and curing agent
09/13/2011US8017671 Thermosetting resin for expediting a thermosetting process
09/13/2011US8017670 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
09/09/2011WO2011108524A1 Resin composition, prepreg, and laminated sheet
09/09/2011WO2011107450A2 Two-component structural adhesive which is impact resistant at room temperature
09/09/2011WO2011107449A1 Amino group terminated impact strength modifier and use thereof in epoxy resin compositions
09/08/2011US20110218273 Metal stabilizers for epoxy resins and advancement process
09/08/2011US20110218272 Thermosetting resin composition and prepreg using the same
09/08/2011US20110218271 Creping adhesive modifier and process for producing paper products
09/08/2011US20110218270 Use of linear triethylentetramine as curing agent for epoxy resins
09/08/2011US20110218267 Sealant for one-drop fill process
09/08/2011US20110215503 Reducing Adhesion between a Conformable Region and a Mold
09/08/2011DE102010009896A1 Wässrige Polyurethandispersionen Aqueous polyurethane dispersions
09/07/2011CN1890325B Thermosetting resin composition, material for substrate and film for substrate
09/07/2011CN102177187A Epoxy resins and composite materials with improved burn properties
09/07/2011CN102176345A Hybrid fiber pultruded composite material, and preparation method and molding device thereof
09/07/2011CN102175014A Method for manufacturing safe lamp socket
09/07/2011CN102174267A Asphalt cold recycling agent and preparation method thereof
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